High-Performance Packaging of Power Electronics

MRS Bulletin ◽  
2003 ◽  
Vol 28 (1) ◽  
pp. 41-50 ◽  
Author(s):  
M. C. Shaw
Keyword(s):  
Heat Transfer ◽  
Solid State ◽  
Power Electronics ◽  
High Performance ◽  
Materials Science ◽  
State Of The Art ◽  
State Power ◽  
Electronics Packaging ◽  
Current State ◽  
Interdisciplinary Process

AbstractPackaging of solid-state power electronics is a highly interdisciplinary process requiring knowledge of electronics, heat transfer, mechanics, and materials science. Consequently, there are numerous opportunities for innovations at the interfaces of these complementary fields. This article offers a perspective of the current state of the art and identifies six specific areas for materials-based research in power electronics packaging. The emphasis is on identifying the underlying physical relationships that link the performance of the power electronics system to the microstructure and architectural arrangement of the constituents.

scholarly journals Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging

2020 ◽  
Vol 143 (1) ◽  
Author(s):  
Jae Choon Kim ◽  
Zongqing Ren ◽  
Anil Yuksel ◽  
Ercan M. Dede ◽  
Prabhakar R. Bandaru ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
High Performance ◽  
State Of The Art ◽  
Electronics Packaging ◽  
The State ◽  
Future Research ◽  
Conductive Heat ◽  
Recent Advances ◽  
Conventional Cooling

Abstract Thermal metamaterials exhibit thermal properties that do not exist in nature but can be rationally designed to offer unique capabilities of controlling heat transfer. Recent advances have demonstrated successful manipulation of conductive heat transfer and led to novel heat guiding structures such as thermal cloaks, concentrators, etc. These advances imply new opportunities to guide heat transfer in complex systems and new packaging approaches as related to thermal management of electronics. Such aspects are important, as trends of electronics packaging toward higher power, higher density, and 2.5D/3D integration are making thermal management even more challenging. While conventional cooling solutions based on large thermal-conductivity materials as well as heat pipes and heat exchangers may dissipate the heat from a source to a sink in a uniform manner, thermal metamaterials could help dissipate the heat in a deterministic manner and avoid thermal crosstalk and local hot spots. This paper reviews recent advances of thermal metamaterials that are potentially relevant to electronics packaging. While providing an overview of the state-of-the-art and critical 2.5D/3D-integrated packaging challenges, this paper also discusses the implications of thermal metamaterials for the future of electronic packaging thermal management. Thermal metamaterials could provide a solution to nontrivial thermal management challenges. Future research will need to take on the new challenges in implementing the thermal metamaterial designs in high-performance heterogeneous packages to continue to advance the state-of-the-art in electronics packaging.

Power Electronics in an Undergraduate Curriculum

1975 ◽  
Vol 12 (4) ◽  
pp. 303-308 ◽  
Author(s):  
W. Oghanna
Keyword(s):  
Solid State ◽  
Power Electronics ◽  
Electrical Engineering ◽  
State Power ◽  
Undergraduate Curriculum ◽  
Engineering Curriculum ◽  
Contact Hours

This paper establishes the need for a course in Solid-State Power Electronics in the undergraduate electrical engineering curriculum. The appropriate level and duration of a suitable course are discussed and contact hours are recommended from experience with an existing course. A suggested course outline is provided.

Solid-state power electronics in the U.S.A.

IEEE Spectrum ◽  
1969 ◽  
Vol 6 (10) ◽  
pp. 49-59 ◽  
Author(s):  
H. F. Storm
Keyword(s):  
Solid State ◽  
Power Electronics ◽  
State Power

High-performance computing systems: Status and outlook

Acta Numerica ◽  
2012 ◽  
Vol 21 ◽  
pp. 379-474 ◽  
Author(s):  
J. J. Dongarra ◽  
A. J. van der Steen
Keyword(s):  
High Performance Computing ◽  
High Performance ◽  
State Of The Art ◽  
Computing Systems ◽  
Future Developments ◽  
Steady Growth ◽  
Current State ◽  
Near Future ◽  
Performance Computing ◽  
Shed Light

This article describes the current state of the art of high-performance computing systems, and attempts to shed light on near-future developments that might prolong the steady growth in speed of such systems, which has been one of their most remarkable characteristics. We review the different ways devised to speed them up, both with regard to components and their architecture. In addition, we discuss the requirements for software that can take advantage of existing and future architectures.

