Mechanical properties of polydopamine (PDA) thin films

MRS Advances ◽  
2019 ◽  
Vol 4 (07) ◽  
pp. 405-412 ◽  
Author(s):  
Haoqi Li ◽  
Jiaxin Xi ◽  
Yao Zhao ◽  
Fei Ren
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Young’S Modulus ◽  
Self Assembly ◽  
Young's Modulus ◽  
Treatment Temperature ◽  
Air Interface ◽  
Solid Substrates ◽  
Film Conductor ◽  
Almost All

ABSTRACTPolydopamine (PDA) is a biopolymer, which can form uniform thin films on almost all solid substrates as well as at the liquid/air interface. Carbonized polydopamine possesses graphite-like structure and exhibits high electrical conductivity, which makes it a potential carbon-based thin film conductor. However, studies on mechanical behavior of PDA and its derived materials are very limited. In this study, PDA samples were synthesized through self-assembly of dopamine in aqueous solution. Elastic modulus of thin films was measured using the nanoindentation technique. It is shown that the Young’s modulus of PDA thin film increased with increasing heat treatment temperature (up to 600°C). Doping with Cu ions also increased the Young’s modulus of PDA. Furthermore, all PDA thin films, with and without Cu, exhibited creep behavior.

Nanoindentation Measurements on Low-k Porous Silica Thin Films Spin Coated on Silicon Substrates

2003 ◽  
Vol 125 (4) ◽  
pp. 361-367 ◽  
Author(s):  
Xiaoqin Huang ◽  
Assimina A. Pelegri
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Young’S Modulus ◽  
Microelectromechanical Systems ◽  
Young's Modulus ◽  
Porous Silica ◽  
Silicon Substrates ◽  
Silica Thin Films ◽  
Low K

MEMS (MicroElectroMechanical Systems) are composed of thin films and composite nanomaterials. Although the mechanical properties of their constituent materials play an important role in controlling their quality, reliability, and lifetime, they are often found to be different from their bulk counterparts. In this paper, low-k porous silica thin films spin coated on silicon substrates are studied. The roughness of spin-on coated porous silica films is analyzed with in-situ imaging and their mechanical properties are determined using nanoindentation. A Berkovich type nanoindenter, of a 142.3 deg total included angle, is used and continuous measurements of force and displacements are acquired. It is shown, that the measured results of hardness and Young’s modulus of these films depend on penetration depth. Furthermore, the film’s mechanical properties are influenced by the properties of the substrate, and the reproduction of the force versus displacement curves depends on the quality of the thin film. The hardness of the studied low-k spin coated silica thin film is measured as 0.35∼0.41 GPa and the Young’s modulus is determined as 2.74∼2.94 GPa.

Mechanical Properties of Poly 3C-SiC Thin Films According to Carrier Gas (H2) Concentration

2008 ◽  
Vol 600-603 ◽  
pp. 867-870
Author(s):  
Gwiy Sang Chung ◽  
Ki Bong Han
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Surface Roughness ◽  
Atomic Force Microscope ◽  
Young’S Modulus ◽  
Young's Modulus ◽  
Carrier Gas ◽  
Nano Indentation ◽  
Atomic Force

This paper presents the mechanical properties of 3C-SiC thin film according to 0, 7, and 10 % carrier gas (H2) concentrations using Nano-Indentation. When carrier gas (H2) concentration was 10 %, it has been proved that the mechanical properties, Young’s Modulus and Hardness, of 3C-SiC are the best of them. In the case of 10 % carrier gas (H2) concentration, Young’s Modulus and Hardness were obtained as 367 GPa and 36 GPa, respectively. When the surface roughness according to carrier gas (H2) concentrations was investigated by AFM (atomic force microscope), when carrier gas (H2) concentration was 10 %, the roughness of 3C-SiC thin was 9.92 nm, which is also the best of them. Therefore, in order to apply poly 3C-SiC thin films to MEMS applications, carrier gas (H2) concentration’s rate should increase to obtain better mechanical properties and surface roughness.

Measurement of Mechanical Properties for Thin Film Using Visual Image Tracing Method

2007 ◽  
Vol 124-126 ◽  
pp. 1701-1704 ◽  
Author(s):  
Sang Joo Lee ◽  
Seung Woo Han ◽  
Jae Hyun Kim ◽  
Hak Joo Lee
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Young’S Modulus ◽  
Measurement System ◽  
Strain Measurement ◽  
Poisson’S Ratio ◽  
Young's Modulus ◽  
Visual Image ◽  
Poisson's Ratio

It is quite difficult to accurately measure the mechanical properties of thin films. Currently, there are several methods (or application) available for measuring mechanical properties of thin films. Their properties, however, have been determined by indirect methods such as cantilever beam test and diaphragm bulge test. This paper reports the efforts to develop a direct strain measurement system for micro/nano scale thin film materials. The proposed solution is the Visual Image Tracing (VIT) strain measurement system coupled with a micro tensile testing unit, which consists of a piezoelectric actuator, load cell, microscope and CCD cameras. The advantage of this system is the ability to monitor the real time images of specimen during the test in order to determine its Young’s modulus and Poisson’s ratio at the same time. Stress-strain curve, Young’s modulus, yield strength and Poisson’s ratio of copper thin film measured using VIT system are presented.

