Effect of in situ boron doping on properties of silicon germanium films deposited by chemical vapor deposition at 400 °C

2001 ◽  
Vol 16 (9) ◽  
pp. 2607-2612 ◽  
Author(s):  
Sherif Sedky ◽  
Ann Witvrouw ◽  
Annelies Saerens ◽  
Paul Van Houtte ◽  
Jef Poortmans ◽  
...  
Keyword(s):  
Silicon Germanium ◽  
Boron Concentration ◽  
Microelectromechanical Systems ◽  
Chemical Vapor ◽  
Oxide Semiconductor ◽  
Germanium Content ◽  
Seeding Layer ◽  
Glass Substrates ◽  
Transmission Electron

This paper reports on the role of boron in situ doping on enhancing crystallization of silicon germanium deposited at 400 °C and 2 torr. The dependence of growth rate on germanium content and boron concentration is investigated. The minimum boron concentration and the minimum germanium content required for crystallizing the as-grown layers is experimentally determined. The texture and grain microstructure of doped and undoped poly SiGe layers has been investigated by means of x-ray diffraction spectroscopy and transmission electron microscopy. The low deposition temperature coupled with the low tensile stress of the polycrystalline material enable postprocessing of surface micromachined microelectromechanical systems on top of standard complementry metal oxide semiconductor wafers with Al interconnects. Furthermore, the resistivity of the as-grown layers is as low as 1 mΩ cm, and hence, it can be used as a seeding layer for polycrystalline Si solar cells compatible with glass substrates.

Rapid Thermal Chemical Vapor Deposition of Polycrystalline Silicon-Germanium Films on SiO2 and Their Properties

1995 ◽  
Vol 403 ◽  
Author(s):  
V. Z-Q Li ◽  
M. R. Mirabedini ◽  
R. T. Kuehn ◽  
D. Gladden ◽  
D. Batchelor ◽  
...  
Keyword(s):  
Chemical Vapor Deposition ◽  
Vapor Deposition ◽  
Silicon Germanium ◽  
Deposition Temperature ◽  
Chemical Vapor ◽  
Grain Structure ◽  
Germanium Content ◽  
Thermal Chemical Vapor Deposition ◽  
Nucleation Sites

AbstractIn this work, polycrystalline SiGe has been viewed as an alternative gate material to polysilicon in single wafer processing for the deep submicrometer VLSI applications. We studied deposition of the silicon-germanium (SiGe) films with different germanium concentrations (up to 85%) on SiO2 in a rapid thermal chemical vapor deposition reactor using GeH4 and SiH4/H2 gas mixture with the temperature ranging from 550°C to 625°C. Since the SiGe RTCVD process is selective toward oxide and does not form nucleation sites on the oxide easily, an in-situ polysilicon flash technique is used to provide the necessary nucleation sites for the deposition of SiGe films with high germanium content. It was observed that with the in-situ polysilicon flash as a pre-nucleation seed, the SiGe deposited on SiO2 forms a continuous polycrystalline layer. Polycrystalline SiGe films of about 2000Å in thickness have a columnar grain structure with a grain size of approximately 1000Å. Compositional analyses from Auger Electron Spectroscopy (AES) and Rutherford backscattering (RBS) show that the high germanium incorporation in the SiGe films has a weak dependence on the deposition temperature. It is also noted that the germanium content across the film thickness is fairly constant which is a critical factor for the application of SiGe films as the gate material. Lastly, we found that the surface morphology of SiGe films become smoother at lower deposition temperature.

Characterization of Reduced-pressure Chemical Vapor Deposition Polycrystalline Silicon Germanium Deposited at Temperatures ≤550 °C

2002 ◽  
Vol 17 (7) ◽  
pp. 1580-1586 ◽  
Author(s):  
Sherif Sedky ◽  
Ann Witvrouw ◽  
Matty Caymax ◽  
Annelies Saerens ◽  
Paul Van Houtte
Keyword(s):  
Silicon Germanium ◽  
Deposition Temperature ◽  
Polycrystalline Silicon ◽  
Chemical Vapor ◽  
Complementary Metal Oxide Semiconductor ◽  
Oxide Semiconductor ◽  
Reduced Pressure ◽  
Germanium Content ◽  
Wafer Temperature ◽  
The Impact

