Deposition and Etching of Conformal Boron Films for Neutron Detector Applications

2011 ◽  
Vol 1307 ◽  
Author(s):  
Nicholas LiCausi ◽  
Justin Clinton ◽  
Yaron Danon ◽  
James J.-Q. Lu ◽  
Ishwara B. Bhat
Keyword(s):  
Vapor Deposition ◽  
Neutron Detector ◽  
Chemical Etching ◽  
Chemical Vapor ◽  
Deposition Rates ◽  
Si Substrates ◽  
Pressure Chemical ◽  
Conformal Coverage ◽  
Wet Chemical ◽  
Wet Chemical Etching

ABSTRACTIn this work, the deposition of boron using low pressure chemical vapor deposition (LPCVD) has been investigated on planar and deep reactive ion etched (DRIE) Si substrates. Deposition rate and conformal coverage have been studied. Additional studies of “dry” RIE etching and “wet” chemical etching of the deposited boron films are presented. Deposition rates as high as 1 μm/hr and conformal coverage ratios of ~80% have been achieved. Etching rates for various methods studied range widely from 0.35 μm/hr to 1.2 μm/min.

Formation of an Interfacial Buffer Layer for 3C-SiC Heteroepitaxy on AlN/Si Substrates

2014 ◽  
Vol 778-780 ◽  
pp. 251-254 ◽  
Author(s):  
Kazuki Meguro ◽  
Tsugutada Narita ◽  
Kaon Noto ◽  
Hideki Nakazawa
Keyword(s):  
Chemical Vapor Deposition ◽  
Low Temperature ◽  
Surface Morphology ◽  
Buffer Layer ◽  
Vapor Deposition ◽  
Intermediate Layer ◽  
Chemical Vapor ◽  
Si Substrates ◽  
Pressure Chemical ◽  
Sic Films

We have formed a SiC interfacial buffer layer on AlN/Si substrates at a low temperature by low-pressure chemical vapor deposition (LPCVD) using monomethylsilane (CH3SiH3; MMS), and grew 3C-SiC films on the low-temperature buffer layer by LPCVD using MMS. We investigated the surface morphology and crystallinity of the grown SiC films. It was found that the formation of the SiC buffer layer suppressed the outdiffusion of Al and N atoms from the AlN intermediate layer to the SiC films and further improved the surface morphology and crystallinity of the films.

Etching Characteristics of Polycrystalline 3C-SiC Films Using Enhanced RIE

2008 ◽  
Vol 600-603 ◽  
pp. 875-878
Author(s):  
Gwiy Sang Chung ◽  
Chang Min Ohn
Keyword(s):  
Thin Films ◽  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Atmospheric Pressure ◽  
Chemical Vapor ◽  
Chamber Pressure ◽  
Si Substrates ◽  
Pressure Chemical ◽  
Sic Films ◽  
Reactive Gas

This paper describes magnetron reactive ion etching (RIE) characteristics of polycrystalline (poly) 3C-SiC thin films grown on thermally oxidized Si substrates by atmospheric pressure chemical vapor deposition (APCVD). The best vertical structures were obtained by the addition of 40 % O2, 16 % Ar, and 44 % CHF3 reactive gas at 40 mTorr of chamber pressure. Stable etching was achieved at 70 W and the poly 3C-SiC was undamaged. These results show that in a magnetron RIE system, it is possible to etch SiC with lower power than that of the commercial RIE system. Therefore, poly 3C-SiC etched by magnetron RIE has the potential to be applied to micro/nano electro mechanical systems (M/NEMS).

Properties of Single-Crystalline SiC Films Grown on Si by Low-Pressure Chemical Vapor Deposition at 750°C

1992 ◽  
Vol 282 ◽  
Author(s):  
I. Golecki ◽  
J. Marti ◽  
F. Reidinger
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Low Pressure ◽  
Double Crystal ◽  
X Ray ◽  
Si Substrates ◽  
Pressure Chemical ◽  
Means Of Transmission ◽  
Sic Films

ABSTRACTMonocrystalline, epitaxial cubic (100) SiC films have been grown on (100) Si substrates at 750°C, the lowest temperature reported to date, by low-pressure chemical vapor deposition, using methylsilane, SiCH3H3, a single precursor with a Si:C ratio of 1:1, and H2. Hexagonal SiC films were obtained with the aid of a remote H2 plasma, which also increased the deposition rate through a reduction in the activation enthalpy. The films were characterized by means of transmission electron microscopy, single- and double-crystal X-ray diffraction, infra-red absorption, ellipsometry, thickness measurements, four-point probe measurements, and other methods. Based on X-ray diffractometry, the crystalline quality of our β-SiC films is equivalent to that of commercial films of similar thickness. We describe the novel growth apparatus and the properties of the films.

