Ultraviolet Laser Ablation of a Silicon Wafer
Keyword(s):
Si Wafer
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Pulsed laser irradiation at 248 nm can ablate Si atoms from an Si wafer. The mechanism of this photoablation has been examined by laser-induced fluorescence analysis of the Si products. The Si atoms are measured to leave the wafer surface with averaged translational energy of 2.5 kcal/mol. The distribution of translational energy is well described by the theoretical model for non-cascade ablation processes.
1983 ◽
Vol 44
(C5)
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pp. C5-449-C5-454
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Keyword(s):
1983 ◽
Vol 44
(C5)
◽
pp. C5-23-C5-36
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Keyword(s):
Keyword(s):
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