Ftir and Xps Studies of Polyimide/Metal Interface Formation

1989 ◽  
Vol 153 ◽  
Author(s):  
William C. Stewart ◽  
Jihperng Leu ◽  
Klavs F. Jensen
Keyword(s):  
Photoelectron Spectroscopy ◽  
Polymer Structure ◽  
Ring Closure ◽  
Metal Interface ◽  
Polyimide Films ◽  
Polyamic Acid ◽  
Xps Spectra ◽  
X Ray ◽  
Spectroscopy Studies ◽  
Thermal Stability Of

AbstractWe describe infrared and x-ray photoelectron spectroscopy studies of the interfaces formed when the PMDA/ODA polyamic acid is imidized on gold, chromium, and copper. Polyimide films ranging from 34 ° to 1328 ° are analyzed as part of these studies. The IR and XPS results indicate that the gold interacts very little with the polyimide, while copper produces significant changes in the IR and XPS spectra. At elevated cure temperatures passivated chromium also reacts with the polyimide. In structures with chromium and copper, the thermal stability of the polyimide at the interface is reduced from that of bulk polyimide. The data demonstrate that the metals interact with the polymer structure at the point where ring closure occurs to form the polyimide from polyamic acid.

FTIR and XPS Studies of Polyimide/Metal Interface Formation

1989 ◽  
Vol 154 ◽  
Author(s):  
William C. Stewart ◽  
Jihperng Leu ◽  
Klavs F. Jensen
Keyword(s):  
Photoelectron Spectroscopy ◽  
Polymer Structure ◽  
Ring Closure ◽  
Metal Interface ◽  
Polyimide Films ◽  
Interface Formation ◽  
Xps Spectra ◽  
X Ray ◽  
Spectroscopy Studies ◽  
Thermal Stability Of

AbstractWe describe infrared and x-ray photoelectron spectroscopy studies of the interfaces formed when the PMDA/ODA polyamic acid is imidized on gold, chromium, and copper. Polyimide films ranging from 34 Å to 1328 Å are analyzed as part of these studies. The IR and XPS results indicate that the gold interacts very little with the polyimide, while copper produces significant changes in the IR and XPS spectra. At elevated cure temperatures passivated chromium also reacts with the polyimide. In structures with chromium and copper, the thermal stability of the polyimide at the interface is reduced from that of bulk polyimide. The data demonstrate that the metals interact with the polymer structure at the point where ring closure occurs to form the polyimide from polyarnic acid.

scholarly journals Optical, XPS and XRD Studies of Semiconducting Copper Sulfide Layers on a Polyamide Film

2009 ◽  
Vol 2009 ◽  
pp. 1-8 ◽  
Author(s):  
Valentina Krylova ◽  
Mindaugas Andrulevičius
Keyword(s):  
Photoelectron Spectroscopy ◽  
Copper Sulfide ◽  
Diffusion Method ◽  
X Ray Diffraction ◽  
Xps Spectra ◽  
X Ray ◽  
Xrd Studies ◽  
Polyamide Film ◽  
Indirect Band Gap ◽  
Xrd Method

Copper sulfide layers were formed on polyamide PA 6 surface using the sorption-diffusion method. Polymer samples were immersed for 4 and 5 h in 0.15 mol⋅  solutions and acidified with HCl (0.1 mol⋅) at . After washing and drying, the samples were treated with Cu(I) salt solution. The samples were studied by UV/VIS, X-ray diffraction (XRD) and X-ray photoelectron spectroscopy (XPS) methods. All methods confirmed that on the surface of the polyamide film a layer of copper sulfide was formed. The copper sulfide layers are indirect band-gap semiconductors. The values of are 1.25 and 1.3 eV for 4 h and 5 h sulfured PA 6 respectively. Copper XPS spectra analyses showed Cu(I) bonds only in deeper layers of the formed film, while in sulfur XPS S 2p spectra dominating sulfide bonds were found after cleaning the surface with ions. It has been established by the XRD method that, beside , the layer contains as well. For PA 6 initially sulfured 4 h, grain size forchalcocite, , was  nm and fordjurleite, , it was 54.17 nm. The sheet resistance of the obtained layer varies from 6300 to 102 .

scholarly journals Improvement of the thermal stability of dendritic silver-coated copper microparticles by surface modification based on molecular self-assembly

2021 ◽  
Vol 8 (1) ◽  
Author(s):  
Tae Hyeong Kim ◽  
Hyeji Kim ◽  
Hyo Jun Jang ◽  
Nara Lee ◽  
Kwang Hyun Nam ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Photoelectron Spectroscopy ◽  
Self Assembly ◽  
Electrically Conductive ◽  
X Ray ◽  
Alkyl Chains ◽  
Conductive Film ◽  
Initial Resistance ◽  
Thermal Stability Of ◽  
Scanning Electron

AbstractIn the study reported herein, silver-coated copper (Ag/Cu) powder was modified with alkanethiols featuring alkyl chains of different lengths, namely butyl, octyl, and dodecyl, to improve its thermal stability. The modification of the Ag/Cu powders with adsorbed alkanethiols was confirmed by scanning electron microscopy with energy dispersive spectroscopy, X-ray photoelectron spectroscopy, and thermogravimetric analysis. Each powder was combined with an epoxy resin to prepare an electrically conductive film. The results confirmed that the thermal stability of the films containing alkanethiol-modified Ag/Cu powders is superior to that of the film containing untreated Ag/Cu powder. The longer the alkyl group in the alkanethiol-modified Ag/Cu powder, the higher the initial resistance of the corresponding electrically conductive film and the lower the increase in resistance induced by heat treatment.

