Photoluminescence Characterization of Thin Silicon-On-Insulator Films Produced by Oxygen Implantation

1987 ◽  
Vol 107 ◽  
Author(s):  
J. Weber ◽  
H. Baumgart ◽  
J. Petruzzello ◽  
G.K. Celler
Keyword(s):  
Low Temperature ◽  
Single Crystal Silicon ◽  
Silicon On Insulator ◽  
Crystal Silicon ◽  
Czochralski Silicon ◽  
Transmission Electron ◽  
Processing Step ◽  
Low Temperature Photoluminescence

AbstractSingle crystal silicon films on top of a buried SiO2 layer were produced by implanting 1.7x10180+ions/cm2 at 150keV into (100) Czochralski silicon, followed by annealing at higher temperatures. The defect properties of the layers are studied after each processing step by low temperature photoluminescence measurements and transmission electron micrography (TEM). Dislocation-related photoluminescence signals correlate with their TEM observations in the same samples. The photoluminescence method proves to be a very versatile and convenient method for characterizing the quality of silicon-on-insulat or structures.

TEM characterization of Au/Polysilicon interactions

1990 ◽  
Vol 48 (4) ◽  
pp. 650-651
Author(s):  
N. David Theodore ◽  
Leslie H. Allen ◽  
C. Barry Carter ◽  
James W. Mayer
Keyword(s):  
Solid Phase ◽  
Single Crystal Silicon ◽  
Chemical Vapor ◽  
Electrical Contacts ◽  
Silicon Substrates ◽  
Crystal Silicon ◽  
Transmission Electron ◽  
Polysilicon Films ◽  
The Stability

Metal/polysilicon investigations contribute to an understanding of issues relevant to the stability of electrical contacts in semiconductor devices. These investigations also contribute to an understanding of Si lateral solid-phase epitactic growth. Metals such as Au, Al and Ag form eutectics with Si. reactions in these metal/polysilicon systems lead to the formation of large-grain silicon. Of these systems, the Al/polysilicon system has been most extensively studied. In this study, the behavior upon thermal annealing of Au/polysilicon bilayers is investigated using cross-section transmission electron microscopy (XTEM). The unique feature of this system is that silicon grain-growth occurs at particularly low temperatures ∽300°C).Gold/polysilicon bilayers were fabricated on thermally oxidized single-crystal silicon substrates. Lowpressure chemical vapor deposition (LPCVD) at 620°C was used to obtain 100 to 400 nm polysilicon films. The surface of the polysilicon was cleaned with a buffered hydrofluoric acid solution. Gold was then thermally evaporated onto the samples.

Structural Characterization of MBE Grown (001) CdTe Films by Means of Transmission Electron Microscopy, Low Temperature Photoluminescence and Double Crystal Rocking Curves.

1986 ◽  
Vol 77 ◽  
Author(s):  
M. G. Burke ◽  
W. J. Choyke ◽  
N. J. Doyle ◽  
Z. C. Feng ◽  
M. H. Hanes ◽  
...  
Keyword(s):  
Low Temperature ◽  
Ion Milling ◽  
Double Crystal ◽  
X Ray ◽  
Transmission Electron ◽  
Line Defects ◽  
Cdte Films ◽  
Means Of Transmission ◽  
Low Temperature Photoluminescence

ABSTRACTThe effects of chemical etching, mechanical thinning, and ion milling on the low temperature photoluminescence spectra of MBE grown (001) CdTe films are reported. Line defects observed by TEM are correlated with photoluminescence. It is shown that X-ray D.C.R.C, measurements in these films are weighted averages over the whole thickness of the films and therefore weakly reflect the structural perfection of the samples near the surface as deduced by photoluminescence.

Characterization of Heated Atomic Force Microscope Cantilevers in Air and Vacuum

2005 ◽  
Author(s):  
Jungchul Lee ◽  
Tanya L. Wright ◽  
Mark Abel ◽  
Erik Sunden ◽  
Alexei Marchenkov ◽  
...  
Keyword(s):  
Atomic Force Microscope ◽  
Single Crystal Silicon ◽  
Silicon On Insulator ◽  
Thermal Coupling ◽  
Electrical Measurements ◽  
Crystal Silicon ◽  
Laser Raman ◽  
Atomic Force ◽  
Afm Cantilever

This paper presents characterization of heated atomic force microscope (AFM) cantilevers in air and helium, both at atmospheric pressure and in a partially evacuated environment. The cantilevers are made of doped single-crystal silicon using a standard silicon-on-insulator cantilever fabrication process. The electrical measurements show the link between the cantilever temperature-dependant electrical characteristics, electrical resistive heating, and thermal properties of the heated AFM cantilever and its surroundings. Laser Raman thermometry measures temperature along the cantilever with resolution near 1 μm and 4°C. By modulating the gaseous environment surrounding the cantilever, it is possible to estimate the microscale thermal coupling between the cantilever and its environment. This work seeks to improve the calibration and design of heated AFM cantilevers.