scholarly journals High-Performance Emerging Solid-State Memory Technologies

MRS Bulletin ◽  
2004 ◽  
Vol 29 (11) ◽  
pp. 805-813 ◽  
Author(s):  
Herb Goronkin ◽  
Yang Yang
Keyword(s):  
Solid State ◽  
Research And Development ◽  
High Performance ◽  
New Technologies ◽  
State Of The Art ◽  
Electronic Equipment ◽  
Private Industry ◽  
Development Stages ◽  
The World ◽  
And Storage

AbstractThis article introduces the November 2004 issue of MRS Bulletin on the state of the art in solid-state memory and storage technologies.The memory business drives hundreds of billions of dollars in sales of electronic equipment per year. The incentive for continuing on the historical track outlined by Moore's law is huge, and this challenge is driving considerable investment from governments around the world as well as in private industry and universities. The problem is this: recognizing that current approaches to semiconductor-based memory are limited, what new technologies can be introduced to continue or even accelerate the pace of complexity? The articles in this issue highlight several commercially available memories, as well as memory technologies that are still in the research and development stages. What will become apparent to the reader is the huge diversity of approaches to this problem.

Advanced Laser Diode Cooling Concepts

2008 ◽  
Vol 1076 ◽  
Author(s):  
Ryan Feeler ◽  
Jeremy Junghans ◽  
Edward Stephens ◽  
Greg Kemner ◽  
Fred Barlow ◽  
...  
Keyword(s):  
Laser Diode ◽  
Thermal Performance ◽  
Materials Science ◽  
State Of The Art ◽  
Power Laser ◽  
Current State ◽  
Laser Diode Arrays ◽  
High Power Laser Diode ◽  
Better Than

ABSTRACTA new, patent-pending method of cooling high-power laser diode arrays has been developed which leverages advances in several areas of materials science and manufacturing. This method utilizes multi-layer ceramic microchannel coolers with small (100's of microns) integral water channels to cool the laser diode bar. This approach is similar to the current state-of-the-art method of cooling laser diode bars with copper microchannel coolers. However, the multi-layer ceramic coolers offer many advantages over the copper coolers, including reliability and manufacturing flexibility. The ceramic coolers do not require the use of deionized water as is mandatory of high-thermal-performance copper coolers.Experimental and modeled data is presented that demonstrates thermal performance equal to or better than copper microchannel coolers that are commercially available. Results of long-term, high-flow tests are also presented to demonstrate the resistance of the ceramic coolers to erosion. The materials selected for these coolers allow for the laser diode bars to be mounted using eutectic AuSn solder. This approach allows for maximum solder bond integrity over the life of the part.

Advanced Thermal Storage Fluids for Solar Parabolic Trough Systems

Solar Energy ◽  
2002 ◽  
Author(s):  
Luc Moens ◽  
Daniel M. Blake ◽  
Daniel L. Rudnicki ◽  
Mary Jane Hale
Keyword(s):  
Heat Transfer ◽  
Room Temperature ◽  
State Of The Art ◽  
Freezing Point ◽  
Operating Temperature ◽  
Heat Transfer Fluid ◽  
Parabolic Trough ◽  
New Class ◽  
Electricity Cost ◽  
Current State

It has been established that the development of a storage option and increasing the operating temperature for parabolic trough electric systems can significantly reduce the levelized electricity cost (LEC) compared to the current state of the art. Both improvements require a new heat transfer fluid that must have a very low vapor pressure at the hot operating temperature and combined with a high thermal stability, higher than 450°C. Further, the piping layout of trough plants dictates that the fluid not be allowed to freeze, which dictates the use of extensive insulation and heat tracing unless the fluid has a freezing point near 0°C. At present, it seems likely that this “ideal” fluid will have to be found among organic rather than inorganic salts. We are therefore investigating the chemical and thermal properties of ‘room temperature ionic liquids’ (RTILs) that hold much promise as a new class of heat transfer or storage fluids.

scholarly journals Pushing NMR sensitivity limits using dynamic nuclear polarization with closed-loop cryogenic helium sample spinning

2015 ◽  
Vol 6 (12) ◽  
pp. 6806-6812 ◽  
Author(s):  
E. Bouleau ◽  
P. Saint-Bonnet ◽  
F. Mentink-Vigier ◽  
H. Takahashi ◽  
J.-F. Jacquot ◽  
...  
Keyword(s):  
Solid State ◽  
Dynamic Nuclear Polarization ◽  
Solid State Nmr ◽  
Nuclear Polarization ◽  
Closed Loop ◽  
State Of The Art ◽  
Cryogenic Helium ◽  
Current State ◽  
Nmr Sensitivity

The cooler the better. We report a strategy to push the limits of solid-state NMR sensitivity far beyond its current state-of-the-art.

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