Low Resistivity Contact Formation for Lsi Interconnection With Short-Pulse-Laser Induced Mo Cvd

1987 ◽  
Vol 101 ◽  
Author(s):  
F. Uesugi ◽  
Y. Morishige ◽  
T. Shinzawa ◽  
S. Kishida ◽  
M. Hirata ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Heat Dissipation ◽  
Short Pulse ◽  
Laser Pulses ◽  
Direct Writing ◽  
Low Resistivity ◽  
Short Pulse Laser ◽  
Localized Heating ◽  
Short Laser Pulses ◽  
First Time

ABSTRACTThe contact characteristics between Al interconnections in LSI's and direct written Mo lines has been substantially improved by adopting, for the first time, short-pulse-laser induced Mo CVD. The linewidth stability upon Al interconnections has also been improved. Transient, localized heating with short laser pulses effectively overcomes the heat dissipation through Al interconnections which degraded contact characteristics and prevented fine drawing near the Al interconnection. This new scheme can appreciably widen the applicable device field of direct writing circuit restructuring.

scholarly journals Multiphoton Ionization and Fragmentation of CS2 Under Intense Short Pulse Laser Radiation

1999 ◽  
Vol 18 (3) ◽  
pp. 129-142 ◽  
Author(s):  
E. Koudoumas ◽  
R. De Nalda ◽  
C. Fotakis ◽  
S. Couris
Keyword(s):  
Laser Radiation ◽  
Pulse Laser ◽  
Mass Spectra ◽  
Short Pulse ◽  
Multiphoton Ionization ◽  
Laser Pulses ◽  
Pulse Laser Radiation ◽  
Short Pulse Laser ◽  
Multiply Charged ◽  
Intense Mass

The interaction of CS2 with intense short pulse laser radiation is studied, experimentally using time-of-flight mass spectroscopy. Laser pulses of 0.5 and 5 psec at 248 and 496 nm have been used in order to investigate the effect of the wavelength and the pulse duration on the molecular ionization and fragmentation. As shown, for low enough intensities the parent molecular ion is present as the most important peak in all cases. Increasing the intensity results in extensive fragmentation, where the molecular parent ion remains always the more intense mass peak at 496 nm while at 248 nm S+ dominates the mass spectra. Finally, the production of multiply charged fragments is more efficient at the longer wavelength used.

scholarly journals Accelerating ions with high-energy short laser pulses from submicrometer thick targets

2016 ◽  
Vol 4 ◽  
Author(s):  
F. Wagner ◽  
C. Brabetz ◽  
O. Deppert ◽  
M. Roth ◽  
T. Stöhlker ◽  
...  
Keyword(s):  
Focal Plane ◽  
Short Pulse ◽  
Laser Pulses ◽  
High Energy ◽  
Ion Acceleration ◽  
Temporal Contrast ◽  
Short Pulse Laser ◽  
Target Intensity ◽  
Short Laser Pulses ◽  
And Control

Using the example of the PHELIX high-energy short pulse laser we discuss the technical preconditions to investigate ion acceleration with submicrometer thick targets. We show how the temporal contrast of this system was improved to prevent pre-ionization of such targets on the nanosecond timescale. Furthermore the influence of typical fluctuations or uncertainties of the on-target intensity on ion acceleration experiments is discussed. We report how these uncertainties were reduced by improving the assessment and control of the on-shot intensity and by optimizing the positioning of the target into the focal plane. Finally we report on experimental results showing maximum proton energies in excess of 85 MeV for ion acceleration via the target normal sheath acceleration mechanism using target thicknesses on the order of one micrometer.

Investigation of the Dynamic Damage of the Rocks Subjected to Short Pulse Laser

2007 ◽  
Vol 348-349 ◽  
pp. 269-272
Author(s):  
Song Lin Xu ◽  
Dao Ying Xi ◽  
Zhi Ping Tang ◽  
Yun Du
Keyword(s):  
Pulse Laser ◽  
Natural Water ◽  
Water Saturation ◽  
Short Pulse ◽  
Laser Pulses ◽  
Short Pulse Laser ◽  
Water Saturated ◽  
Dynamic Damage

Some preliminary experiments are conducted to investigate the responses of granite， marble and red stone in the states of natural，water-saturation and oil-saturated under the shock of short pulse laser. The 3D contour of ablation pit and the preliminary relations of the ablation contour to the number of laser pulses are obtained. The results show that some cracks generate at local places for the shock of laser，and the degree of ablation of the oil-saturated rocks is more severe than that of the natural and water saturated rocks. However，further work should be conducted to control the direction，sizes and number of cracks generated under the shock of laser.

Silicon Thinning using Ultra-Short Pulse Laser Ablation

2004 ◽  
Author(s):  
F. Beaudoin ◽  
P. Perdu ◽  
C. DeNardi ◽  
R. Desplats ◽  
J. Lopez ◽  
...  
Keyword(s):  
Laser Ablation ◽  
Sample Preparation ◽  
Pulse Laser ◽  
Pulse Laser Ablation ◽  
Short Pulse ◽  
Special Care ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser

Abstract Ultra-short pulse laser ablation is applied to IC backside sample preparation. It is contact-less, non-thermal, precise and can ablate the various types of material present in IC packages. This study concerns the optimization of ultra-short pulse laser ablation for silicon thinning. Uncontrolled silicon roughness and poor uniformity of the laser thinned cavity needed to be tackled. Special care is taken to minimize the silicon RMS roughness to less than 1µm. Application to sample preparation of 256Mbit devices is presented.

Chromium oxide dissolution in steels via short pulse laser processing

2013 ◽  
Vol 115 (4) ◽  
pp. 1469-1477 ◽  
Author(s):  
Evgeny Kharanzhevskiy ◽  
Sergey Reshetnikov
Keyword(s):  
Pulse Laser ◽  
Chromium Oxide ◽  
Laser Processing ◽  
Short Pulse ◽  
Oxide Dissolution ◽  
Short Pulse Laser

The study of time dependent, broadband X-ray emission from ultra-short pulse laser produced plasmas

1994 ◽  
Author(s):  
Ronnie Shepherd ◽  
Rex Booth ◽  
Dwight Price ◽  
Rosemary Walling ◽  
Richard More ◽  
...  
Keyword(s):  
Pulse Laser ◽  
Short Pulse ◽  
Time Dependent ◽  
X Ray ◽  
Short Pulse Laser ◽  
Ultra Short Pulse ◽  
Ultra Short Pulse Laser
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