Synthesis and processing of nanocrystalline Ag–Fe–Ni for low thermal expansion–high conductivity thermal management applications

2001 ◽  
Vol 16 (2) ◽  
pp. 340-343 ◽  
Author(s):  
J. Stolk ◽  
M. Gross ◽  
D. Stolk ◽  
A. Manthiram
Keyword(s):  
Electrical Conductivity ◽  
Thermal Expansion ◽  
Metal Ion ◽  
Coefficient Of Thermal Expansion ◽  
Thermomechanical Analysis ◽  
Nominal Composition ◽  
Two Phase ◽  
X Ray ◽  
Fine Grained ◽  
Low Thermal Expansion

Nanocrystalline Ag–Fe–Ni powders were produced by a reduction of the aqueous metal ion solutions with sodium borohydride and then converted to fine-grained silver–Invar alloys that offer attractive thermal, electrical, and mechanical properties. The samples were characterized by x-ray diffraction, scanning electron microscopy, wavelength dispersive x-ray spectrometry, thermomechanical analysis, microhardness measurements, and electrical conductivity measurements; thermal conductivity was estimated using the Wiedemann–Franz law. Sintering of a specimen with a nominal composition of 60 wt% Ag–25.6 wt% Fe–14.4 wt.% Ni led to the formation of a two-phase silver–Invar alloy with a grain size of approximately 2 μm, a hardness of 133 HK200g, coefficient of thermal expansion of 12.44 × 10−6 / °C, and electrical conductivity of 2.13 × 105 (Ω cm) −1.

Improving mechanical and thermal properties of graphite–aluminium composite using Si, SiC and eggshell particles

2019 ◽  
Vol 54 (17) ◽  
pp. 2365-2376 ◽  
Author(s):  
MO Durowoju ◽  
TB Asafa ◽  
ER Sadiku ◽  
S Diouf ◽  
MB Shongwe ◽  
...  
Keyword(s):  
Electrical Conductivity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Relative Density ◽  
Coefficient Of Thermal Expansion ◽  
Mechanical And Thermal Properties ◽  
Sem Images ◽  
Plasma Sintering ◽  
Low Thermal Expansion ◽  
Spark Plasma

Graphite–aluminium (Gr–Al) composites are being used for diverse engineering applications because of their light weight, good electrical conductivity and thermal properties. However, their applications are limited by high coefficient of thermal expansion and low microhardness values which can be enhanced by adding cheap and efficient fillers. This paper reports the effect of addition of eggshell (ES) particles on the properties of sintered Gr–Al-based composites. Five different composites (Gr–Al, Gr–Al  +  20 wt.%Si, Gr–Al + 20 wt.%SiC, Gr–Al + 20Si wt.% + 20 wt.%ES and Gr–Al + 20SiC wt.% + 20 wt.%ES) were sintered at a temperature of 540 ℃, holding time of 10 min, heating rate of 52 ℃/min and pressure of 50 MPa using spark plasma sintering system. The sintered samples were characterized based on morphology, microhardness, relative density, coefficient of thermal expansion and electrical conductivity. Based on SEM images, graphite particles of flake-like structure were largely undeformed while Al particles were smaller, round and irregular in shape and fairly uniformly distributed in the composites. The microhardness value of sintered Gr–Al + 20 wt.%SiC + 20 wt.%ES composite was 39.55 HV compared to 30.46 HV for Gr–Al, the least of the samples. The Gr–Al + 20 wt.%SiC + 20 wt.%ES composite also has a very low thermal expansion coefficient (0.98 × 10−5/K) but lowest electrical conductivity at temperature beyond 150 ℃. Highest densification and minimum relative density (94%) were obtained in Gr–Al + 20 wt.%Si + 20 wt.%ES composite. These enhanced performances are largely due to the incorporation of ES particles. This study therefore demonstrated that ESs particles enhanced microhardness and lowered thermal expansion of Gr–Al-based composites which have promising applications in industries especially for thermal management.

