Semiconducting Arylacetylene:Insulating Polymer Blends for Organic-Based Electronic Devices

2012 ◽  
Vol 1402 ◽  
Author(s):  
Pascal Wolfer ◽  
Maria Laura Santarelli ◽  
Luigi Vaccaro ◽  
Alessandra Broggi ◽  
Daniela Lanari ◽  
...  

ABSTRACTIn this contribution we have reported about bi-component blends of readily accessible semiconducting molecular arylacetylenes with insulating high-density polyethylene (HDPE) and poly(vinylidene fluoride) (PVDF) that may exhibit electronic characteristics comparable to those of the neat semiconductors, as measured in field-effect transistors (FETs).

Nanomaterials ◽  
2019 ◽  
Vol 9 (3) ◽  
pp. 361 ◽  
Author(s):  
Kartik Behera ◽  
Mithilesh Yadav ◽  
Fang-Chyou Chiu ◽  
Kyong Rhee

In this study, a graphene nanoplatelet (GNP) was used as a reinforcing filler to prepare poly(vinylidene fluoride) (PVDF)/high density polyethylene (HDPE) blend-based nanocomposites through a melt mixing method. Scanning electron microscopy confirmed that the GNP was mainly distributed within the PVDF matrix phase. X-ray diffraction analysis showed that PVDF and HDPE retained their crystal structure in the blend and composites. Thermogravimetric analysis showed that the addition of GNP enhanced the thermal stability of the blend, which was more evident in a nitrogen environment than in an air environment. Differential scanning calorimetry results showed that GNP facilitated the nucleation of PVDF and HDPE in the composites upon crystallization. The activation energy for non-isothermal crystallization of PVDF increased with increasing GNP loading in the composites. The Avrami n values ranged from 1.9–3.8 for isothermal crystallization of PVDF in different samples. The Young’s and flexural moduli of the blend improved by more than 20% at 2 phr GNP loading in the composites. The measured rheological properties confirmed the formation of a pseudo-network structure of GNP-PVDF in the composites. The electrical resistivity of the blend reduced by three orders at a 3-phr GNP loading. The PVDF/HDPE blend and composites showed interesting application prospects for electromechanical devices and capacitors.


2009 ◽  
Vol 105 (5) ◽  
pp. 054110 ◽  
Author(s):  
I. Lazareva ◽  
Y. Koval ◽  
P. Müller ◽  
K. Müller ◽  
K. Henkel ◽  
...  

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