scholarly journals Tailoring the Crystallographic Texture and Electrical Properties of Inkjet-printed Interconnects for Use in Microelectronics

2011 ◽  
Vol 1335 ◽  
Author(s):  
Romain Cauchois ◽  
Mohamed Saadaoui ◽  
Karim Inal ◽  
Beatrice Dubois-Bonvalot ◽  
Jean-Christophe Fidalgo
Keyword(s):  
Low Cost ◽  
Gold Wire ◽  
Electronics Packaging ◽  
Fiber Texture ◽  
Bonding Process ◽  
Process Step ◽  
Gold Thin Film ◽  
Microelectronic Devices ◽  
Electrical Interconnects ◽  
Sintering Condition

ABSTRACTIn this paper, silver nanoparticles with a mean diameter of 40 nm are studied for future applications in microelectronic devices. The enhanced diffusivity of nanoparticles is exploited to fabricate electrical interconnects at low temperature. Sintering condition has been tuned to tailor the grain size so that electrical resistivity can be lowered down to 3.4 μOhm∙cm. In this study, a {111}-textured gold thin film has been used to increase diffusion routes. The combined effects of the substrate crystalline orientation and the sintering condition have been demonstrated to have a significant impact on microstructures. In particular, a {111} fiber texture is developed above 300°C in printed silver only if the underlying film exhibits a preferential orientation. This condition appeared as essential for the efficiency of the gold wire-bonding process step. Thus, inkjet-printed interconnects show a prospective potential compared to conventional subtractive technique and offers new opportunities for low cost metallization in electronics packaging.

scholarly journals Thermoplastic Elastomer (TPE)–Poly(Methyl Methacrylate) (PMMA) Hybrid Devices for Active Pumping PDMS-Free Organ-on-a-Chip Systems

Biosensors ◽  
2021 ◽  
Vol 11 (5) ◽  
pp. 162
Author(s):  
Mathias Busek ◽  
Steffen Nøvik ◽  
Aleksandra Aizenshtadt ◽  
Mikel Amirola-Martinez ◽  
Thomas Combriat ◽  
...  
Keyword(s):  
Methyl Methacrylate ◽  
Drug Testing ◽  
Low Cost ◽  
Thermoplastic Elastomer ◽  
Bonding Process ◽  
Cell Alignment ◽  
Poly Methyl Methacrylate ◽  
Bonding Parameters ◽  
Organ On A Chip ◽  
Hybrid Devices

Polydimethylsiloxane (PDMS) has been used in microfluidic systems for years, as it can be easily structured and its flexibility makes it easy to integrate actuators including pneumatic pumps. In addition, the good optical properties of the material are well suited for analytical systems. In addition to its positive aspects, PDMS is well known to adsorb small molecules, which limits its usability when it comes to drug testing, e.g., in organ-on-a-chip (OoC) systems. Therefore, alternatives to PDMS are in high demand. In this study, we use thermoplastic elastomer (TPE) films thermally bonded to laser-cut poly(methyl methacrylate) (PMMA) sheets to build up multilayered microfluidic devices with integrated pneumatic micro-pumps. We present a low-cost manufacturing technology based on a conventional CO2 laser cutter for structuring, a spin-coating process for TPE film fabrication, and a thermal bonding process using a pneumatic hot-press. UV treatment with an Excimer lamp prior to bonding drastically improves the bonding process. Optimized bonding parameters were characterized by measuring the burst load upon applying pressure and via profilometer-based measurement of channel deformation. Next, flow and long-term stability of the chip layout were measured using microparticle Image Velocimetry (uPIV). Finally, human endothelial cells were seeded in the microchannels to check biocompatibility and flow-directed cell alignment. The presented device is compatible with a real-time live-cell analysis system.

Magnetostrictive Fe-Ga Wires with Fiber Texture

2008 ◽  
Vol 1129 ◽  
Author(s):  
Shannon Patrick Farrell ◽  
Patti E. Quigley ◽  
Kyle J. Avery ◽  
Tim D. Hatchard ◽  
Stephanie E Flynn ◽  
...  
Keyword(s):  
Crystallographic Texture ◽  
Low Cost ◽  
Annealing Treatment ◽  
Cost Effective ◽  
Fiber Texture ◽  
Saturation Field ◽  
Energy Harvesters ◽  
Cost Effective Approach ◽  
Wire Method ◽  
Deformation Processes

