Activation and Interdiffusion Characteristics in Implanted GaAs-AlGaAs Heterostructures on Si

1988 ◽  
Vol 126 ◽  
Author(s):  
S. J. Pearton ◽  
K. T. Short ◽  
K. S. Jones ◽  
S. M. Vernon
Keyword(s):  
Activation Energy ◽  
Thermal Activation ◽  
Secondary Ion Mass Spectrometry ◽  
Thermal Activation Energy ◽  
Activation Kinetics ◽  
Lattice Disorder ◽  
Si Substrates ◽  
Transmission Electron ◽  
And Diffusion ◽  
Secondary Ion

ABSTRACTThe activation kinetics and diffusion behaviour of implanted Be and Si in two different types of MOCVD-grown GaAs-AlGaAs heterostructures on Si substrates were examined by electrochemical C-V profiling, secondary ion mass spectrometry and sheet resistivity measurements. The implanted Be displays a thermal activation energy of 0.70 eV and Si a thermal activation energy of 0.53 eV in heteroepitaxial material, similar to the comparable cases in homoepitaxial GaAs. In addition, there is no evidence for enhanced diffusivity of either species, at least for implants located away from the heterointerface. The remnant lattice disorder in the heterostructures caused by implantation and annealing is negligible compared to the as-grown disorder, as revealed by transmission electron microscopy.

Effects of Concurrent Co or Ti Silicidation on Transient Diffusion and End-of-Range Damage in Phosphorus Implanted Silicon

1992 ◽  
Vol 262 ◽  
Author(s):  
J.W. Honeycutt ◽  
J. Ravi ◽  
G. A. Rozgonyi
Keyword(s):  
Secondary Ion Mass Spectrometry ◽  
Complete Removal ◽  
Dislocation Loops ◽  
Enhanced Diffusion ◽  
Depth Profiles ◽  
Enhanced Dissolution ◽  
Implantation Damage ◽  
Transmission Electron ◽  
Defect Behavior ◽  
Secondary Ion

ABSTRACTThe effects of Ti and Co silicidation on P+ ion implantation damage in Si have been investigated. After silicidation of unannealed 40 keV, 2×1015 cm-2 P+ implanted junctions by rapid thermal annealing at 900°C for 10–300 seconds, secondary ion mass spectrometry depth profiles of phosphorus in suicided and non-silicided junctions were compared. While non-silicided and TiSi2 suicided junctions exhibited equal amounts of transient enhanced diffusion behavior, the junction depths under COSi2 were significantly shallower. End-of-range interstitial dislocation loops in the same suicided and non-silicided junctions were studied by planview transmission electron microscopy. The loops were found to be stable after 900°C, 5 minute annealing in non-silicided material, and their formation was only slightly effected by TiSi2 or COSi2 silicidation. However, enhanced dissolution of the loops was observed under both TiSi2 and COSi2, with essentially complete removal of the defects under COSi2 after 5 minutes at 900°C. The observed diffusion and defect behavior strongly suggest that implantation damage induced excess interstitial concentrations are significantly reduced by the formation and presence of COSi2, and to a lesser extent by TiSi2. The observed time-dependent defect removal under the suicide films suggests that vacancy injection and/or interstitial absorption by the suicide film continues long after the suicide chemical reaction is complete.

About the Electrical Activation of 1×1020 cm-3 Ion Implanted Al in 4H-SiC at Annealing Temperatures in the Range 1500 - 1950°C

2018 ◽  
Vol 924 ◽  
pp. 333-338 ◽  
Author(s):  
Roberta Nipoti ◽  
Alberto Carnera ◽  
Giovanni Alfieri ◽  
Lukas Kranz
Keyword(s):  
Activation Energy ◽  
Sheet Resistance ◽  
Annealing Time ◽  
Thermal Activation ◽  
Room Temperature ◽  
Annealing Temperature ◽  
Thermal Activation Energy ◽  
Electrical Activation ◽  
Temperature Range ◽  
Annealing Temperatures

The electrical activation of 1×1020cm-3implanted Al in 4H-SiC has been studied in the temperature range 1500 - 1950 °C by the analysis of the sheet resistance of the Al implanted layers, as measured at room temperature. The minimum annealing time for reaching stationary electrical at fixed annealing temperature has been found. The samples with stationary electrical activation have been used to estimate the thermal activation energy for the electrical activation of the implanted Al.

