Thermoelectric behaviour of p- and n- type Ti-Ni-Sn half Heusler alloy variants and their amorphous equivalents

2013 ◽  
Vol 1490 ◽  
pp. 33-40
Author(s):  
Song Zhu ◽  
Satish Vitta ◽  
Terry M. Tritt

ABSTRACTTi-Ni-Sn type half-Heusler alloys which have the versatility to be either p- or n-type depending on the type of substitution, have been synthesized and investigated in the present work. The added advantage of doping them with multiple elements is that they will be amenable to bulk amorphous phase formation. The hole doped alloys were predominantly single phase with a cubic structure, while the electron doped alloys were found to have minor additional phases. All the alloys exhibit extremely weak metallic-like or degenerate semiconductor transport behaviour in the temperature range 20 K to 1000 K. The resistivity of p-type alloys exhibits semi-metallic-to-semiconducting transition at ∼ 500 K while the n-type alloys exhibit a weak metallic-like behaviour in the complete temperature range. The Seebeck coefficient has strong temperature dependence with a maximum of 45 μV K−1 in the temperature range 600-700 K in the p-type alloys. The n-type alloys however exhibit a linear variation of the Seebeck coefficient with temperature. The total thermal conductivity of the alloys increases with increasing temperature without any peak at low temperatures indicating significant disorder induced scattering. The p-type alloys have the lowest thermal conductivity compared to the n-type alloys. These alloys become amorphous after pulsed laser deposition except one alloy which exhibits compensated transport behaviour.

2021 ◽  
Vol 59 (5) ◽  
pp. 329-335
Author(s):  
Sung-Yoon Kim ◽  
Go-Eun Lee ◽  
Il-Ho Kim

Mn-doped tetrahedrites Cu12-xMnxSb4S13 (0.1 ≤ x ≤ 0.4) were synthesized by mechanical alloying (MA) and sintered by hot pressing (HP). A single tetrahedrite phase was synthesized by MA without post-annealing, and it was stable without any phase changes after HP. The hot-pressed specimens had a relative density higher than 98.6%. The lattice constant of the Mn-doped samples increased compared to that of undoped Cu12Sb4S13, but no significant change in the lattice constant was observed with a change in Mn content. All Mn-doped tetrahedrites acted as p-type semiconductors, as confirmed from positive Hall and Seebeck coefficient values. The Seebeck coefficient increased with increasing temperature but decreased with increasing Mn content; maximum Seebeck coefficient values of 200−219 μVK-1 were obtained at 323−723 K for x = 0.1. Electrical conductivity increased with increasing temperature and Mn content; the highest electrical conductivity values of (1.76−2.45) × 104 Sm-1 were obtained at 323−723 K for x = 0.4. As a result, Cu11.6Mn0.4Sb4S13 exhibited a maximum power factor of 0.80 mWm-1K-2 at 723 K. As the Mn content increased, both the electronic and lattice thermal conductivities increased, and thus, the total thermal conductivity was the lowest at 0.48–0.63Wm-1K-1 at 323–723 K for x = 0.1. A maximum dimensionless figure of merit of 0.75 was obtained at 723 K for Cu11.7Mn0.3Sb4S13. The MA-HP process is suitable for preparing doped tetrahedrites exhibiting excellent thermoelectric performance.


2011 ◽  
Vol 312-315 ◽  
pp. 223-228
Author(s):  
Il Ho Kim

Sn-filled and Fe-doped CoSb3 skutterudites were synthesized by encapsulated induction melting. A single δ-phase was obtained by subsequent annealing, as confirmed by X-ray diffraction. The as-solidified ingot consisted of mixed phases of -CoSb, -CoSb2, δ-CoSb3 and elemental Sb. The phases could be transformed by annealing, and the phases of the as-solidified ingot annealed at 773 K for 24 h transformed to δ-CoSb3. The temperature dependence of the Seebeck coefficient, electrical resistivity and thermal conductivity were examined from 300 K to 700 K. The positive Seebeck coefficient confirmed p-type conduction. The electrical resistivity increased with increasing temperature, which showed that the SnzCo3FeSb12 skutterudite is highly degenerate. The thermal conductivity was reduced by Sn-filling because the filler atoms acted as phonon scattering centers in the skutterudite lattice. The thermoelectric figure of merit was enhanced by Sn filling and its optimum composition was considered to be Sn0.3Co3FeSb12.


