Epitaxial Growth of Metallic Layers by Solid Phase Interdiffusion : Study of the Ni/GaAs and Ni/AlAs Systems

1989 ◽  
Vol 160 ◽  
Author(s):  
Roland Guerin ◽  
S. Deputier ◽  
J. Caulet ◽  
M. Minier ◽  
A. Poudoulec ◽  
...  

AbstractAn ideal metal/III-V semiconductor contact should be made by stable and epitaxial metallic films. In principle, such a contact may be obtained by the solid state ΐnterdiffusion of a metal film with a III-V SC substrate. We studied the solid state interdiffusions in the Ni/GaAs and Ni/AlAs systems. Our starting point was the experimental determination of the Ni-Ga-As and Ni-Al-As ternary phase diagrams. The main steps of the interaction appear to be different in the two systems. During the Ni/GaAs one, three successive steps as a function of the annealing temperature are observed : first a mixture of a Ga-rich ternary phase (C phase) + NiAs, then C phase + NiAs + NiGa and at last the two binaries NiAs + NiGa where the reaction stops. In the case of the Ni/AlAs reactions, the three steps successively correspond to a mixture of NiAl + an As-rich ternary phase then NiAl + another As-rich ternary phase + NiAs and finally NiAl + NiAs. NiAs and NiAl are the key compounds in Ni/GaAs and Ni/AlAs reactions respectively and all the reaction compounds are either textured (pseudocubic NiAs and ternaries) or epitaxial (cubic binaries NiGa and NiAl).

2000 ◽  
Vol 77 (6) ◽  
pp. 701 ◽  
Author(s):  
Kerry K. Karukstis ◽  
Sara K. Avrantinis ◽  
Stephanie L. Boegeman ◽  
Jeanie N. Conner ◽  
Blaine M. Hackman ◽  
...  

2009 ◽  
Vol 54 (1) ◽  
pp. 16-21 ◽  
Author(s):  
Rosana Emi Tamagawa ◽  
Everson Alves Miranda ◽  
Cesar Costapinto Santana ◽  
Marco Giulietti

2001 ◽  
Vol 16 (8) ◽  
pp. 2314-2320 ◽  
Author(s):  
Yoshihiro Terada ◽  
Kenji Ohkubo ◽  
Tetsuo Mohri ◽  
Tomoo Suzuki

A method for the determination of site preference of substitutional elements in intermetallic compounds is proposed. It is demonstrated in Ni3Al–X alloys that the ridge direction in thermal conductivity contours in the ternary γ′ phase agrees with that of the solubility lobe of the γ′ phase in ternary phase diagrams. The ridge direction is a reliable indication of site preference of substitutional elements in intermetallic compounds. The present method is conveniently applied to a normal polycrystalline specimen with small size, and therefore, a versatile class of brittle compounds can be studied.


1995 ◽  
Vol 67 (5) ◽  
pp. 993-998 ◽  
Author(s):  
James A. Cox ◽  
Kathryn S. Alber ◽  
Carrie A. Brockway ◽  
Mark E. Tess ◽  
Waldemar. Gorski

2002 ◽  
Vol 17 (2) ◽  
pp. 291-301 ◽  
Author(s):  
T. Y. Lee ◽  
W. J. Choi ◽  
K. N. Tu ◽  
J. W. Jang ◽  
S. M. Kuo ◽  
...  

Intermetallic compound (IMC) growth during solid-state aging at 125, 150, and 170 °C up to 1500 h for four solder alloys (eutectic SnPb, Sn–3.5Ag, Sn–3.8Ag–0.7Cu, and Sn–0.7Cu) on Cu under bump metallization was investigated. The samples were reflowed before aging. During the reflow, the solders were in the molten state and the formation of the IMC Cu6Sn5 in the cases of eutectic SnPb and Sn–3.5Ag had a round scallop-type morphology, but in Sn–0.7Cu and Sn–3.8Ag–0.7Cu the scallops of Cu6Sn5 were faceted. In solid-state aging, all these scallops changed to a layered-type morphology. In addition to the layered Cu6Sn5, the IMC Cu3Sn also grew as a layer and was as thick as the Cu6Sn5. The activation energy of intermetallic growth in solid-state aging is 0.94 eV for eutectic SnPb and about 1.05 eV for the Pb-free solders. The rate of intermetallic growth in solid-state aging is about 4 orders of magnitude slower than that during reflow. Ternary phase diagrams of Sn–Pb–Cu and Sn–Ag–Cu are used to discuss the reactions. These diagrams predict the first phase of IMC formation in the wetting reaction and the other phases formed in solid-state aging. Yet, the morphological change and the large difference in growth rates between the wetting reaction and solid-state aging cannot be predicted.


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