This paper investigates the possibility of reducing the deposition temperature of polycrystalline silicon germanium to a level compatible with complementary metal-oxide semiconductor (CMOS) post processing. To achieve this goal, the exact wafer temperature during deposition was experimentally determined and it was found to be 30 °C lower than the reactor setting temperature. The deposition temperature was reduced from 625 to 500 °C. The impact of varying the deposition pressure from 10 to 760 torr and the germanium content from 15% to 100% was investigated. X-ray diffraction spectroscopy and transmission electron microscopy showed that the SixGe1−x films deposited at an actual wafer temperature of 520 °C are polycrystalline for germanium contents as low as 15%. Also, it was shown that the deposition conditions can be adjusted to yield a low tensile stress at an actual wafer temperature of 520 °C, which is suitable for integrating surface micromachined micro-electromechanical systems on top of standard CMOS wafers with Al interconnects.

In Situ Observation of Nucleation and Growth of Carbon Nanotubes from Iron Carbide Nanoparticles

2008 ◽  
Vol 1142 ◽  
Author(s):  
Hideto Yoshida ◽  
Seiji Takeda ◽  
Tetsuya Uchiyama ◽  
Hideo Kohno ◽  
Yoshikazu Homma
Keyword(s):  
Carbon Nanotubes ◽  
Iron Carbide ◽  
Bulk Diffusion ◽  
Chemical Vapor ◽  
Nucleation And Growth ◽  
Atomic Scale ◽  
In Situ Observation ◽  
Transmission Electron ◽  
Cvd Growth

ABSTRACTNucleation and growth processes of carbon nanotubes (CNTs) in iron catalyzed chemical vapor deposition (CVD) have been observed by means of in-situ environmental transmission electron microscopy. Our atomic scale observations demonstrate that solid state iron carbide (Fe3C) nanoparticles act as catalyst for the CVD growth of CNTs. Iron carbide nanoparticles are structurally fluctuated in CVD condition. Growth of CNTs can be simply explained by bulk diffusion of carbon atoms since nanoparticles are carbide.

scholarly journals Carbon-Involved Near-Surface Evolution of Cobalt Catalyst during Reaction: An in-situ Study

2020 ◽  
Author(s):  
Feng Yang ◽  
Haofei Zhao ◽  
Wu Wang ◽  
Qidong Liu ◽  
Xu Liu ◽  
...  
Keyword(s):  
Chemical Vapor ◽  
Carbon Diffusion ◽  
Deposition Process ◽  
Catalytic Performance ◽  
Surface Evolution ◽  
Near Surface ◽  
Co Catalysts ◽  
Transmission Electron ◽  
Walled Carbon Nanotubes

Abstract When carbon-containing species are involved in reactions catalyzed by transition metals at high temperature, the diffusion of carbon on/in catalysts dramatically influence the catalytic performance. Acquiring information on the carbon-diffusion-involved evolution of catalysts at atomic level is crucial for understanding the reaction mechanism yet also challenging. For the chemical vapor deposition process of single-walled carbon nanotubes (SWCNTs), we developed methodologies to record in-situ the near-surface structural and chemical evolution of Co catalysts with carbon permeation using an aberration-corrected environmental transmission electron microscope and the synchrotron X-ray absorption spectroscopy. The nucleation and growth of SWCNTs were linked with the partial carbonization of catalysts and the alternating dissolvement-precipitation of carbon in catalysts. The dynamics of carbon atoms in catalysts brings deeper insight into the growth mechanism of SWCNTs and also sheds light on inferring mechanisms of more reactions. The methodologies developed here will find broad applications in studying catalytic and other processes.

Design and Applications of Environmental Cell Transmission Electron Microscope for In Situ Observations of Gas–Solid Reactions

2001 ◽  
Vol 7 (6) ◽  
pp. 494-506 ◽  
Author(s):  
Renu Sharma
Keyword(s):  
Chemical Vapor ◽  
Atomic Level ◽  
Chemical Information ◽  
Oxidation Reduction ◽  
Transmission Electron ◽  
Recent Developments ◽  
Level Information ◽  
Resolution Imaging ◽  
Electron Energy Loss

AbstractThe environmental transmission electron microscopy (E-TEM) is a budding technique for in situ study of gas–solid chemical reactions with numerous applications. Recent improvements in the design have made it possible not only to obtain atomic level information but also the chemical information during the reaction by incorporating an imaging filter or electron energy-loss spectrometer to an E-TEM. We have been involved in modifying a couple of microscopes to incorporate environmental cells in order to convert them into E-TEMs. These microscopes have been used to obtain atomic level information of the structural and chemical changes during dynamic processes by in situ electron diffraction, high-resolution imaging, and electron energyloss spectroscopy. The applications include, but are not limited to, oxidation, reduction, polymerization, nitridation, dehydroxylation, hydroxylation, chemical vapor deposition, etc. We report recent developments in the design and application along with the limitations of an E-TEM.

