A New Subcritical Nanostructure of Graphene—Crinkle-Ruga Structure and Its Novel Properties

MRS Advances ◽  
2018 ◽  
Vol 3 (45-46) ◽  
pp. 2763-2769 ◽  
Author(s):  
Ruizhi Li ◽  
Mrityunjay Kothari ◽  
Alexander K. Landauer ◽  
Moon-Hyun Cha ◽  
Heemin Kwon ◽  
...  

AbstractHere, we report an experimental characterization of a new subcritical graphene nanostructure termed a crinkle ruga. Multilayer graphene forms crinkles as a periodic mode of buckling if the ratio of periodic buckling span to thickness is smaller than a critical value. Otherwise, it forms wrinkles. The crinkles have sawtooth-shaped profiles with their faces perfectly flat and the tips of the peaks and valleys highly curved. Our AFM measurements show that the width of the curvature focusing band at the tip is very narrow, e.g. smaller than 16 nm for a 6o crinkle, indicating a strong influence of flexoelectric coupling in crinkle formation. We also found that concavity or convexity of crinkle tips, i.e. parity of the crinkle, can be controlled. Due to the flexoelectric coupling, the concave tip at the crinkle valley is positively charged, and the convex tip at the crinkle peak negatively charged. In addition, here, we demonstrate that the charges at the crinkle tips can attract macromolecules in adsorption experiments. We show linearly-aligned adsorption of C60 along crinkle valleys on an HOPG surface. In another experiment, we exhibit period-doubled adsorption of lambda DNA on an HOPG surface, possibly caused by ion kinetics involved in the DNA adsorption along the crinkle valleys.

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.


1982 ◽  
Vol 10 (1) ◽  
pp. 37-54 ◽  
Author(s):  
M. Kumar ◽  
C. W. Bert

Abstract Unidirectional cord-rubber specimens in the form of tensile coupons and sandwich beams were used. Using specimens with the cords oriented at 0°, 45°, and 90° to the loading direction and appropriate data reduction, we were able to obtain complete characterization for the in-plane stress-strain response of single-ply, unidirectional cord-rubber composites. All strains were measured by means of liquid mercury strain gages, for which the nonlinear strain response characteristic was obtained by calibration. Stress-strain data were obtained for the cases of both cord tension and cord compression. Materials investigated were aramid-rubber, polyester-rubber, and steel-rubber.


AIAA Journal ◽  
2002 ◽  
Vol 40 ◽  
pp. 16-25
Author(s):  
J. P. Wojno ◽  
T. J. Mueller ◽  
W. K. Blake

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