Study of diamond adhesion behavior on chromium and titanium for obtaining adherent diamond coatings on steel

2000 ◽  
Vol 15 (11) ◽  
pp. 2330-2335 ◽  
Author(s):  
Q. H. Fan ◽  
J. Grácio ◽  
E. Pereira ◽  
N. Ali ◽  
W. Ahmed
Keyword(s):  
Diamond Films ◽  
Film Stress ◽  
Diamond Coatings ◽  
Micro Raman Spectroscopy ◽  
The Poor ◽  
Adhesion Behavior ◽  
Indentation Tests ◽  
Pure Chromium ◽  
Film Form ◽  
Poor Adhesion

It is known that diamond films display poor adhesion on metals such as copper and steel. One solution to overcome the poor adhesion is to use interlayer materials. In this study we report results of an investigation of the adhesion behavior of diamond on pure chromium (Cr) and titanium (Ti) substrates. Cr and Ti are promising interlayer materials for adhering diamond to stainless steel. The coating adhesion was studied using indentation tests combined with acoustic emission signals during loading. It was found that a 105-N load indentation caused the film to delaminate from the Cr substrate, while the diamond film remained attached to the titanium even after the indentation at 180 N. Micro-Raman spectroscopy was used to monitor the film stress. The diamond films grown on Ti substrates were found to be less stressed than the films grown on Cr substrates. Therefore, Ti was used in thin-film form to obtain adherent diamond coatings on steel.

Diamond/Carbide Nano-Composite Gradient Films: a Route to solve the Adhesion Issues of Diamond Films

2005 ◽  
Vol 890 ◽  
Author(s):  
Thorsten Staedler ◽  
Srikanth Vadali ◽  
Xin Jiang
Keyword(s):  
Diamond Film ◽  
Catalytic Effect ◽  
Soot Formation ◽  
Composite Films ◽  
Diamond Films ◽  
Chemical Vapour ◽  
Compositional Gradient ◽  
Process Step ◽  
Reactive Gases ◽  
Poor Adhesion

ABSTRACTDue to their outstanding mechanical properties diamond films are ideal candidates for many cutting and machining applications. However, industrial applications of these films are limited due to poor adhesion. Two main reasons causing this poor adhesion, which are based on the extrinsic physical and chemical properties of diamond, can be identified: High mechanical stresses induced by a difference of the thermal expansion coefficient between the diamond film and the substrate as well as a catalytic effect in case of metallic substrates containing iron-, cobalt- and nickel that, in combination with a methane atmosphere during deposition, leads to soot formation. One option to overcome these difficulties is to provide an interfacial layer that acts as adhesion layer as well as barrier layer to prevent the catalytic effect of the substrate elements. Even though some successful examples exist, this approach usually requires a time consuming and expensive multi-step process.In this paper, the synthesis of nanocrystalline diamond/carbide composite films with a compositional gradient will be reported. Focusing on the example of diamond/ß-SiC the possibility to create a gradient layer ranging from ß-SiC to diamond in a controlled manner will be shown. The films are prepared by a Microwave Assisted Plasma Chemical Vapour Deposition process (MWCVD) using H2, CH4 and Tetramethylsilane (TMS) as reactive gases. The structure, grain sizes, and volume fractions of the components of these composite films, which consist of a mixture of diamond and carbide phase, can be controlled by adjusting the concentrations of the reactive gases in the gas mixture. This strategy, which handles all depositions in one process step, should allow for an improved diamond film adhesion on tools. The preparation and characterization of the composite films with special emphasize on their mechanical and tribological properties will be discussed and a short outlook on other diamond/carbide systems will be given.

Effect of Accelerator Type on Brass-Rubber Adhesion

1983 ◽  
Vol 56 (2) ◽  
pp. 450-464 ◽  
Author(s):  
G. R. Hamed ◽  
T. Donatelli
Keyword(s):  
Copper Sulfide ◽  
Crosslink Density ◽  
Direct Interaction ◽  
Cure Rate ◽  
Tetramethylthiuram Disulfide ◽  
Sulfide Layer ◽  
Pull Out ◽  
The Poor ◽  
Copper And Zinc ◽  
Poor Adhesion