Growth of Silicon-Germanium Alloys by Atmospheric-Pressure Chemical Vapor Deposition at Low Temperatures

1991 ◽  
Vol 220 ◽  
Author(s):  
P. D. Agnello ◽  
T. O. Sedgwick ◽  
M. S. Goorsky ◽  
J. Ott ◽  
T. S. Kuan ◽  
...  
Keyword(s):  
Silicon Germanium ◽  
Atmospheric Pressure ◽  
Chemical Vapor ◽  
Hole Mobility ◽  
Significant Feature ◽  
X Ray Diffraction ◽  
Transmission Electron ◽  
Pressure Chemical ◽  
Silicon Growth ◽  
Silicon Germanium Alloys

ABSTRACTDichlorosilanc and germane were used to grow silicon-germanium alloys at temperatures as low as 550°C at atmospheric pressure. Germanium mole fractions as high as 44% were obtained and the layers exhibit smooth surface morphology. Silicon-gcrmanium/silicon multilayers with abrupt hctero-intcrfaccs have been achieved. Cross Section Transmission Electron Microscopy, (XTEM) and High Resolution X-Ray Diffraction, (HRXRD) characterization of the hetero-interface abruptness will be presented. Recent results on two-dimensional (2-D) hole mobility structures grown by this technique will also be reported. Selective growth of silicon-germanium on oxide patterned silicon wafers was also demonstrated. A significant feature of the selective deposition is the lack of faceting at the oxide sidcwall, which has been commonly observed in high temperature silicon growth.

The Effect of Plasma Power on the Properties of Amorphous Silicon-Germanium Thin Films

2011 ◽  
Vol 317-319 ◽  
pp. 341-344
Author(s):  
Long Gu ◽  
Hui Dong Yang ◽  
Bo Huang
Keyword(s):  
Thin Films ◽  
Amorphous Silicon ◽  
Deposition Rate ◽  
Silicon Germanium ◽  
Structural Characteristics ◽  
Chemical Vapor ◽  
Plasma Power ◽  
Glass Substrates ◽  
Frequency Plasma ◽  
Amorphous Silicon Germanium

Amorphous Silicon-germanium films were prepared by radio frequency plasma enhanced chemical vapor deposition (RF-PECVD) on glass substrates. The structural characteristics, deposition rate, photosensitivity, and optical band gap of the silicon-germanium thin films were investigated with plasma power varying from 15W to 45W. The deposition rate increased within a certain range of plasma power. With the plasma power increasing, the photosensitivity of the thin films decreased. It is evident that varying the plasma power changes the deposition rate, photosensitivity, which was fundamentally crucial for the fabrication of a-Si/a-SiGe/a-SiGe stacked solar cells. For our deposition system, the most optimization value was 30-35W.

Low Temperature Silicon Epitaxial Growth by Plasma Enhanced Chemical Vapor Deposition From SiH4/He/H2

1991 ◽  
Vol 235 ◽  
Author(s):  
Yung-Jen Lin ◽  
Ming-Deng Shieh ◽  
Chiapying Lee ◽  
Tri-Rung Yew
Keyword(s):  
Electron Microscopy ◽  
Chemical Vapor Deposition ◽  
Epitaxial Growth ◽  
Vapor Deposition ◽  
Chemical Vapor ◽  
Ex Situ ◽  
Epitaxial Layers ◽  
Cross Sectional ◽  
Transmission Electron

ABSTRACTSilicon epitaxial growth on silicon wafers were investigated by using plasma enhanced chemical vapor deposition from SiH4/He/H2. The epitaxial layers were growm at temperatures of 350°C or lower. The base pressure of the chamber was greater than 2 × 10−5 Torr. Prior to epitaxial growth, the wafer was in-situ cleaned by H2 baking for 30 min. The epi/substrate interface and epitaxial layers were observed by cross-sectional transmission electron microscopy (XTEM). Finally, the influence of the ex-situ and in-situ cleaning processes on the qualities of the interface and epitaxial layers was discussed in detail.

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