Microstructure of buried nitride films in silicon formed by implanted nitrogen

1986 ◽  
Vol 44 ◽  
pp. 734-735
Author(s):  
A. K. Datye ◽  
S. S. Tsao ◽  
D. R. Myers
Keyword(s):  
Silicon Nitride ◽  
Ion Implantation ◽  
Single Crystal ◽  
Single Crystal Silicon ◽  
Amorphous Layer ◽  
Nitride Layer ◽  
Silicon On Insulator ◽  
Crystal Silicon ◽  
Defective Surface

High fluence ion implantation of nitrogen ions in silicon is currently of great interest in the formation of silicon on insulator (SOI) structures. After ion implantation, the single crystal silicon water usually exhibits a highly defective surface layer followed by an amorphous layer corresponding to the peak of the nitrogen implant profile. Annealing the sample at ∽ 1200 C yields a buried layer of silicon nitride underneath a top layer of single crystal silicon. The Quality of the single crystal silicon, buried nitride and the silicon/silicon nitride interface is of paramount importance from the standpoint of device design. We have used high resolution cross section TEM to examine the Si/nitride interface and the buried nitride layer.

The Study of Seam Line Defects in Silicon-On-Oxide by Merged Epitaxial Lateral Overgrowth

1993 ◽  
Vol 317 ◽  
Author(s):  
Yangchin Shih ◽  
J. C. Lou ◽  
W. G. Oldham
Keyword(s):  
Epitaxial Film ◽  
Single Crystal Silicon ◽  
Silicon On Insulator ◽  
Epitaxial Lateral Overgrowth ◽  
Formation Mechanisms ◽  
Crystal Silicon ◽  
Lateral Overgrowth ◽  
Transmission Electron ◽  
Low Dislocation Density ◽  
Line Defects

ABSTRACTSelective Epitaxial Growth of silicon through windows in SiO2 using low-temperature SiH2Cl2/H2 chemistry in a hot wall LPCVD system was used to form Epitaxial Lateral Overgrowth (ELO) regions of Silicon-on-insulator. In cases where pattern ‘width was less than two times epi film thickness, the ELO regions merged to form a continuous epitaxial film. In this study, 2.5 μm thick single crystal silicon layers were grown perfectly over oxide regions with very low dislocation density (< 104/cm2). The epitaxial Si/oxide interfaces were smooth and defect-free. However, a “seam”-like defect was occasionally observed in the epitaxial film on top of the oxide, at the locations where two growth fronts merged together. This crystallographic defect in some case extends through the whole Silicon-on-Oxide film and would be expected to be detrimental to electronic devices built on or close to it. The sturctures of these seam line defects were investigated in detail by transmission electron Microscopy (TEM). The formation mechanisms of these seam line defects and possible origins are discussed.

Analysis of Silicon-On-Insulator Structures Formed By Oxygen Ion Implantation

1985 ◽  
Vol 43 ◽  
pp. 300-301
Author(s):  
N. Lewis ◽  
E. L. Hall ◽  
A. Mogro-Campero ◽  
R. P. Love
Keyword(s):  
Ion Implantation ◽  
Single Crystal ◽  
Single Crystal Silicon ◽  
Silicon Layer ◽  
Device Fabrication ◽  
Silicon On Insulator ◽  
High Dose ◽  
Crystal Silicon ◽  
Oxygen Ion ◽  
Oxygen Ion Implantation

The formation of buried oxide structures in single crystal silicon by high-dose oxygen ion implantation has received considerable attention recently for applications in advanced electronic device fabrication. This process is performed in a vacuum, and under the proper implantation conditions results in a silicon-on-insulator (SOI) structure with a top single crystal silicon layer on an amorphous silicon dioxide layer. The top Si layer has the same orientation as the silicon substrate. The quality of the outermost portion of the Si top layer is important in device fabrication since it either can be used directly to build devices, or epitaxial Si may be grown on this layer. Therefore, careful characterization of the results of the ion implantation process is essential.

scholarly journals A Flexible PI/Si/SiO2 Piezoresistive Microcantilever for Trace-Level Detection of Aflatoxin B1

