Reduction of Threading Dislocation Density in InN Film Grown with in situ Surface Modification by Radio-frequency Plasma-excited Molecular Beam Epitaxy

MRS Advances ◽  
2018 ◽  
Vol 3 (18) ◽  
pp. 931-936
Author(s):  
F. B. Abas ◽  
R. Fujita ◽  
S. Mouri ◽  
T. Araki ◽  
Y. Nanishi
Keyword(s):  
Surface Modification ◽  
Electrical Properties ◽  
Dislocation Density ◽  
Hall Effect Measurement ◽  
Threading Dislocation ◽  
X Ray ◽  
Transmission Electron ◽  
Threading Dislocation Density ◽  
Order Of Magnitude

ABSTRACTThe objective of this study was to investigate the relationship between the thickness of N radical irradiated InN template with crystallographic quality and electrical properties of InN film grown with the previously proposed method, in situ surface modification by radical beam irradiation. In this study, three InN samples were grown with this method on different thickness of irradiated templates. The crystallographic quality of InN films was analyzed by X-ray diffraction and the electrical properties were studied by Hall effect measurement. InN grown on 100 nm thick irradiated template shows lower full-width at half-maximum of X-ray rocking curves and lower carrier concentration compared to InN grown on 200 nm and 450 nm thick irradiated templates. Transmission electron microscopy revealed that threading dislocation density in the InN film decreased by an order of magnitude to ∼4.6×109cm-2. These results suggest that this method is possible for reduction of threading dislocation density in InN and the thickness of irradiated template should be minimized for higher crystallographic quality and electrical properties of the entire InN film.

Defect-Engineered Graded GexSi1-x Buffers on Si (001) with Extreme Low Threading Dislocation Density

1995 ◽  
Vol 378 ◽  
Author(s):  
G. Kissinger ◽  
T. Morgenstern ◽  
G. Morgenstern ◽  
H. B. Erzgräber ◽  
H. Richter
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Atomic Force Microscopy ◽  
Dislocation Density ◽  
Threading Dislocation ◽  
Force Microscopy ◽  
Atomic Force ◽  
Transmission Electron ◽  
Dislocation Densities ◽  
Threading Dislocation Density

AbstractStepwise equilibrated graded GexSii-x (x≤0.2) buffers with threading dislocation densities between 102 and 103 cm−2 on the whole area of 4 inch silicon wafers were grown and studied by transmission electron microscopy, defect etching, atomic force microscopy and photoluminescence spectroscopy.

Defect Reduction in Cd1-xZnxTe Epilayers on GaAs Substrates

1994 ◽  
Vol 299 ◽  
Author(s):  
Saket Chadda ◽  
Kevin Malloy ◽  
John Reno
Keyword(s):  
Threading Dislocation ◽  
Full Width ◽  
X Ray Diffraction ◽  
Defect Reduction ◽  
X Ray ◽  
Gaas Substrates ◽  
Transmission Electron ◽  
Threading Dislocation Density ◽  
Optimum Period ◽  
Bulk Alloys

AbstractCd0.91Zn0.09Te/CdTe multilayers of various period thicknesses were inserted into Cd0.955Zn0.045Te bulk alloys grown on (001) GaAs. The net strain of the multilayer on the underlying Cd0.955Zn0.045Te was designed to be zero. X-ray diffraction full width at half maximum (FWHM) was used as a means to optimize the period thickness of the multilayer. Transmission electron microscopy of the optimum period thickness samples demonstrated four orders of magnitude decrease in the threading dislocation density. Mechanism of bending by equi-strained multilayers is discussed.