AbstractRecently, low-cost processing approaches that produce textured thin bodies have engendered interest as cost-effective approaches for fabrication of magnetostrictive Fe-Ga alloys. In particular, wire-forming methods that strictly control the solidification direction could lead to some measure of crystallographic texture control. This is critical for development of large magnetostriction in polycrystals and for use of the alloys in actuators, sensors, energy harvesters and other systems. Magnetostrictive Fe-Ga wires have been prepared using an innovative cost-effective approach – based on the Taylor wire method – that combines rapid solidification and deformation processes. The procedure for making magnetostrictive wires is discussed and the wires are evaluated in terms of microstructure, crystallographic texture and magnetostriction. Results show that the Taylor-based approach is an effective and versatile means to draw 1-3 mm diameter textured Fe-Ga wire. Experimentation on the influence of drawing technique and quench conditions on texture development resulted with production of a strong <100> fiber texture in the Fe-Ga wire. Magnetostriction measurements, in the absence of prestress, indicated a maximum magnetostriction of ˜165 ppm in a saturation field of less than 200 mTesla. This is considered a significant strain for bulk polycrystalline Fe-Ga alloys without a pre-stress or a stress-annealing treatment. The unique properties of wires made with the Taylor-based approach coupled with the low intrinsic cost make this an attractive approach for production of textured magnetostrictive wire for a variety of applications.

Chemical selective coating of nickel / palladium / gold metallization on screen-printed thick film on LTCC and Al2O3 ceramic for high temperature applications

2012 ◽  
Vol 2012 (CICMT) ◽  
pp. 000334-000338
Author(s):  
Jens Müller ◽  
Thomas Mache ◽  
Torsten Thelemann
Keyword(s):  
High Temperature ◽  
Thick Film ◽  
Low Cost ◽  
Gold Wire ◽  
Wire Bonding ◽  
Pure Gold ◽  
Al2o3 Ceramic ◽  
Selective Coating ◽  
Silver Palladium ◽  
Silver Silver

Electroless plating on silver is a low cost alternative to printing of mixed metals or pure gold paste systems on LTCC. It overcomes the necessity to have material transitions from inner to outer layers or from conductor lines to wire bonding- or solder-pads. Since no commercial process and material set for silver thick film conductors has been available on the market a proprietary Ni/Pd/Au coating technology was developed for the use on silver inks for LTCC and Al2O3-ceramic as a base for both soldering and wire bonding. The work included the screening of different chemicals as well as several silver paste systems from two commercial vendors. Conductor adhesion, plating layer thicknesses, plating accuracy, (lead free) solderability and gold wire-bondability were assessed to optimize the process. Layers of about 5 microns Ni, (0.1 to 0.3) microns Pd and (0.05 to 0.15) microns Au were electrolessly deposited. The developed Ni-Pd-Au finish is an economical alternative with only about a quarter of the cost compared to the conventional use of silver, silver / palladium and gold compounds for ceramic substrates. This technology allows coating of the structures down to a fine pad size of 200×200 microns and a minimum line width of 100 microns, without reducing the adhesion mechanism between thick-film metallization and ceramic substrate. By covering of pure conductors with high temperature glass or dielectrics, further material saving is possible. Besides, the process offers also very good coating of structures in cavities.

Stress Analysis under Cu Bump Bonding Process

2012 ◽  
Vol 217-219 ◽  
pp. 2317-2321 ◽  
Author(s):  
Chun Yue Huang ◽  
Ying Liang ◽  
Song Wu ◽  
Tian Ming Li
Keyword(s):  
Stress Distribution ◽  
Flip Chip ◽  
Mechanical Performance ◽  
Copper Wire ◽  
Low Cost ◽  
Element Model ◽  
Bonding Process ◽  
Bonding Pressure ◽  
Shaping Process ◽  
Set Up

The copper wire has some advantages in thermal performance, mechanical performance, and low cost, which make it can provide the lowest cost flip-chip(FC) package for low I/O density device. The 2D Cu stud bump finite element model was set up by using ANSYS/LS-DYNA with LOLID162 element to dynamic simulate the Cu stud bump bonding shaping process. The stress distribution in the Cu stud bump and the pad during the bonding process were studied, and the influence of pad thickness on the stress distribution of Si chip was also analyzed. The results shows that under the bonding process the Cu bump height is mainly influenced by the bonding pressure and the top shape of the Cu bump is influenced by ultrasonic energy, the increase of pad thickness results in reducing stress concentration inside the Si chip.

On-Site Monitoring of Steroid Hormones in Environmental Waters with a Low-Cost, Integrated Polymer Lab-on-Chip Device

2013 ◽  
Vol 448-453 ◽  
pp. 396-401
Author(s):  
Nuno Miguel Matos Pires ◽  
Tao Dong
Keyword(s):  
Steroid Hormones ◽  
Optical Sensors ◽  
Water Samples ◽  
Low Cost ◽  
Cost Effective ◽  
Environmental Water ◽  
Lab On Chip ◽  
Gold Thin Film ◽  
Site Monitoring ◽  
On Chip

Routine analysis of steroid hormones in environmental water samples demands for cost-effective tools that can detect multiple targets simultaneously. This study reports a high-throughput polymer platform integrated to polymer optical sensors for on-site monitoring of hormones in water. This opto-microfluidic device concept is fully compatible to low-cost fabrication methods. A competitive chemiluminescence immunoassay was performed onto gold thin film coated chambers, and a detection resolution of roughly 0.2 ng/mL was obtained using 17β-estradiol as the model target. Furthermore, the integrated polymer platform showed good recovery for the estradiol target when spiked in surface water samples.

Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag2O for Packaging of High-Temperature Electronics

2012 ◽  
Vol 706-709 ◽  
pp. 2962-2967 ◽  
Author(s):  
Akio Hirose ◽  
Naoya Takeda ◽  
Yosuke Konaka ◽  
Hiroaki Tatsumi ◽  
Yusuke Akada ◽  
...  
Keyword(s):  
Low Temperature ◽  
Ag Nanoparticles ◽  
Electronics Packaging ◽  
Bonding Process ◽  
Low Temperature Sintering ◽  
High Melting Point ◽  
Organic Nanoparticles ◽  
High Temperature Electronics ◽  
Low Temperature Bonding

A novel bonding process using Ag2O paste composed of Ag2O particles and a reducing agent has been proposed as a Pb-free alternative of high melting point solders in electronics packaging. Ag2O paste formed Ag nanoparticles through the redox reaction in the bonding process and in-situ formed Ag nanoparticles sintered immediately. While the bonding process using Ag metallo-organic nanoparticles, which have been proposed, was unfavorable to the bonding at 250 degree Celsius or lower in terms of requiring removal of stable organic shells, the bonding process using Ag2O paste demonstrated the possibility of further low-temperature bonding.

Fabrication of Nanochannels on Polymer Thin Film

2009 ◽  
Author(s):  
Vinh-Nguyen Phan ◽  
Patrick Abgrall ◽  
Nam-Trung Nguyen ◽  
Peige Shao ◽  
Jeroen Anton Van Kan
Keyword(s):  
Thin Film ◽  
Low Cost ◽  
Base Material ◽  
Hot Embossing ◽  
Bonding Process ◽  
Thermal Bonding ◽  
Polymer Thin Film ◽  
Silicon Mold ◽  
Wide Range ◽  
Temperature And Pressure

Recent advances in nanotechnology allow the fabrication of structures down to the nanometer range. Various theoretical and experimental studies on the characteristics of fluid in nanochannels have been carried out in recent years. The results show that transport phenomena in nanoscale promise a wide range of applications in biological and chemical analysis. Practical applications require fabrication of nanochannels with a short production time and at a low cost. Polymer is considered as a suitable material for mass production of nanochannels due to the wide range of properties available, as well as the low cost of material and fabrication process. This paper reports the fabrication of planar nanochannels using hot embossing and thermal bonding technique on a polymer thin film. The mold for hot embossing was fabricated on a silicon wafer using photolithography and Reactive Ion Etching (RIE). Polymethylmethacrylate (PMMA) thin film with a thickness of 250 μm was used as the base material to emboss the nanochannels from the silicon mold. Temperature and pressure were controlled and recorded continuously during the embossing process. The channels then were examined by Atomic Force Microscope (AFM) in tapping mode to verify the width and the depth of the channel. Next, another piece of PMMA thin film was bonded to the first piece by thermal bonding process to make closed nanochannels. Temperature and pressure during the bonding process were controlled and recorded. Access to the channels was made on the thin film by a laser cutter before embossing. The results showed that open planar channels with the depth down to 30nm can be fabricated on PMMA thin film with a process time less than 30 minutes. Width and depth of the channels agree well with appropriate dimensions on the mold. Bonding can be achieved within 40 minutes. Closed planar channels with the depth of 300nm were fabricated successfully by a combination of embossing and thermal bonding processes. This project demonstrates the possibility of fabricating nanochannels with low cost and short processing time using polymer material. The processes are suitable not only for nanochannels but also for more complicated nanostructures. The presented technique allows the fabrication of nanodevices with various designs.

Investigation of Bond-Pad Etching Chemistries for Determination of Probe/Bonding Related Sub-Pad Cracks

2007 ◽  
Author(s):  
Valentina Korchnoy
Keyword(s):  
Comparative Analysis ◽  
Environmental Stress ◽  
Barrier Layer ◽  
High Reliability ◽  
Wire Bonding ◽  
Bonding Process ◽  
Microelectronic Devices ◽  
The Wire

Abstract Bond-pad integrity directly affects the performance of microelectronic devices. Bond-pad cracking and the related sub-pad cracking of Inter-Metal Dielectric (IMD) may introduce a high reliability risk and cause units to fail at environmental stress. Bond-pad cracks may be initiated by probing during wafer sort and the wire bonding process during assembly. This paper presents a comparative analysis of the various chemistries used for exposure and decoration of pad cracks. The investigation showed that a tri-iodine etch provides clean and artifact-free exposure of the TiN barrier layer of the pad and is the best (of the methods tried herein) for pad crack observation.

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