Characterization of LPCVD of Silicon Nitride in a Rapid Thermal Processor

1989 ◽  
Vol 146 ◽  
Author(s):  
F. Scott Johnson ◽  
Roderick M. Miller ◽  
Mehmet C. Öztüirk ◽  
Jimmie J. Wortman
Keyword(s):  
Chemical Vapor Deposition ◽  
Silicon Nitride ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Electrical Characteristics ◽  
Deposition Rates ◽  
Silicon Nitride Films ◽  
Tube Furnaces ◽  
Pressure Chemical

ABSTRACTLow pressure chemical vapor deposition of silicon nitride has been studied using a cold-walled, lamp heated, rapid thermal processor. Films were deposited at low presure using both silane and dichlorosilane, diluted in hydrogen and argon carrier gasses. The dichlorosilane and ammonia reaction was found to be unsuitable for use in the cold-walled system. Rapid thermal chemical vapor depositions using silane and ammonia did not result in “bullseye” non-uniformities reported for low presure depositions in conventional hot-walled tube furnaces. Ammonia to silane ratios of 120:1 were found to result in stoichiometric silicon nitride films. Deposition rates are well suited for dielectricapplications. Electrical characteristics are comparable to those of films deposited using APCVD and LPCVD methods.

Effects of secondary pretreatments of substrate on the nucleation of diamond film

1996 ◽  
Vol 11 (7) ◽  
pp. 1787-1794 ◽  
Author(s):  
W. S. Yang ◽  
Jung Ho Je
Keyword(s):  
Plasma Etching ◽  
Chemical Etching ◽  
Diamond Powder ◽  
Structural Defects ◽  
Nucleation Density ◽  
Diamond Nucleation ◽  
Si Substrates ◽  
Nucleation Sites ◽  
Wet Chemical ◽  
Wet Chemical Etching

The effects of secondary pretreatments on diamond nucleation were investigated for the Si substrates pretreated by the diamond abrasion. When the substrate was just abraded with diamond powder, the nucleation density of diamond was 7 × 108/cm2. However, the nucleation density was found to be greatly decreased by various secondary pretreatments except by one wet chemical etching method. The nucleation density was reduced to 3 × 107/cm2 by the chemical etching (I), to 7 × 106/cm2 by the H2 plasma etching, and to ∼104/cm2 by the Ar sputtering, or O2 plasma etching. It was very slightly reduced to 3 × 108/cm2 by the chemical etching (II). The effects of secondary pretreatments in reducing the nucleation density were found to be very closely related to the removal of diamond seeds rather than topographic sites or structural defects. Therefore, diamond seeds generated by the diamond abrasion are considered as the main nucleation sites of diamond.

scholarly journals Large-area synthesis of monolayer MoSe2 films on SiO2/Si substrates by atmospheric pressure chemical vapor deposition

RSC Advances ◽  
2017 ◽  
Vol 7 (45) ◽  
pp. 27969-27973 ◽  
Author(s):  
Yu Zhao ◽  
Hyunjea Lee ◽  
Woong Choi ◽  
Weidong Fei ◽  
Cheol Jin Lee
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Atmospheric Pressure ◽  
Chemical Vapor ◽  
Large Area ◽  
Si Substrates ◽  
Pressure Chemical

We report the synthesis of large-area monolayer MoSe2 films extended up to a millimeter scale on SiO2/Si substrates by atmospheric pressure chemical vapor deposition (CVD).

Epitaxial Monocrystalline SiC Films Grown on Si by Low-Pressure Chemical Vapor Deposition at 750°C

1992 ◽  
Vol 242 ◽  
Author(s):  
I. Golecki ◽  
F. Reidinger ◽  
J. Marti
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Low Pressure ◽  
Double Crystal ◽  
X Ray ◽  
Si Substrates ◽  
Pressure Chemical ◽  
Means Of Transmission ◽  
Sic Films

ABSTRACTMonocrystalline, epitaxial cubic (100) SiC films have been grown on monocrystalline (100) Si substrates at 750°C, the lowest epitaxial growth temperature reported to date. The films were grown by low-pressure chemical vapor deposition, using methylsilane, SiCH3H3, a single precursor with a Si:C ratio of 1:1, and H2. The films were characterized by means of transmission electron microscopy, single- and double-crystal X-ray diffraction, infra-red absorption, ellipsometry, thickness measurements, four-point probe measurements, and other methods. Based on X-ray diffractometry, the crystalline quality of our films is equivalent to that of commercial films of similar thickness. We describe the novel growth apparatus used in this study and the properties of the films.

Raman Scattering Studies of Si1−xGex Layers Grown by Atmospheric Pressure Chemical Vapor Deposition

1992 ◽  
Vol 281 ◽  
Author(s):  
C. H. Perry ◽  
Feng Lu ◽  
F. Namavar ◽  
N. L. Rowell
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Atmospheric Pressure ◽  
Quantitative Measure ◽  
Chemical Vapor ◽  
Rocking Curve ◽  
Si Substrates ◽  
Pressure Chemical ◽  
Characterization Studies ◽  
Highly Strained

ABSTRACTRoom temperature Raman spectra are reported of Si1−xGex layers on Si substrates (for 0.08≤x≤0.2). The samples were grown using atmospheric pressure chemical vapor deposition techniques. Layer thicknesses varied from 0.1 — 10μm. The relative frequency shift of the Si-Si phonon mode for the SiGe strained epilayers from an incommensurate pseudo-alloy of the same composition is used as a quantitative measure of the lattice strain. For thicknesses below a critical value the Raman data indicate that the films are highly strained and the growth is commensurate with the substrate whereas thicker films are partially or fully relaxed. Phonon lines are sensitive to the interfaces and alloy layers. The results are consistent with other characterization studies, such as TEM and X-ray rocking curve measurements, of the same samples.

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