High-Temperature Dielectric Polyimide Films for Energy Storage Applications
Keyword(s):
ABSTRACTTwo new diamines containing three nitriles are synthesized via a 3-step route. They are polymerized with four commercial dianhydrides (i.e. 6FDA, OPDA, BTDA and PMDA) in N,N-dimethylacetamide (DMAc) to afford poly(amic acid)s, which are thermally cured at temperatures up to 300 °C to form tough, creasable films. Most of these polyimides are soluble in common solvents. Their glass transition temperatures range from 216 to 341 °C. The polyimides are stable up to 400 °C. The dielectric constants of these OPDA-based polyimides increase from 2.9 (CP2) to 4.7 as measured by the D-E loops.
1995 ◽
Vol 7
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pp. 337-345
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2007 ◽
Vol 43
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pp. 989-995
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2018 ◽
Vol 31
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pp. 909-918
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