Ion Irradiation Induced Grain Growth in Metal Thin Films

1988 ◽  
Vol 100 ◽  
Author(s):  
Joyce. C. Liu ◽  
J. W. Mayer

ABSTRACTThe dependence of ion irradiation induced grain growth on collision and material properties were studied in metal and alloy thin films. The uniform grain size increased with ion dose in the low dose regime; and the growth saturated in the high dose regime. The saturated grain size was determined 'by the cascade dimension as well as the atomic mobility. The growth was further influenced by the temperature, composition and impurity.

1991 ◽  
Vol 235 ◽  
Author(s):  
D. A. Lilienfeld ◽  
P. Bøorgesen ◽  
P. Meyer

ABSTRACTIon irradiation induced grain growth size distributions in Pd are examined at low temperatures. Two features are observed: 1) A majority of the grains saturate in size. 2) Some grains achieve sizes much larger than the average grain size and continue to grow with ion dose. However, by careful choice of ion mass and ion dose, it is possible to produce a sample possessing a monomodal grain size. This process will have applications in producing thin films of nanocrystalline materials.


1991 ◽  
Vol 235 ◽  
Author(s):  
K. H. Chae ◽  
J. H. Song ◽  
J. H. Joo ◽  
J. J. Woo ◽  
C. N. Whang ◽  
...  

ABSTRACTThe relation between the ion irradiation induced grain growth in bilayer system and the basic parameters involved in ion beam mixing process was studied. TEM micrographs showed that a significant grain growth has been induced by Ar+ irradiation at room temperature. The grain size increases rapidly in low dose region, while it approaches a saturated value in high dose region, and it has close relationship with thermodynamic properties such as cohesive energy ( ΔHc ) and heat of mixing( ΔHm ). The experimental results are in good agreement with the model for the grain growth based on the thermal spike induced atomic migration.


1999 ◽  
Vol 564 ◽  
Author(s):  
Wei-Tsu Tseng ◽  
Ying-Lang Wang

AbstractThe correlation between microstructures of Al and W metal thin films and their respective CMP performance is investigated. It is found that CMP removal rate decreases with increasing grain size. In both cases, the textures of the metal films are altered and their resistivity increased after CMP. The phenomenon is more pronounced for polish under a greater down force. The table speed, on the other hand, has only minimum effects on microstructure and resistivity. The possible underlying mechanisms leading to this phenomenon are proposed and their potential impacts on metallization reliability is discussed.


2004 ◽  
Vol 2004.1 (0) ◽  
pp. 389-390
Author(s):  
Tomonori SASAKI ◽  
Kinuko FUJIMOTO ◽  
Ming YANG

2002 ◽  
Vol 17 (6) ◽  
pp. 1520-1528 ◽  
Author(s):  
Chen-Lung Fan ◽  
Daniel Ciardullo ◽  
Jay Paladino ◽  
Wayne Huebner

Thin films of TiO2 were fabricated by spin-coating silicon wafers and cover glass with a titanium citrate complex precursor. The grain growth and phase development of both freestanding and supported films were studied using a combination of atomic force microscopy, x-ray diffraction, and transmission electron microscopy. Freestanding films prepared at 400 °C possess only the anatase phase, while supported films treated under the same conditions formed a small amount of the rutile phase. After heat treatment at various temperatures, results indicated that porosity was introduced into the films when the grain size grew close to the film thickness. Grain growth studies show that the grain size of the freestanding film underwent a drastic increase during the transformation from anatase to rutile. The grain size of the supported films did not show an abrupt change upon heat treatment. The grain size of the freestanding films treated at 900 °C was approximately three times larger than that of the supported films.


Vacuum ◽  
1991 ◽  
Vol 42 (15) ◽  
pp. 995-999 ◽  
Author(s):  
Peixuan Wang ◽  
Yanfeng Fu ◽  
Guoguang Zhang ◽  
Ruzhang Ma

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