Ultraviolet Laser Ablation of a Silicon Wafer

1988 ◽  
Vol 129 ◽  
Author(s):  
Masahiro Kawasaki ◽  
Hiroyasu Sato ◽  
Gen Inoue

Pulsed laser irradiation at 248 nm can ablate Si atoms from an Si wafer. The mechanism of this photoablation has been examined by laser-induced fluorescence analysis of the Si products. The Si atoms are measured to leave the wafer surface with averaged translational energy of 2.5 kcal/mol. The distribution of translational energy is well described by the theoretical model for non-cascade ablation processes.

1992 ◽  
Vol 275 ◽  
Author(s):  
Akiharu Morimoto ◽  
Shigeru Mizukami ◽  
Tatsuo Shimizu ◽  
Toshiharu Mlnamikawa ◽  
Yasuto Yonezawa ◽  
...  

ABSTRACTBa2YCu3Ox superconducting films were prepared by Nd:YAG laser ablation, equipped with a second (ArF excimer) laser for irradiation onto the growing film surface. The irradiation onto the film during the deposition were delayed for various delay times against the ablation of Ba2YCu3Ox target. The experiment showed that the second laser irradiation within several tens us around the ablation event induces a change of the crystal orientation. This result suggests that the crystal growth for the laser ablation is determined mainly around this time scale.


1993 ◽  
Vol 3 (12) ◽  
pp. 2173-2188
Author(s):  
N. G. Chechenin ◽  
A. V. Chernysh ◽  
V. V. Korneev ◽  
E. V. Monakhov ◽  
B. V. Seleznev

1983 ◽  
Vol 44 (C5) ◽  
pp. C5-449-C5-454 ◽  
Author(s):  
P. Baeri ◽  
M. G. Grimaldi ◽  
E. Rimini ◽  
G. Celotti

1983 ◽  
Vol 44 (C5) ◽  
pp. C5-23-C5-36 ◽  
Author(s):  
H. Kurz ◽  
L. A. Lompré ◽  
J. M. Liu

Author(s):  
Nguyen Phi Long ◽  
Hiroyuki Daido ◽  
Yukihiro Matsunaga ◽  
Tomonori Yamada ◽  
Akihiro Nishimura ◽  
...  

Author(s):  
Katia del Carmen Martínez Guzmán ◽  
Sadasivan Shaji ◽  
Tushar Kanti Das Roy ◽  
Bindu Krishnan ◽  
David Avellaneda Avellaneda ◽  
...  

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