Temperature/Doping-Dependency of the Electrical Properties of the Nickel Doped Copper Oxide Thin Films

2021 ◽  
Vol 16 (2) ◽  
pp. 163-169
Author(s):  
Alaa Y. Mahmoud ◽  
Wafa A. Alghameeti ◽  
Fatmah S. Bahabri
Keyword(s):  
Thin Films ◽  
Activation Energy ◽  
Electrical Properties ◽  
Thermal Activation ◽  
Doping Concentration ◽  
Energy Gap ◽  
Cupric Oxide ◽  
Electrical Energy ◽  
Thermal Activation Energy ◽  
Ni Doping

The electrical properties of the Nickel doped cupric oxide Ni-CuO thin films with various doping concentrations of Ni (0, 20, 30, 70, and 80%) are investigated at two different annealing temperatures; 200 and 400 °C. The electrical properties of the films; namely thermal activation energy and electrical energy gap are calculated and compared. We find that for the non-annealed Ni-CuO films, both thermal activation energy and electrical energy gap are decreased by increasing the doping concentration, while for the annealed films, the increase in the Ni doping results in the increase in thermal activation energy and electrical energy gap for most of the Ni-CuO films. We also observe that for a particular concentration, the annealing at 200 °C produces lower thermal activation energy and electrical energy gap than the annealing at 400 °C. We obtained two values of the activation energy varying from -5.52 to -0.51 eV and from 0.49 to 3.36 eV, respectively, for the annealing at 200 and 400 °C. We also obtained two values of the electrical bandgap varying from -11.05 to -1.03 eV and from 0.97 to 6.71 eV, respectively, for the annealing at 200 and 400 °C. It is also noticeable that the increase in the doping concentration reduces the activation energy, and hence the electrical bandgap energies.

Transportation of Na and Li in Hydrothermally Grown ZnO

2009 ◽  
Vol 1201 ◽  
Author(s):  
Pekka Tapio Neuvonen ◽  
Lasse Vines ◽  
Klaus Magnus Johansen ◽  
Anders Hallén ◽  
Bengt Gunnar Svensson ◽  
...  
Keyword(s):  
Mass Spectrometry ◽  
Activation Energy ◽  
Formation Energy ◽  
Secondary Ion Mass Spectrometry ◽  
Diffusion Constant ◽  
Zinc Vacancy ◽  
Diffusion Source ◽  
Secondary Ion ◽  
Zinc Site ◽  
Limited Diffusion

AbstractSecondary ion mass spectrometry has been applied to study the transportation of Na and Li in hydrothermally grown ZnO. A dose of 1015 cm-2 of Na+ was implanted into ZnO to act as a diffusion source. A clear trap limited diffusion is observed at temperatures above 550 °C. From these profiles, an activation energy for the transport of Na of ∼1.7 eV has been extracted. The prefactor for the diffusion constant and the solid solubility of Na cannot be deduced independently from the present data but their product estimated to be ∼3 × 1016 cm-1s-1. A dissociation energy of ∼2.4 eV is extracted for the trapped Na. The measured Na and Li profiles show that Li and Na compete for the same traps and interact in a way that Li is depleted from Na-rich regions. This is attributed to a lower formation energy of Na-on-zinc-site than that for Li-on-zinc-site defects and the zinc vacancy is considered as a major trap for migrating Na and Li atoms. Consequently, the diffusivity of Li is difficult to extract accurately from the present data, but in its interstitial configuration Li is indeed highly mobile having a diffusivity in excess of 10-11 cm2s-1 at 500 °C.

scholarly journals Изменение структуры и свойств приповерхностного слоя Si, имплантированного Zn, в зависимости от флюенса облучения ионами -=SUP=-132-=/SUP=-Xe-=SUP=-26+-=/SUP=- с энергией 167 МэВ

2019 ◽  
Vol 53 (3) ◽  
pp. 332
Author(s):  
В.В. Привезенцев ◽  
В.С. Куликаускас ◽  
В.А. Скуратов ◽  
О.С. Зилова ◽  
А.А. Бурмистров ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Zinc Oxide ◽  
Cross Section ◽  
Secondary Ion Mass Spectrometry ◽  
Sample Surface ◽  
Transmission Electron ◽  
Oxide Phases ◽  
Secondary Ion ◽  
Surface Pores ◽  
Scanning Electron

AbstractSingle-crystal n -Si(100) wafers are implanted with ^64Zn^+ ions with an energy of 50 keV and dose of 5 × 10^16 cm^–2. Then the samples are irradiated with ^132Xe^26+ ions with an energy of 167 MeV in the range of fluences from 1 × 10^12 to 5 × 10^14 cm^–2. The surface and cross section of the samples are visualized by scanning electron microscopy and transmission electron microscopy. The distribution of implanted Zn atoms is studied by time-of-flight secondary-ion mass spectrometry. After irradiation with Xe, surface pores and clusters consisting of a Zn–ZnO mixture are observed at the sample surface. In the amorphized subsurface Si layer, zinc and zinc-oxide phases are detected. After irradiation with Xe with a fluence of 5 × 10^14 cm^–2, no zinc or zinc-oxide clusters are detected in the samples by the methods used in the study.

Sign in / Sign up

Export Citation Format

Share Document