Mechanical characterization of a bonded tailorable coefficient of thermal expansion lattice with near optimal performance

2018 ◽  
Vol 33 (20) ◽  
pp. 3383-3397 ◽  
Author(s):  
Jonathan B. Berger ◽  
Robert M. McMeeking
Keyword(s):  
Thermal Expansion ◽  
Mechanical Characterization ◽  
Coefficient Of Thermal Expansion ◽  
Optimal Performance ◽  
Image Position

Abstract

Investigation of micro-yield strength and coefficient of thermal expansion of Al–Cu–Mg–Li–Sc–Ag alloys with various contents of Li

2019 ◽  
Vol 34 (15) ◽  
pp. 2714-2726 ◽  
Author(s):  
Ruibin Yang ◽  
Junrui Yang ◽  
Kun Xie ◽  
Zhongxia Liu ◽  
Guotao Zhang
Keyword(s):  
Thermal Expansion ◽  
Yield Strength ◽  
Coefficient Of Thermal Expansion ◽  
Image Position

Abstract

scholarly journals Electrical and Mechanical Characterization of Li Ion Battery Electrode using PinPoint™ SSRM

2020 ◽  
Vol 28 (3) ◽  
pp. 48-53
Author(s):  
John Paul Pineda ◽  
Cathy Lee ◽  
Byong Kim ◽  
Keibock Lee
Keyword(s):  
Mechanical Characterization ◽  
Li Ion Battery ◽  
Battery Electrode ◽  
Li Ion ◽  
Image Position

Abstract

Transient and Residual Stresses and Displacements in Self-Curing Bone Cement—Part I: Characterization of Relevant Volumetric Behavior of Bone Cement

1982 ◽  
Vol 104 (1) ◽  
pp. 21-27 ◽  
Author(s):  
A. M. Ahmed ◽  
W. Pak ◽  
D. L. Burke ◽  
J. Miller
Keyword(s):  
Thermal Expansion ◽  
Residual Stresses ◽  
Bone Cement ◽  
Coefficient Of Thermal Expansion ◽  
Stress Generation ◽  
Curing Process ◽  
Cooling Phase ◽  
Volumetric Behavior ◽  
Fixation System

In this first part of a two-part report, some aspects of the volumetric behavior of bone cement during its curing process are examined as a prelude to an analysis for the transient and residual stresses and displacements in stem fixation systems. Experiments show that stress generation in the cement is associated with its temperature while curing and that during the cooling phase, the stresses are mainly due to thermal as opposed to bulk shrinkage. The appropriate coefficient of thermal expansion of bone cement has been evaluated from measurements in a simulated fixation system in conjunction with a thermoelastic analysis.

Synthesis of Ca-Al-Si-O Compounds from Local Wastes

2009 ◽  
Vol 620-622 ◽  
pp. 121-124
Author(s):  
U.Sangwanna Sanewirush ◽  
P. Saewong
Keyword(s):  
Thermal Conductivity ◽  
Thermal Expansion ◽  
Rice Husk Ash ◽  
Coefficient Of Thermal Expansion ◽  
Ternary Diagram ◽  
Alumina Ceramics ◽  
Calcium Aluminosilicate ◽  
Pulp Production ◽  
Aluminum Anodizing

The local wastes, which are sources of SiO2, Al2O3 and CaO, are rice husk ash, waste sediment from aluminum anodizing process and dreg from pulp production, respectively. The wastes are mixed in three different compositions in ranges of 20-50 SiO2, 20-35 CaO and 20-45 Al2O3, wet milled, slip casted and then fired at 1,100 °C. Characterization of the fired bodies reveals the formation of calcium-aluminosilicate compounds: gehlenite and anorthite as major phases, in accordance with the SiO2-CaO-Al2O3 ternary diagram. Their bulk densities and % water absorption lies between 0.95-1.42 g/cm3 and 37.40-67.95%, respectively. While flexural strength and coefficient of thermal expansion are between 4.09-9.56 MPa and 6.14 - 10.1 x 10-6 °C-1, respectively. By simple thermal conductivity comparison, the materials themselves have thermal conductivity comparable to alumina ceramics. These wastes, therefore, may be used as precursors for the production of some insulating refractory members, in place of minerals from natural resources.

scholarly journals A Comparative Study on the Characterization of Nanofibers with Cellulose I, I/II, and II Polymorphs from Wood

Polymers ◽  
2019 ◽  
Vol 11 (1) ◽  
pp. 153 ◽  
Author(s):  
Haiying Wang ◽  
Suiyi Li ◽  
Tiantian Wu ◽  
Xiaoxuan Wang ◽  
Xudong Cheng ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Comparative Study ◽  
Coefficient Of Thermal Expansion ◽  
Cellulose Nanofibers ◽  
High Yield ◽  
Chemical Extraction ◽  
Cellulose Content ◽  
Cellulose I ◽  
Aspect Ratios