2013 ◽  
Vol 1543 ◽  
Author(s):  
Ö. Ceyda Yelgel ◽  
Gyaneshwar P. Srivastava

ABSTRACTIn this work we present a detailed theoretical investigation of the thermal conductivities of n-type 0.1 wt.% CuBr doped 85% Bi2Te3 - 15% Bi2Se3 and p-type 3 wt% Te doped 20% Bi2Te3 - %80 Sb2Te3 single crystals. The thermal conductivity contributions arising from carriers, electron-hole pairs and phonons are computed rigorously in the temperature range $300\,{\rm{K}}\, \le \,T\, \le \,500\,{\rm{K}}$. In agreement with available experimental measurements we theoretically find that the lowest total thermal conductivity is 3.15 W K−1 m−1 at 380 K for the n-type alloy and 1.145 W K−1 m−1 at 400 K for the p-type alloy. Stronger mass-defect scattering is found to be responsible for the lower thermal conductivity of the p-type alloy throughout the temperature range of the study.


2016 ◽  
Vol 09 (01) ◽  
pp. 1650017 ◽  
Author(s):  
Yidong Xu ◽  
Yixuan Wu ◽  
Zhiwei Chen ◽  
Wenjia Shen ◽  
Zhengzhong Jian ◽  
...  

BaSi2 has been known as a wide gap semiconductor with an intrinsic low lattice thermal conductivity, therefore may be a promising environmental friendly thermoelectric (TE) material with abundant constituent elements. In this work, NixBa[Formula: see text]Si2 compounds with 0[Formula: see text] are synthesized by arc melting. The resistivity, thermal conductivity and Seebeck coefficient are measured in the temperature range of 300–850[Formula: see text]K. The resistivity of the undoped BaSi2 is as high as 480[Formula: see text]mOhm[Formula: see text]cm at room temperature. Through Ni-doping, both resistivity and the Seebeck coefficient decrease dramatically. Meanwhile, the total thermal conductivity has no apparent difference due to Ni-doping. The lattice thermal conductivity decreases with increasing temperature monotonously to be lower than 1[Formula: see text]W/m[Formula: see text]K at high temperatures.


2007 ◽  
Vol 1044 ◽  
Author(s):  
Julio E. Rodríguez

AbstractSeebeck coefficient S(T), thermal conductivity κ(T) and electrical resistivity ρ(T) measurements on polycrystalline La1.85Sr0.15CuO4-δ(LSCO) compounds grown by solid-state reaction method were carried out in the temperature range between 100 and 290K. The obtained samples were submitted to annealing processes of different duration in order to modify their oxygen stoichiometry. The Seebeck coefficient is positive over the measured temperature range and its magnitude increases with the annealing time up to reach values close to 150 µV/K. The electrical resistivity exhibits a metallic behavior, in all samples, ρ(T) takes values less than 1mΩ-cm. As the annealing time increases, the total thermal conductivity increases up to values close to 3 W/K-m. From S(T), κ(T) and ρ(T) data, the thermoelectric power factor (PF) and the dimensionless figure of merit (ZT) were determined. These parameters reach maximum values around 25 µW/K2-cm and 0.18, respectively. The observed behavior in the transport properties become these compounds potential thermoelectric materials, which could be used in low temperature thermoelectric applications.


1987 ◽  
Vol 97 ◽  
Author(s):  
C. Wood ◽  
D. Emin ◽  
R. S. Feigelson ◽  
I. D. R. Mackinnon

ABSTRACTMeasurements of the electrical conductivity, Seebeck coefficient and Hall mobility from -300 K to -1300 K have been carried out on multiphase hotpressed samples of the nominal composition B6Si. In all samples the conductivity and the p-type Seebeck coefficient both increase smoothly with increasing temperature. By themselves, these facts suggest small-polaronic hopping between inequivalent sites. The measured Hall mobilities are always low, but vary in sign. A possible explanation is offered for this anomalous behavior.


