Rapid thermal recrystallization of amorphous silicon films
1997 ◽
Vol 12
(10)
◽
pp. 2511-2514
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Keyword(s):
In this work the properties of polycrystalline silicon layers obtained by rapid thermal annealing have been discussed. Amorphous silicon layers with thickness of 3000 Å have been deposited on silicon wafers in rf sputtering system. The layers were annealed for 15 s to 5 min at temperatures in the range 800–1200 °C in vacuum 5 × 10−5 Torr. A correlation was established between structure, morphology, sheet resistance, and the parameters of the RTA annealing.
1994 ◽
Vol 37-38
◽
pp. 287-292
◽
2013 ◽
Vol 24
(11)
◽
pp. 4209-4212
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2000 ◽
Vol 39
(Part 2, No. 1A/B)
◽
pp. L19-L21
◽
1998 ◽
Vol 135
(1-4)
◽
pp. 205-208
◽
1993 ◽
Vol 8
(3)
◽
pp. 327-332
◽
2001 ◽
Vol 40
(Part 1, No. 4A)
◽
pp. 2150-2154
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Keyword(s):