Using Nanoindentation and Nanoscratch to Determine Thin Film Mechanical Properties

2006 ◽  
Vol 326-328 ◽  
pp. 357-360 ◽  
Author(s):  
Rwei Ching Chang ◽  
Feng Yuan Chen ◽  
Chang En Sun
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Friction Factor ◽  
Young’S Modulus ◽  
Physical Vapor Deposition ◽  
Young's Modulus ◽  
Indentation Test ◽  
Lateral Force ◽  
Wafer Substrate

This work uses nanoindentation and nanoscratch to measure the mechanical properties of evaporation copper thin films. The thin film is deposited on a silicon wafer substrate by using the physical vapor deposition method provided by a resistive heating evaporator. The mechanical properties are then determined by indentation test and lateral force test produced by nanoindenter and nanoscratch. The results show that, as the copper thin film is 500nm in thickness and the indentation depth increases from 100nm to 400nm, the Young’s modulus increases from 151GPa to 160GPa while the hardness increases from 2.8GPa to 3.5GPa. Moreover, both the Young’s modulus and the hardness decrease as the thickness of the thin film increases. Besides, the nanoscratch results show that the friction factor also increases as the scratch depth increases, and a thinner film thickness makes a larger friction factor. The results represent the substrate has a significant effect on the mechanical properties of the thin films.

The Study on Deposition Process and Mechanical Properties of Deposited Cu Thin Films Using Molecular Dynamics

2013 ◽  
Vol 684 ◽  
pp. 37-41
Author(s):  
Jen Ching Huang ◽  
Yi Chia Liao ◽  
Huail Siang Liu ◽  
Fu Jen Cheng
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Mechanical Properties ◽  
Molecular Dynamics ◽  
Young’S Modulus ◽  
Adhesion Force ◽  
Young's Modulus ◽  
Early Stage ◽  
Vacancy Concentration ◽  
Deposition Process

This paper studies the deposition process and mechanical properties of Cu thin films deposited on single crystal copper substrates with various surface roughnesses by molecular dynamics (MD). In the effect of vacancy concentration (Cv) of substrate, the Young's modulus of sample decreased as the Cv of substrate increased but the adhesion force will increase as the Cv of substrate increases. The effect of substrate roughness on the peak intensity of crystal orientation has little. And the greater Cv of substrate, the surface roughness of the deposited thin film also increased. In the effect of numbers of deposited atoms, the deposited thin film thickness increases, the surface will be relatively flat and the Young's modulus will also increase. By the XRD pattern, the principal growth directions of thin film are the (220) and (200) in the early stage of growth during deposition. However, with the thickness increasing, the (111) will be the preferred orientation.

scholarly journals Out-of-Plane Thermal Expansion Coefficient and Biaxial Young’s Modulus of Sputtered ITO Thin Films

Coatings ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 153
Author(s):  
Chuen-Lin Tien ◽  
Tsai-Wei Lin
Keyword(s):  
Thin Films ◽  
Thermal Expansion ◽  
Thermal Stress ◽  
Young’S Modulus ◽  
Thermal Expansion Coefficient ◽  
Expansion Coefficient ◽  
Young's Modulus ◽  
Heating Temperature ◽  
Glass Substrates ◽  
Ito Thin Films

This paper proposes a measuring apparatus and method for simultaneous determination of the thermal expansion coefficient and biaxial Young’s modulus of indium tin oxide (ITO) thin films. ITO thin films simultaneously coated on N-BK7 and S-TIM35 glass substrates were prepared by direct current (DC) magnetron sputtering deposition. The thermo-mechanical parameters of ITO thin films were investigated experimentally. Thermal stress in sputtered ITO films was evaluated by an improved Twyman–Green interferometer associated with wavelet transform at different temperatures. When the heating temperature increased from 30 °C to 100 °C, the tensile thermal stress of ITO thin films increased. The increase in substrate temperature led to the decrease of total residual stress deposited on two glass substrates. A linear relationship between the thermal stress and substrate heating temperature was found. The thermal expansion coefficient and biaxial Young’s modulus of the films were measured by the double substrate method. The results show that the out of plane thermal expansion coefficient and biaxial Young’s modulus of the ITO film were 5.81 × 10−6 °C−1 and 475 GPa.

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