2021 ◽  
Author(s):  
Bo Feng

Abstract The effect of Ti doped at Cu site on the thermoelectric properties of BiCuSeO was studied by experimental method and first principles calculation. The results show that Ti doping can cause the lattice contraction and decrease the lattice constant. Ti doping can increase the band gap and lengthen the Cu/Ti-Se bond, resulting in the decrease of carrier concentration. Ti doping can reduce the effective mass and the Bi-Se bond length, correspondingly improve the carrier mobility. Ti doping can decrease the density of states of Cu-3d and Se-4p orbitals at the top of valence band, but Ti-4p orbitals can obviously increase the density of states at the top of valence band and finally increase the electrical conductivity in the whole temperature range. With the decrease of effective mass, Ti doping would reduce the Seebeck coefficient, but the gain effect caused by the increase of electrical conductivity is more than the benefit reduction effect caused by the decrease of Seebeck coefficient, and the power factor shows an upward trend. Ti doping can reduce Young's modulus, lead to the increase of defect scattering and strain field, correspondingly reduce the lattice thermal conductivity and total thermal conductivity. It is greatly increased for the ZT values in the middle and high temperature range, with the highest value of 1.04 at 873 K.


2008 ◽  
Vol 368-372 ◽  
pp. 547-549
Author(s):  
Jun Jiang ◽  
Ya Li Li ◽  
Gao Jie Xu ◽  
Ping Cui ◽  
Li Dong Chen

In the present study, n-type (Bi2Se3)x(Bi2Te3)1-x crystals with various chemical compositions were fabricated by the zone melting method. Thermoelectric properties, including Seebeck coefficient (α), electrical conductivity (σ) and thermal conductivity (κ), were measured in the temperature range of 300-500 K. The influence of the variations of Bi2Te3 and Bi2Se3 content on thermoelectric properties was studied. The increase of Bi2Se3 content (x) caused an increase in carrier concentration and thus an increase of σ and a decrease of α. The maximum figure of merit (ZT = α2σT/κ) of 0.87 was obtained at about 325 K for the composition of 93%Bi2Te3-7%Bi2Se3 with doping TeI4.


2006 ◽  
Vol 929 ◽  
Author(s):  
Bangke Zheng ◽  
S. Budak ◽  
C. Muntele ◽  
Z. Xiao ◽  
S. Celaschi ◽  
...  

ABSTRACTWe made p-type nanoscale super lattice thermoelectric cooling devices which consist of multiple periodic layers of Si1−x Gex / Si, The thickness of each layer ranges between 10 and 50 nm. The super lattice was bombarded by 5 MeV Si ion with different fluencies aiming to form nano-cluster quantum dot structures. We estimated the thermo-electric efficiency of the so fabricated devices, measuring the thin film cross plane thermal conductivity by the 3rd harmonic method, measuring the cross plane Seebeck coefficient, and finally measuring the cross plane electric conductivity before and after ion bombardment. As predicted, the thermo-electric Figure of Merit of the films increases with increasing Si ion fluencies. In addition to the effect of quantum well confinement of the phonon transmission, the nano-scale crystal quantum dots produced by the incident Si beam further adversely affects the thermal conductivity by absorbing and dissipating phonon along the lattice, and therefore further reduces the cross plane thermal conductivity, This process increases the electron density of state therefore increasing Seebeck coefficient, and the electric conductivity.


2000 ◽  
Vol 626 ◽  
Author(s):  
Jun-ichi Tani ◽  
Hiroyasu Kido

ABSTRACTIn order to investigate the thermoelectric properties of Re-doped β-FeSi2 (Fe1-xRexSi2), Ir-doped β-FeSi2 (Fe1-xIrxSi2), and Pt-doped β-FeSi2 (Fe1-xPtxSi2), the electrical resistivity, the Seebeck coefficient, and the thermal conductivity of these samples have been measured in the temperature range between 300 and 1150 K. Fe1-xRexSi2 is p-type, while Fe1-xIrxSi2 and Fe1-xPt xSi2 are n-type over the measured temperature range. The solubility limits of dopant are estimated to be 0.2at% for Fe1-xRexSi2, 0.5at% for Fe1-xIrxSi2, and 1.9at% for Fe1-xPtxSi2. A maximum ZT value of 0.14 was obtained for Fe1-xPt xSi2 (x=0.03) at the temperature 847 K.


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