scholarly journals Residual stress in electrodeposited nanocrystalline nickel-tungsten coatings

2012 ◽  
Vol 27 (9) ◽  
pp. 1271-1284 ◽  
Author(s):  
Tiffany D. Ziebell ◽  
Christopher A. Schuh

Abstract

Wear ◽  
2018 ◽  
Vol 412-413 ◽  
pp. 136-143 ◽  
Author(s):  
M.V.N. Vamsi ◽  
Nitin P. Wasekar ◽  
G. Sundararajan

2008 ◽  
Author(s):  
H. Jarmakani ◽  
Y. M. Wang ◽  
E. Bringa ◽  
M. A. Meyers ◽  
Mark Elert ◽  
...  

2011 ◽  
Vol 27 (1) ◽  
pp. 121-125 ◽  
Author(s):  
Min-Jae Choi ◽  
Seung-Kyun Kang ◽  
Ingeun Kang ◽  
Dongil Kwon

Abstract


2019 ◽  
Vol 34 (08) ◽  
pp. 1395-1404 ◽  
Author(s):  
Jia Song ◽  
Liang Zhang ◽  
Wenheng Wu ◽  
Beibei He ◽  
Xiaoqing Ni ◽  
...  

Abstract


2002 ◽  
Vol 740 ◽  
Author(s):  
Christopher A. Schuh ◽  
T. G. Nieh

ABSTRACTThe breakdown of classical Hall-Petch scaling remains an area of scientific interest, and will govern the limiting strength of nanocrystalline alloys for structural applications. In this work we discuss the hardness and scratch resistance of nanocrystalline nickel and nickel-tungsten solid solution alloys, assessed through nanoindentation and nano-scratch techniques. The materials have been prepared by electrodeposition, and are fully dense with grain sizes between 6 and 22 nm. In this range of grain sizes, there is some evidence for a breakdown of Hall-Petch scaling, reflected in both the hardness and abrasion data. The role of solid solution alloying on this breakdown is also discussed.


2015 ◽  
Vol 30 (8) ◽  
pp. 1078-1089 ◽  
Author(s):  
Lei Shen ◽  
Yuming He ◽  
Dabiao Liu ◽  
Qiang Gong ◽  
Bo Zhang ◽  
...  

Abstract


2013 ◽  
Vol 28 (13) ◽  
pp. 1813-1819 ◽  
Author(s):  
K.A. Darling ◽  
L.J. Kecskes ◽  
M. Atwater ◽  
J. Semones ◽  
R.O. Scattergood ◽  
...  


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