Sensors ◽  
2021 ◽  
Vol 21 (4) ◽  
pp. 1118
Author(s):  
Yuan Tian ◽  
Yi Liu ◽  
Yang Wang ◽  
Jia Xu ◽  
Xiaomei Yu
Keyword(s):  
Single Crystal ◽  
Aflatoxin B1 ◽  
Single Crystal Silicon ◽  
Silicon Layer ◽  
Wheatstone Bridge ◽  
Silicon On Insulator ◽  
Passivation Layer ◽  
Spring Constant ◽  
Trace Level ◽  
Crystal Silicon

In this paper, a polyimide (PI)/Si/SiO2-based piezoresistive microcantilever biosensor was developed to achieve a trace level detection for aflatoxin B1. To take advantage of both the high piezoresistance coefficient of single-crystal silicon and the small spring constant of PI, the flexible piezoresistive microcantilever was designed using the buried oxide (BOX) layer of a silicon-on-insulator (SOI) wafer as a bottom passivation layer, the topmost single-crystal silicon layer as a piezoresistor layer, and a thin PI film as a top passivation layer. To obtain higher sensitivity and output voltage stability, four identical piezoresistors, two of which were located in the substrate and two integrated in the microcantilevers, were composed of a quarter-bridge configuration wheatstone bridge. The fabricated PI/Si/SiO2 microcantilever showed good mechanical properties with a spring constant of 21.31 nN/μm and a deflection sensitivity of 3.54 × 10−7 nm−1. The microcantilever biosensor also showed a stable voltage output in the Phosphate Buffered Saline (PBS) buffer with a fluctuation less than 1 μV @ 3 V. By functionalizing anti-aflatoxin B1 on the sensing piezoresistive microcantilever with a biotin avidin system (BAS), a linear aflatoxin B1 detection concentration resulting from 1 ng/mL to 100 ng/mL was obtained, and the toxic molecule detection also showed good specificity. The experimental results indicate that the PI/Si/SiO2 flexible piezoresistive microcantilever biosensor has excellent abilities in trace-level and specific detections of aflatoxin B1 and other biomolecules.

Characterization of Thermal Oxides of Laser Annealed Polysilicon

1981 ◽  
Vol 4 ◽  
Author(s):  
Rajiv R. Shah ◽  
Robert Mays ◽  
D. Lloyd Crosthwait
Keyword(s):  
Laser Processing ◽  
Single Crystal Silicon ◽  
Electrical Characterization ◽  
Device Fabrication ◽  
Breakdown Field ◽  
Guard Ring ◽  
Crystal Silicon ◽  
Process Sequence ◽  
Thermal Oxide

ABSTRACTWe report an investigation of the effects of laser processing on the thermal oxides of polysilicon. LPCVD polysilicon, 500 nm thick, deposited on 500 nm thermal oxide of single crystal silicon was laser processed at various stages in the process sequence for device fabrication. Effects of CW Ar+ and pulsed 1.06 and 0.53 μm laser processing were investigated. Laser annealed polysilicon was oxidized in a steam ambient. Using a second level of polysilicon, guard ring diode and capacitors were fabricated. Electrical characterization revealed an improvement in breakdown field strengths of these oxides without deleterious effects on any of the associated interfaces.

Characterization of JEOL 3000f TEM Equipped for Electron Holography

2000 ◽  
Vol 6 (S2) ◽  
pp. 228-229
Author(s):  
M. A. Schofield ◽  
Y. Zhu
Keyword(s):  
Electron Microscope ◽  
Transmission Electron Microscope ◽  
Design Of Experiment ◽  
Electron Holography ◽  
Fringe Spacing ◽  
Interference Fringes ◽  
Transmission Electron ◽  
Careful Design

Quantitative off-axis electron holography in a transmission electron microscope (TEM) requires careful design of experiment specific to instrumental characteristics. For example, the spatial resolution desired for a particular holography experiment imposes requirements on the spacing of the interference fringes to be recorded. This fringe spacing depends upon the geometric configuration of the TEM/electron biprism system, which is experimentally fixed, but also upon the voltage applied to the biprism wire of the holography unit, which is experimentally adjustable. Hence, knowledge of the holographic interference fringe spacing as a function of applied voltage to the electron biprism is essential to the design of a specific holography experiment. Furthermore, additional instrumental parameters, such as the coherence and virtual size of the electron source, for example, affect the quality of recorded holograms through their effect on the contrast of the holographic fringes.

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