Abstract A natural rubber compound accelerated with tetramethylthiuram disulfide (TMTD) was studied and compared to an N-oxydiethylene-2-benzothiazolesulfenamide (MBS) accelerated compound in order to determine the factors resulting in the poor adhesion to brass of the former. Adhesion to brass-plated steel cord was measured by using the TCAT pull-out test. Vulcanization time and temperature were varied. Also, both compounds were analyzed for crosslink density and type at different states of cure by selective cleavage of the crosslinks with thiol reagents. The poor adhesion to brass of the TMTD compound was not accounted for by cure rate or crosslink density or crosslink type. Synchronization of the rubber cure rate with the sulfidation rate of the brass surface appeared to be unimportant in determining the brass adhesion characteristics of that compound. This was investigated by testing the adhesion of the TMTD compound to brass plated steel cords of different reactivities. Cords were analyzed for copper sulfide formation by an energy dispersive x-ray (EDX) technique after pull-out and also after immersion in squalene solutions containing each accelerator with and without added free sulfur. This analysis showed that there is significant sulfidation of brass in the presence of TMTD accelerator. Atomic absorption analyses of the squalene solutions, after the cord immersions, showed relatively large amounts of copper and zinc present in the TMTD solutions as compared to the MBS solutions. This indicates that TMTD corrodes brass to a much greater extent than the MBS accelerator. From the data presented, the following conclusions can be drawn: (1) The poor adhesion to brass of TMTD accelerated compounds is not related to: (a) their rapid cure rates, (b) a lack of synchronization between cure rate and sulfidation rate, or (c) crosslink density or type. This implies that a deficiency of physical entanglements of rubber crosslinks within the copper sulfide layer is not a reason for the poor adhesion to brass of these compounds. (2) Considerable sulfidation of brass occurs in squalene solutions with TMTD indicating that lack of sulfur availability for brass sulfidation is not a valid explanation for the poor brass adhesion of TMTD compounds. Contrarily, in fact, the data suggest that excessive sulfidation of brass occurs in the presence of TMTD. (3) The corrosive nature of TMTD toward brass has been documented for cords dipped in TMTD/squalene solutions. This characteristic of TMTD likely results in a copper sulfide layer on the brass which is porous and mechanically weak. It is proposed that this direct interaction of TMTD with brass provides an explanation for the poor adhesion to brass of TMTD accelerated compounds. The mechanism by which the TMTD causes the very rapid removal of the brass into solution is not known at this time. Perhaps the TMTD or its decomposition fragments form relatively stable complexes with copper and zinc such that their removal is favored.

scholarly journals Influence of the Heat Dissipation Mode of Long-Flute Cutting Tools on Temperature Distribution during HFCVD Diamond Films

Crystals ◽  
2019 ◽  
Vol 9 (8) ◽  
pp. 394
Author(s):  
Zhang ◽  
Qian ◽  
wang ◽  
Huang ◽  
Zhang ◽  
...  
Keyword(s):  
Heat Dissipation ◽  
Focal Point ◽  
Cutting Tools ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Polycrystalline Diamond ◽  
Decisive Role ◽  
Diamond Coatings ◽  
The Difference ◽  
The Individual

The distribution of substrate temperature plays a decisive role on the uniformity of polycrystalline diamond films on cemented carbide tools with a long flute, prepared by a hot filament chemical vapor deposition (HFCVD). In this work, the heat dissipation mode at the bottom of tools is a focal point, and the finite volume method (FVM) is conducted to simulate and predict the temperature field of tools, with the various materials of the holder placed under the tools. The simulation results show that the thermal conductivity of the holder affects the temperature difference of the individual tools greatly, but only affects the temperature of different tools at the same XY plane slightly. Moreover, the ceramic holder can reduce the difference in temperature of an individual tool by 54%, compared to a copper one. Afterwards, the experiments of the deposition of diamond films is performed using the preferred ceramic holder. The diamond coatings on the different positions present a highly uniform distribution on their grain size, thickness, and quality.

Intrinsic Stress Measurements in CVD Diamond Films

1999 ◽  
Vol 593 ◽  
Author(s):  
Jin Yu ◽  
J.G. Kim ◽  
Y. C. Sohn ◽  
Y. S. Lee
Keyword(s):  
Film Thickness ◽  
Diamond Films ◽  
Strain Analysis ◽  
Chemical Vapor ◽  
Film Stress ◽  
Intrinsic Stress ◽  
Ex Situ ◽  
Chemical Vapor Deposition Method ◽  
Si Substrate ◽  
Curvature Measurements