Incorporation and Role of Nitrogen During Oxynitridation of Silicon Studied by Photoelectron Spectroscopy

1999 ◽  
Vol 567 ◽  
Author(s):  
Masayuki Suzuki ◽  
Yoji Saito
Keyword(s):  
Photoelectron Spectroscopy ◽  
High Vacuum ◽  
Oxide Films ◽  
Silicon Surfaces ◽  
Gaseous Mixtures ◽  
X Ray ◽  
Initial Stage ◽  
Thermal Stability Of

ABSTRACTWe tried direct oxynitridation of silicon surfaces by remote-plasma-exited nitrogen and oxygen gaseous mixtures at 700°C in a high vacuum. The oxynitrided surfaces were investigated with in-situ X-ray photoelectron spectroscopy. With increase of the oxynitridation time, the surface density of nitrogen gradually increases, but that of oxygen shows nearly saturation behavior after the rapid increase in the initial stage. We also annealed the grown oxynitride and oxide films to investigate the role of the contained nitrogen. The desorption rate of oxygen from the oxynitride films is much less than that from oxide films. We confirmed that nitrogen stabilizes the thermal stability of these oxynitride films.

29Si NMR and XPS Investigation of the Structure of Silicon Oxycarbide Glasses Derived from Polysiloxane Precursors

1994 ◽  
Vol 346 ◽  
Author(s):  
R.J.P. Corriu ◽  
D. Leclercq ◽  
P.H. Mutin ◽  
A. Vioux
Keyword(s):  
Solid State ◽  
Photoelectron Spectroscopy ◽  
Solid State Nmr ◽  
Random Distribution ◽  
Silicon Oxycarbide ◽  
29Si Nmr ◽  
Xps Spectra ◽  
Excess Carbon ◽  
X Ray ◽  
Silicon Oxycarbide Glasses

ABSTRACTTwo silicon oxycarbide glasses with different compositions (O/Si ratio 1.2 and 1.8) were prepared by pyrolysis at moderate temperature (900 °C) of polysiloxane precursors. Their structure was investigated using quantitative 29Si solid-state NMR and X-ray photoelectron spectroscopy (XPS). The environment of the silicon atoms in the oxycarbide phase corresponded to a purely random distribution of Si-O and Si-C bonds depending on the O/Si ratio of the glass only and not on the structure of the precursors. At the light of the NMR results, the Si2p XPS spectra of the glasses may be interpreted using the contribution of the five possible SiOxC4-x tetrahedra. The Cls spectra of these glasses indicated the presence of oxycarbide carbon in CSi4 tetrahedra, similar to carbide carbon, and graphitic-like excess carbon.

Preparation and Characterization of Ni2+-Montmorillonite/Polyvinyl Alcohol Water-Soluble Nanocomposite Film

2005 ◽  
Vol 13 (8) ◽  
pp. 839-846 ◽  
Author(s):  
Li-Ping Wang ◽  
Yun-Pu Wang ◽  
Fa-Ai Zhang
Keyword(s):  
Polyvinyl Alcohol ◽  
Photoelectron Spectroscopy ◽  
Thermal Characteristics ◽  
Water Soluble ◽  
Scanning Calorimetry ◽  
Xps Spectra ◽  
X Ray ◽  
Alcohol Water ◽  
Ft Ir ◽  
Silicate Layers

A new type of nano-composite film was prepared from polyvinyl alcohol, Ni2+-montmorillonite (Ni2+-MMT), defoamer, a levelling agent and a plasticizer. Its thermal characteristics were studied by Differential Scanning Calorimetry (DSC). The intermolecular interactions were measured by Fourier transform infrared spectroscopy (FT-IR) and X-ray photoelectron spectroscopy (XPS), and the tensile strength (TS) and elongation at break (%E) were measured. The microstructures were studied by X-ray diffraction (XRD) and atomic force microscopy (AFM). FT-IR and XPS spectra indicated that cross-linking has taken place between PVA and Ni2+-MMT. XRD and AFM indicate that the PVA molecules had inserted themselves into the silicate layers of MMT, exfoliating them and dispersing them randomly into the PVA matrix. Compared to pure PVA film, the TS of the films was increased and %E decreased when the Ni2+-Montmorillonite was added and the dissolution temperature of the film was also reduced.

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