Studies of the Coefficient of Thermal Expansion of Low-k ILD Materials by X-Ray Reflectivity

2006 ◽  
Vol 914 ◽  
Author(s):  
George Andrew Antonelli ◽  
Tran M. Phung ◽  
Clay D. Mortensen ◽  
David Johnson ◽  
Michael D. Goodner ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Coefficient Of Thermal Expansion ◽  
Chemical Vapor ◽  
Dielectric Materials ◽  
Free Standing ◽  
Dielectric Thin Films ◽  
X Ray ◽  
Chemical Vapor Deposited ◽  
Low K

AbstractThe electrical and mechanical properties of low-k dielectric materials have received a great deal of attention in recent years; however, measurements of thermal properties such as the coefficient of thermal expansion remain minimal. This absence of data is due in part to the limited number of experimental techniques capable of measuring this parameter. Even when data does exist, it has generally not been collected on samples of a thickness relevant to current and future integrated processes. We present a procedure for using x-ray reflectivity to measure the coefficient of thermal expansion of sub-micron dielectric thin films. In particular, we elucidate the thin film mechanics required to extract this parameter for a supported film as opposed to a free-standing film. Results of measurements for a series of plasma-enhanced chemical vapor deposited and spin-on low-k dielectric thin films will be provided and compared.

Effect of Interconnectivity of Nickel on Electrical and Thermal Properties of Alumina-Ni Interpenetrating Phase Composite

2011 ◽  
Vol 239-242 ◽  
pp. 2679-2682 ◽  
Author(s):  
Rub Nawaz Shahid ◽  
Bin Awais Hasan ◽  
Fahad Ali ◽  
Naeem Ul Haq Tariq
Keyword(s):  
Electrical Conductivity ◽  
Thermal Expansion ◽  
Thermal Properties ◽  
Impedance Spectroscopy ◽  
Electron Spectroscopy ◽  
Coefficient Of Thermal Expansion ◽  
Optimal Combination ◽  
Percolation Limit ◽  
Scanning Electron

In this work percolation range for Al2O3-Ni interpenetrating phase composite (IPC) was studied to find the optimal combination of electrical conductivity and coefficient of thermal expansion (CTE). The impedance spectroscopy and scanning electron spectroscopy were used to study the percolation limit.

scholarly journals Effect of Radial Forging on the Microstructure and Mechanical Properties of Ti-Based Alloys

Metals ◽  
2020 ◽  
Vol 10 (11) ◽  
pp. 1488
Author(s):  
Lev B. Zuev ◽  
Galina V. Shlyakhova ◽  
Svetlana A. Barannikova
Keyword(s):  
Phase State ◽  
Metal Flow ◽  
Mechanical Processing ◽  
Radial Forging ◽  
X Ray Diffraction ◽  
Two Phase ◽  
X Ray ◽  
Fine Grained ◽  
Fine Grained Structure

Radial forging is a reliable way to produce Ti alloy rods without preliminary mechanical processing of their surface, which is in turn a mandatory procedure during almost each stage of the existing technology. In the present research, hot pressing and radial forging (RF) of the titanium-based Ti-3.3Al-5Mo-5V alloy were carried out to study the specifics of plasticized metal flow and microstructural evolution in different sections of the rods. The structural analysis of these rods was performed using metallography and X-ray diffraction techniques. The X-ray diffraction reveals the two-phase state of the alloy. The phase content in the alloy was shown to vary upon radial forging. Finally, radial forging was found to be a reliable method to achieve the uniform fine-grained structure and high quality of the rod surface.