ABSTRACTDiamond films were grown over Si substrate at 1253K by the hot filament chemical vapor deposition method using CH4/H2 gas mixture, and intrinsic stresses in the film were deduced from the ex-situ curvature measurements. In order to account for the creep deformation of the Si substrate, an elastic/plastic stress and strain analysis were conducted. Results showed that intrinsic stresses were generally several times larger than the average film stresses and always positive increasing with the film thickness. For the film thickness larger than 10μm, stress relaxation by creep of the substrate became significant, and must be considered for the accurate assessment of the film stress in diamond. Later, an analysis based on the grain growth accounted for the development of intrinsic stresses reasonably well

Silicon Nitride Tools Coated With Tic Or Tin Composite Diamond Structures

1995 ◽  
Vol 415 ◽  
Author(s):  
W.D. Fan ◽  
K. Jagannadham ◽  
J. Narayan
Keyword(s):  
Vapor Deposition ◽  
Physical Vapor Deposition ◽  
Diamond Films ◽  
Chemical Vapor ◽  
Diamond Coating ◽  
Diamond Coatings ◽  
Adhesion Properties ◽  
Tin Films ◽  
Composite Diamond ◽  
Diamond Paste

ABSTRACTComposite diamond coatings on Si3N4 substrates have been developed to minimize stresses/strains and improve wear and adhesion properties. The coatings consist of a first layer of discontinuous diamond crystallites which are anchored to the Si3N4 substrate by a second interposing layer of TiC or TiN film. A top third layer of continuous diamond film is grown epitaxially on the first layer. The diamond films and TiC or TiN films were deposited using hot filament chemical vapor deposition and laser physical vapor deposition, respectively. The TiC and TiN films were examined by X-ray diffraction. The diamond films were characterized by scanning electron microscopy and Raman spectroscopy. Adhesion of the diamond coatings was investigated using overlap polishing with diamond paste, wear against Al-12.5%Si alloy, and pull-test. The results show that after introducing an interposing layer of TiC or TiN, adhesion of diamond coatings on Si3N4 substrates is improved significantly. After polishing test against diamond paste for 4 hours, only 30% of diamond was retained with single diamond coating while 80% of diamond was found with TiN composite diamond coating. The mechanism of improvement of adhesion is discussed.

Polarized micro-Raman spectroscopy for studying stresses in as-grown and tensile-tested diamond films

2008 ◽  
Vol 202 (11) ◽  
pp. 2263-2267 ◽  
Author(s):  
T. Gries ◽  
L. Vandenbulcke ◽  
P. Simon ◽  
A. Canizares
Keyword(s):  
Raman Spectroscopy ◽  
Diamond Films ◽  
Micro Raman Spectroscopy

scholarly journals Recycling of WEEE Plastics Waste in Mortar: The Effects on Mechanical Properties

Recycling ◽  
2021 ◽  
Vol 6 (4) ◽  
pp. 70
Author(s):  
Alessandra Merlo ◽  
Luca Lavagna ◽  
Daniel Suarez-Riera ◽  
Matteo Pavese
Keyword(s):  
Mechanical Properties ◽  
Natural Resources ◽  
Mechanical Performance ◽  
Plastic Waste ◽  
Partial Replacement ◽  
Porosity Formation ◽  
Mineral Aggregate ◽  
The Poor ◽  
Structural Applications ◽  
Poor Adhesion

This work focused on the recycling of WEEE plastic waste as a partial substitute for aggregate in light mortars. The plastic mix, provided by the IREN group, was used as a replacement of aggregate in 15, 30, 45, 60, 75, and 90%vol in mortars. Worsening of the mechanical performance of around 50% was detected already at only 15%vol of mineral aggregate substituted with plastic waste. The explanation of this phenomenon was found in both the scarce mechanical properties of the used plastic and in the poor adhesion between matrix and plastics that resulted in extra-porosity formation, as also demonstrated by comparing the results with several models in the literature. However, the use of plastic waste as a partial replacement of natural aggregate contributes to the preservation of natural resources and, in any case, does not limit the application of these materials in non-structural applications.

Friction and adhesion behavior of polycrystalline diamond films deposited on metals

2000 ◽  
Vol 126 (2-3) ◽  
pp. 110-115 ◽  
Author(s):  
Qi Hua Fan ◽  
E. Pereira ◽  
P. Davim ◽  
J. Gracio ◽  
C.J. Tavares
Keyword(s):  
Diamond Films ◽  
Polycrystalline Diamond ◽  
Adhesion Behavior
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