Effects of stacking fault energy on the thermal stability and mechanical properties of nanostructured Cu–Al alloys during thermal annealing

2011 ◽  
Vol 26 (3) ◽  
pp. 407-415 ◽  
Author(s):  
X.H. An ◽  
S. Qu ◽  
S.D. Wu ◽  
Z.F. Zhang
Keyword(s):  
Mechanical Properties ◽  
Thermal Stability ◽  
Thermal Annealing ◽  
Al Alloys ◽  
Stacking Fault ◽  
Stacking Fault Energy ◽  
Image Position

Abstract

Thermal stability of sputtered copper films containing dilute insoluble tungsten: Thermal annealing study

2003 ◽  
Vol 18 (6) ◽  
pp. 1429-1434 ◽  
Author(s):  
C. H. Lin ◽  
J. P. Chu ◽  
T. Mahalingam ◽  
T. N. Lin ◽  
S. F. Wang
Keyword(s):  
Thermal Stability ◽  
Thermal Annealing ◽  
Stacking Fault ◽  
Stacking Fault Energy ◽  
Silicide Formation ◽  
Copper Silicide ◽  
Cu Films ◽  
Cu Film ◽  
Pure Cu ◽  
Thermal Stability Of

This paper describes studies on the thermal annealing behavior of Cu films with 2.3 at.% W deposited on Si substrates. The magnetron cosputtered Cu films with insoluble W were vacuum annealed at temperatures ranging from 200 to 800 °C. Twins were observed in focused ion beam and transmission electron microscopy images of as-deposited and 400 °C annealed pure Cu film, and these twins were attributed to the intrinsic low stacking fault energy. Twins in pure Cu film may provide an additional diffusion path during annealing for copper silicide formation. The beneficial effect of W on the thermal stability of Cu film was supported by the following observations: (i) x-ray diffraction studies show that Cu4Si was formed at 530 °C in Cu–W film, whereas pure Cu film exhibited Cu4Si growth at 400 °C; (ii) shallow diffusion profiles for Cu into Si in Cu–W film through secondary ion mass spectroscopy analyses, and the high activation energy needed for the copper silicide formation from the differential scanning calorimetry study; (iii) addition of W in Cu film increases the stacking fault energy and results in a low twin density.

Role of stacking fault energy and strain rate in strengthening of Cu and Cu–Al alloys

2014 ◽  
Vol 29 (16) ◽  
pp. 1747-1754 ◽  
Author(s):  
Baozhuang Cai ◽  
Yan Long ◽  
Cuie Wen ◽  
Yulan Gong ◽  
Caiju Li ◽  
...  
Keyword(s):  
Strain Rate ◽  
Al Alloys ◽  
Stacking Fault ◽  
Stacking Fault Energy ◽  
Image Position

Abstract

Structural features and strength behavior of TRIP/TWIP steels

2020 ◽  
pp. 5-18
Author(s):  
D. V. Prosvirnin ◽  
◽  
M. S. Larionov ◽  
S. V. Pivovarchik ◽  
A. G. Kolmakov ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Chemical Composition ◽  
Thermomechanical Processing ◽  
Maximum Load ◽  
Structural Features ◽  
Stacking Fault ◽  
Stacking Fault Energy ◽  
Structural And Functional Properties ◽  
Twip Steels ◽  
The Creation

A review of the literature data on the structural features of TRIP / TWIP steels, their relationship with mechanical properties and the relationship of strength parameters under static and cyclic loading was carried out. It is shown that the level of mechanical properties of such steels is determined by the chemical composition and processing technology (thermal and thermomechanical processing, hot and cold pressure treatment), aimed at achieving a favorable phase composition. At the atomic level, the most important factor is stacking fault energy, the level of which will be decisive in the formation of austenite twins and / or the formation of strain martensite. By selecting the chemical composition, it is possible to set the stacking fault energy corresponding to the necessary mechanical characteristics. In the case of cyclic loads, an important role is played by the strain rate and the maximum load during testing. So at high loading rates and a load approaching the yield strength under tension, the intensity of the twinning processes and the formation of martensite increases. It is shown that one of the relevant ways to further increase of the structural and functional properties of TRIP and TWIP steels is the creation of composite materials on their basis. At present, surface modification and coating, especially by ion-vacuum methods, can be considered the most promising direction for the creation of such composites.

scholarly journals Effect of stacking fault energy on the restoration mechanisms and mechanical properties of friction stir welded copper alloys

2019 ◽  
Vol 162 ◽  
pp. 185-197 ◽  
Author(s):  
Akbar Heidarzadeh ◽  
Tohid Saeid ◽  
Volker Klemm ◽  
Ali Chabok ◽  
Yutao Pei
Keyword(s):  
Mechanical Properties ◽  
Copper Alloys ◽  
Stacking Fault ◽  
Stacking Fault Energy ◽  
Friction Stir

scholarly journals Correlation of Grain Size, Stacking Fault Energy, and Texture in Cu-Al Alloys Deformed under Simulated Rolling Conditions

2015 ◽  
Vol 2015 ◽  
pp. 1-12 ◽  
Author(s):  
Ehab A. El-Danaf ◽  
Mahmoud S. Soliman ◽  
Ayman A. Al-Mutlaq
Keyword(s):  
Grain Size ◽  
Strain Hardening ◽  
Mechanical Twinning ◽  
Al Alloys ◽  
Stacking Fault ◽  
Stacking Fault Energy ◽  
Wide Range ◽  
Orientation Density ◽  
Pure Cu ◽  
Strain Hardening Rate

The effect of grain size and stacking fault energy (SFE) on the strain hardening rate behavior under plane strain compression (PSC) is investigated for pure Cu and binary Cu-Al alloys containing 1, 2, 4.7, and 7 wt. % Al. The alloys studied have a wide range of SFE from a low SFE of 4.5 mJm−2for Cu-7Al to a medium SFE of 78 mJm−2for pure Cu. A series of PSC tests have been conducted on these alloys for three average grain sizes of ~15, 70, and 250 μm. Strain hardening rate curves were obtained and a criterion relating twinning stress to grain size is established. It is concluded that the stress required for twinning initiation decreases with increasing grain size. Low values of SFE have an indirect influence on twinning stress by increasing the strain hardening rate which is reflected in building up the critical dislocation density needed to initiate mechanical twinning. A study on the effect of grain size on the intensity of the brass texture component for the low SFE alloys has revealed the reduction of the orientation density of that component with increasing grain size.

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