Synthesis and properties of low coefficient of thermal expansion copolyimides derived from biphenyltetracarboxylic dianhydride with p-phenylenediamine and 4,4′-oxydialinine

e-Polymers ◽  
2016 ◽  
Vol 16 (4) ◽  
pp. 295-302 ◽  
Author(s):  
Yonglin Lei ◽  
Yuanjie Shu ◽  
Jinhua Peng ◽  
Yongjian Tang ◽  
Jichuan Huo
Keyword(s):  
Thermal Stability ◽  
Thermal Expansion ◽  
Coefficient Of Thermal Expansion ◽  
Thermomechanical Analysis ◽  
Amic Acid ◽  
Molar Ratio ◽  
Structure And Property ◽  
Property Relations ◽  
Ft Ir ◽  
Biphenyltetracarboxylic Dianhydride

AbstractA series of copolyimides were prepared by thermal imidization of poly(amic acid)s (PAAs) derived from 3,3′,4,4′-biphenyltetracarboxylic dianhydride (s-BPDA), 2,3′,3,4′-biphenyltetracarboxylic dianhydride (a-BPDA), p-phenylenediamine (PDA) and 4,4′-oxydialinine (4,4′-ODA) commonly used for the production of commercial polyimides. The flexible copolyimide films were obtained from that the molar ratio of s-BPDA, a-BPDA, PDA and 4,4′-ODA was 9:1:8:2 (Co-PIs-3), 8:2:9:1 (Co-PIs-5) and 8:2:8:2 (Co-PIs-6). These obtained copolyimide films were characterized by Fourier transform-infrared spectroscopy(FT-IR), wide angle X-ray (WAXD), Thermogravimetric (TG), dynamic mechanical thermal analysis (DMA), thermomechanical analysis (TMA), field-emission scanning electron microscopy (FE-SEM) and mechanical properties measurement. The results showed that three copolyimides remained semi-crystalline and exhibited high glass transition temperature (Tg), high thermal stability, great ultimate tensile strength and low coefficient of thermal expansion (CTE). The Co-PIs-5 had lower crystallinity, lower CTE, greater elongation at break, higher Tg and thermal stability and the greater dense extent, compared with Co-PIs-3 and Co-PIs-6. Structure and property relations of the prepared polyimides were also briefly discussed. The results revealed that the copolymerization of s-BPDA/PDA with a small number of 4,4′-ODA/a-BPDA was a useful means for enhancing flexibility without sacrificing low CTE.

Highly transparent polyhydroxyimide/TiO2 and ZrO2 hybrid films with high glass transition temperature (Tg) and low coefficient of thermal expansion (CTE) for optoelectronic application

2017 ◽  
Vol 5 (33) ◽  
pp. 8444-8453 ◽  
Author(s):  
Shun-Wen Cheng ◽  
Tzu-Tien Huang ◽  
Chia-Liang Tsai ◽  
Guey-Sheng Liou
Keyword(s):  
Thermal Expansion ◽  
Glass Transition ◽  
Transition Temperature ◽  
Glass Transition Temperature ◽  
Thermal Expansion Coefficient ◽  
Coefficient Of Thermal Expansion ◽  
High Glass Transition Temperature ◽  
Hybrid Films ◽  
Optoelectronic Application ◽  
Low Thermal Expansion

Highly transparent polyhydroxyimide/TiO2 and ZrO2 hybrids films with high glass transition temperature and low thermal expansion coefficient for optoelectronic application.

STRUCTURE AND ELECTRICAL PROPERTIES OF SrO-BOROVANADATE (V2O5)z(SrO)0.2(B2O3)0.8-z GLASSES

2010 ◽  
Vol 24 (11) ◽  
pp. 1471-1488
Author(s):  
A. MEKKI ◽  
G. D. KHATTAK ◽  
M. N. SIDDIQUI
Keyword(s):  
Electrical Conductivity ◽  
Temperature Dependence ◽  
Inductively Coupled Plasma ◽  
Glass Structure ◽  
Model Parameters ◽  
Nominal Composition ◽  
Polaron Hopping ◽  
X Ray ◽  
Dc Electrical Conductivity ◽  
Hopping Model