Polymorphic changes in cellulose nanofibers (CNFs) are closely related to their properties and applications, and it is of interest to investigate how polymorphic changes influence their properties. A comparative study on the properties of CNFs with cellulose I, I/II, and II polymorphs from wood was conducted herein. CNFs were obtained by chemical extraction combined with a simple and efficient mechanical treatment (one pass through a grinder). This process resulted in a relatively high yield of 80–85% after a simple grinding treatment. The polymorphic changes in the CNFs and the chemical composition, morphology, tensile performances, and thermal properties were systematically characterized and compared. The X-ray diffraction and FTIR analyses verified the existence of three types of purified pulps and CNFs with cellulose I, cellulose I/II, and cellulose II polymorphs (CNF-I, CNF-I/II, CNF-II). Morphological observations presented that these three types of CNFs all exhibited high aspect ratios and entangled structures. Tensile testing showed that the CNF films all exhibited high tensile strengths, and the fracture strains of the CNF-I/II (11.8%) and CNF-II (13.0%) films were noticeably increased compared to those of the CNF-I film (6.0%). If CNF-II is used as reinforcing material, its larger fracture strain can improve the mechanical performance of the CNF composites, such as fracture toughness and impact strength. In addition, CNF-I, CNF-I/II, and CNF-II films showed very low thermal expansion in the range 20–150 °C, with the coefficient of thermal expansion values of 9.4, 17.1, and 17.3 ppm/K, respectively. Thermogravimetric analysis (TGA) revealed that the degradation temperature of CNF-I and CNF-II was greater than that of CNF-I/II, which was likely due to increased α-cellulose content. This comparative study of the characterization of CNF-I, CNF-I/II, and CNF-II provides a theoretical basis for the application of CNFs with different polymorphs and could broaden the applications of CNFs.

Characterization of Epoxy-Functionalized Silsesquioxanes as Potential Underfill Encapsulants

1998 ◽  
Vol 519 ◽  
Author(s):  
E. K. Lin ◽  
C. R. Snyder ◽  
F. I. Mopsik ◽  
W. E. Wallace ◽  
W. L. Wu ◽  
...  
Keyword(s):  
Thermal Expansion ◽  
Flip Chip ◽  
Coefficient Of Thermal Expansion ◽  
Silica Particles ◽  
Critical Parameters ◽  
Organic Hybrid ◽  
Solder Bumps ◽  
The Difference ◽  
Electronics Packages

AbstractIn electronics packaging, underfill encapsulants are needed to improve package reliability in flip-chip devices. The underfill generally consists of an epoxy resin highly filled with silica particles and is designed to reduce the stress arising from the difference in the thermal expansion between the solder bumps and the substrate. Currently, concerns about the flow of the silica particles and surface phenomena are arising as electronics packages reduce in size. Newly developed epoxy-functionalized octameric silsesquioxanes provide an intriguing alternative to current formulations. These single-phase inorganic/organic hybrid materials may have properties similar to filled materials without the complications from the rheology of filled materials. The physical properties of the functionalized silsesquioxanes are measured with respect to the critical parameters for underfill materials. Measurements of properties such as the coefficient of thermal expansion and density are performed to evaluate the suitability of these materials as potential underfill encapsulants.

scholarly journals Inverse problems in the mechanical characterization of elastic arteries

MRS Bulletin ◽  
2015 ◽  
Vol 40 (4) ◽  
pp. 317-323 ◽  
Author(s):  
Claire Morin ◽  
Stéphane Avril
Keyword(s):  
Inverse Problems ◽  
Mechanical Characterization ◽  
Image Position

Abstract

Processing, Microstructure, and Thermal Expansion Measurements for High Temperature Ru-Al-Cr B2 Alloys

2008 ◽  
Vol 1128 ◽  
Author(s):  
Yutaka Hashimoto ◽  
Norihiko L. Okamoto ◽  
Manuel Acosta ◽  
David R Johnson ◽  
Haruyuki Inui
Keyword(s):  
Thermal Expansion ◽  
High Temperature ◽  
Room Temperature ◽  
Coefficient Of Thermal Expansion ◽  
Directionally Solidified ◽  
Average Value ◽  
Heat Treated ◽  
Structural Applications ◽  
Cr System

AbstractThe B2 intermetallic compound RuAl has a melting temperature above 2000 °C and is a candidate for high temperature structural applications. A large extension of the B2 phase field is found in the Ru-Al-Cr system as was documented by the characterization of arc-melted and heat treated alloys. Two compositions consisting of Ru-35Al-19Cr and Ru-20Al-38Cr (at. %) were directionally solidified in an optical floating zone furnace. Depending upon the processing conditions, single phase, polycrystalline, B2 microstructures could be produced. The coefficient of thermal expansion (CTE) was measured from room temperature to 1250 °C for the Ru-20Al-38Cr alloy, and an average value of 11×10-6 K-1 was found. Additionally, the thermal conductivity was measured as 27 W/mK at room temperature for the Ru-20Al-38Cr B2 alloy and as 89 W/mK for binary RuAl.

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