High Thermal Conductivity Silicon Nitride Ceramic

MRS Bulletin ◽  
2001 ◽  
Vol 26 (6) ◽  
pp. 451-455 ◽  
Author(s):  
Kiyoshi Hirao ◽  
Koji Watari ◽  
Hiroyuki Hayashi ◽  
Mikito Kitayama
Keyword(s):  
Thermal Conductivity ◽  
Silicon Nitride ◽  
Single Crystals ◽  
High Thermal Conductivity ◽  
Silicon Nitride Ceramic ◽  
Polycrystalline Ceramics ◽  
Thermal Conductivities

Since the confirmation that nonmetallic single crystals with a diamond-like structure, such as SiC, BP, and AlN, have high intrinsic thermal conductivities of over 300 W m−1 K−1,1,2 a great deal of effort has been focused on the development of nonoxide polycrystalline ceramics with high thermal conductivity.

scholarly journals Thermal conductivity of polycrystalline aluminum nitride (AlN) ceramics

Cerâmica ◽  
2004 ◽  
Vol 50 (315) ◽  
pp. 247-253 ◽  
Author(s):  
A. Franco Júnior ◽  
D. J Shanafield
Keyword(s):  
Thermal Conductivity ◽  
Aluminum Nitride ◽  
Single Crystal ◽  
Single Crystals ◽  
Conduction Mechanism ◽  
Sintering Process ◽  
Polycrystalline Aluminum ◽  
Polycrystalline Ceramics ◽  
Thermal Conductivities

In general, polycrystalline ceramics exhibit lower thermal conductivities than their associated single crystals. For instance, at 300K, the theoretical thermal conductivity of single crystal aluminum nitride (AlN) is 319 W/m-K, whereas, the values measured for polycrystalline AlN ceramics range from 17 W/m-K to 285 W/m-K. This variation is not unusual for polycrystalline ceramics. The variability is strongly dependent upon the purity of the starting materials and the details of sintering process. The process is important since it influences the microstructure and thus influences the conduction mechanism. In this paper we present the causes of this variation and how it can be controlled.

A Tough Silicon Nitride Ceramic with High Thermal Conductivity

2011 ◽  
Vol 23 (39) ◽  
pp. 4563-4567 ◽  
Author(s):  
You Zhou ◽  
Hideki Hyuga ◽  
Dai Kusano ◽  
Yu-ichi Yoshizawa ◽  
Kiyoshi Hirao
Keyword(s):  
Thermal Conductivity ◽  
Silicon Nitride ◽  
High Thermal Conductivity ◽  
Silicon Nitride Ceramic

The thermal conductivity of solid helium

1952 ◽  
Vol 214 (1119) ◽  
pp. 546-563 ◽  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Resistance ◽  
Single Crystals ◽  
Liquid Helium ◽  
Solid Helium ◽  
Boundary Scattering ◽  
Conductivity Measurements ◽  
Helium Ii ◽  
Characteristic Temperatures ◽  
Thermal Conductivities

The thermal conductivities of crystals of solid helium at densities between 0⋅194 and 0⋅218 g/cm 3 have been measured at liquid-helium temperatures. In order to interpret the results, the specific heat of solid helium at these densities has been measured from 0⋅6 to 1⋅4° K. The range of densities employed is sufficient to allow the observation of Debye characteristic temperatures varying by 40 %, and of thermal conductivities varying by factors of over 10. It is shown that the conductivity measurements are in accord with the ‘umklapp’ type of thermal resistance derived by Peierls (1929, 1935). Further work was restricted by the difficulty of obtaining good single crystals in narrow tubes, but measurements of the conductivity at one density were obtained down to 0⋅3° K. In this region the conductivity is limited by boundary scattering and is higher than that observed by other authors for liquid helium II at similar temperatures.

Preparation and Properties of Rigid Carbon Felt Thermal Insulation

2015 ◽  
Vol 833 ◽  
pp. 48-51 ◽  
Author(s):  
Wei Shi ◽  
Jia Yan Li ◽  
Qi Fan You ◽  
Tong Lu ◽  
Yi Tan
Keyword(s):  
Mechanical Properties ◽  
Thermal Conductivity ◽  
Compressive Strength ◽  
Thermal Insulation ◽  
Bending Strength ◽  
High Thermal Conductivity ◽  
Carbon Felt ◽  
Matrix Concentration ◽  
Thermal Conductivities

Matrix derived from resin after carbonization in rigid carbon felt thermal insulation has many advantages. The microstructures and properties of these materials were investigated in this paper. Results showed that matrix tend to accumulate at the intersections of fibers. This can improve mechanical properties and have a little influence on thermal conductivities of the composites. The excellent bending strength of 2.66MPa, compressive strength of 0.91MPa and a high thermal conductivity of 0.81W/(m·K) (at 1500°C) with a matrix concentration of 32.7% is achieved. However, high thermal conductivity is harmful for those materials which are used as thermal insulators.

Thermal-Wave Probing at Various Spatial Scales

MRS Bulletin ◽  
2001 ◽  
Vol 26 (6) ◽  
pp. 465-470 ◽  
Author(s):  
Danièle Fournier
Keyword(s):  
Thermal Conductivity ◽  
Single Crystal ◽  
Grain Boundaries ◽  
Thermal Wave ◽  
Spatial Scales ◽  
High Thermal Conductivity ◽  
Heterogeneous Microstructures ◽  
Thermal Conductivities

In recent years, high thermal conductivity has been found in materials with heterogeneous microstructures, that is, ceramics and films with granular microstructures having different phases. Understanding the thermal conductivities and microstructures of these materials is more difficult, however, than in the case of single-crystal materials because they consist of grains and grain boundaries.

Fracture Resistance Behavior of High-Thermal-Conductivity Silicon Nitride Ceramics

2013 ◽  
Vol 11 (5) ◽  
pp. 872-882 ◽  
Author(s):  
You Zhou ◽  
Tatsuki Ohji ◽  
Hideki Hyuga ◽  
Yu-ichi Yoshizawa ◽  
Norimitsu Murayama ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Silicon Nitride ◽  
Fracture Resistance ◽  
High Thermal Conductivity ◽  
Nitride Ceramics
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