SrO -borovanadate glasses with the nominal composition (V 2 O 5 ) z( SrO )0.2 ( B2 O 3 ) 0.8-z, 0.4≤z ≤0.8 were studied by direct current (DC) electrical conductivity, inductively coupled plasma (ICP) spectroscopy, Fourier transform infrared (FT-IR) spectroscopy and X-ray-powder-diffraction (XRD). These glasses were prepared by a normal quench technique and the actual compositions of the glasses were determined by ICP spectroscopy. XRD patterns confirm the amorphous nature of the present glasses. The temperature dependence of DC electrical conductivity of these glasses has been studied in terms of different hopping models. The IR results agree with previous investigations on similar glasses and it has been concluded that similar to SrO -vanadate glasses, metavandate chainlike structures of SrV 2 O 6 and individual VO 4 units also occur in these SrO -borovanadate glasses. The SrV 2 O 6 and VO n polyhedra predominate in the low B 2 O 3 containing SrO -borovanadate glasses as the B substitutes into the V sites of the various VO n polyhedra and only when the B 2 O 3 concentration exceeds the SrO content do BO n structures appear. This qualitative picture of three distinct structural groupings for the Sr -vanadate and Sr -borovanadate glasses is consistent with the proposed glass structure on previous IR and extended X-ray absorption fine structure (EXAFS) studies on these types of glasses. The conductivity results were analyzed with reference to theoretical models existing in the literature and the analysis shows that the conductivity data are consistent with Mott's nearest neighbor hopping model. However, both Mott VRH and Greaves models are suitable to explain the data. Schnakenberg's generalized polaron hopping model is also consistent with the temperature dependence of the activation energy, but the various model parameters such as density of states, hopping energy obtained from the best fits were found to be not in accordance with the prediction of the Mott model.

Some recent developments in high-strength glasses and ceramics

1964 ◽  
Vol 282 (1388) ◽  
pp. 52-56
Keyword(s):  
Thermal Expansion ◽  
Bending Strength ◽  
Glass Ceramics ◽  
High Strength ◽  
Fine Grained ◽  
Thermal Expansion Coefficients ◽  
Low Thermal Expansion ◽  
Recent Developments ◽  
Expansion Coefficients ◽  
Mechanical Strengths

Two areas of development in the field of glasses and ceramics have produced new materials with unusual combinations of properties. Glass-ceramics are melted and formed as glasses by conventional glass-forming techniques, but by a subsequent heat treatment, they are converted to fine-grained crystalline structures with new and useful combinations of properties. Products with thermal expansion coefficients approaching zero and flexural strengths ranging from 10 000 to 50 000 Lb./in. 2 have been made though not all combinations of low thermal expansion coefficients and high mechanical strengths are possible. The second area of development is in so-called Chemcor glasses. Such glass products can be preferentially pre-stressed by chemical means so as to produce an outer layer with high compressive stress and a bending strength in the finished product up to 100 000 Lb/in. 2 .

Electrical conductivity changes in bulk Sn, and eutectic Sn-Ag in bulk and in joints, from aging and thermal shock

2005 ◽  
Vol 20 (2) ◽  
pp. 364-374 ◽  
Author(s):  
F. Guo ◽  
J.G. Lee ◽  
T. Hogan ◽  
K.N. Subramanian
Keyword(s):  
Electrical Conductivity ◽  
Thermal Expansion ◽  
Thermal Shock ◽  
Intermetallic Compounds ◽  
Damage Accumulation ◽  
Coefficient Of Thermal Expansion ◽  
Substrate Interface ◽  
Effects Of Aging

Electrical conductivity of electronic interconnects made with Sn-based solders undergo a significant amount of deterioration during service. Several factors, such as anisotropy of Sn, coefficient of thermal expansion mismatches between the entities that make up the joint, and growth of intermetallic compounds present within the solder and solder/substrate interface, may contribute to the damage accumulation during thermal excursions and cause deterioration of properties. This study dealing with effects of aging and thermal shock on electrical conductivity, carried out with bulk Sn, and eutectic Sn–Ag in bulk and joint configurations, is aimed at evaluating the roles of the above factors on the deterioration of electrical conductivity from these thermal excursions.

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