Evaluation of threading dislocation density of strained Ge epitaxial layer by high resolution x-ray diffraction

2017 ◽  
Vol 26 (12) ◽  
pp. 127309 ◽  
Author(s):  
Yuan-Hao Miao ◽  
Hui-Yong Hu ◽  
Xin Li ◽  
Jian-Jun Song ◽  
Rong-Xi Xuan ◽  
...  
Keyword(s):  
High Resolution ◽  
Dislocation Density ◽  
Epitaxial Layer ◽  
Threading Dislocation ◽  
X Ray Diffraction ◽  
X Ray ◽  
Threading Dislocation Density

Improved Structural Quality and Carrier Decay Times in GaN Epitaxy on SiN and TiN Porous Network Templates

2006 ◽  
Vol 527-529 ◽  
pp. 1505-1508
Author(s):  
Ümit Özgür ◽  
Y. Fu ◽  
Cole W. Litton ◽  
Y.T. Moon ◽  
F. Yun ◽  
...  
Keyword(s):  
Chemical Vapor ◽  
Structural Quality ◽  
Threading Dislocation ◽  
X Ray Diffraction ◽  
Porous Network ◽  
X Ray ◽  
Radiative Efficiency ◽  
Decay Times ◽  
Threading Dislocation Density

Improved structural quality and radiative efficiency were observed in GaN thin films grown by metalorganic chemical vapor deposition on in situ-formed SiN and TiN porous network templates. The room temperature carrier decay time of 1.86 ns measured for a TiN network sample is slightly longer than that for a 200 μm-thick high quality freestanding GaN (1.73 ns). The linewidth of the asymmetric X-Ray diffraction (XRD) (1012) peak decreases considerably with the use of SiN and TiN layers, indicating the reduction in threading dislocation density. However, no direct correlation is yet found between the decay times and the XRD linewidths, suggesting that point defect and impurity related nonradiative centers are the main parameters affecting the lifetime.

Evaluation of X-ray Bragg peak profiles with the variance method obtained by in situ measurement on Mg–Al alloys

2020 ◽  
Vol 53 (2) ◽  
pp. 360-368
Author(s):  
Gergely Farkas ◽  
István Groma ◽  
Jozef Veselý ◽  
Kristián Máthis
Keyword(s):  
Dislocation Density ◽  
Profile Analysis ◽  
Line Profile Analysis ◽  
Dislocation Interaction ◽  
X Ray ◽  
Variance Method ◽  
Al Content ◽  
Transmission Electron ◽  
Bragg Peak Profiles

The microstructural evolution in randomly oriented Mg–Al samples is investigated in situ during compression by X-ray diffraction as a function of Al concentration. The diffraction data are evaluated by the variance method, which provides information about the dislocation density and spatial distribution of the dislocations. The dislocation density increases with increasing alloying content. Since the increment of the dislocation density above the yield point is linear, the mutual dislocation interaction type is determined from the Taylor equation. The results indicate the dominance of basal–basal dislocation interactions, but at higher alloying content the share of the basal–non-basal interactions increases. It is shown that the dynamics of dislocation wall formation also depend on Al content. Transmission electron microscopy observations are in agreement with the results obtained by X-ray line profile analysis.

Cantilever Epitaxy of GaN on Sapphire: Further Reductions in Dislocation Density

2002 ◽  
Vol 743 ◽  
Author(s):  
D. M. Follstaedt ◽  
P. P. Provencio ◽  
D. D. Koleske ◽  
C. C. Mitchell ◽  
A. A. Allerman ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Dislocation Density ◽  
Threading Dislocation ◽  
Threading Dislocations ◽  
Processing Conditions ◽  
Optimum Growth ◽  
Cross Sectional ◽  
Transmission Electron ◽  
Threading Dislocation Density

ABSTRACTThe density of vertical threading dislocations at the surface of GaN grown on sapphire by cantilever epitaxy has been reduced with two new approaches. First, narrow mesas (<1 μm wide) were used and {11–22} facets formed over them early in growth to redirect dislocations from vertical to horizontal. Cross-sectional transmission electron microscopy was used to demonstrate this redirection and to identify optimum growth and processing conditions. Second, a GaN nuc-leation layer with delayed 3D → 2D growth transition and inherently lower threading dislocation density was adapted to cantilever epitaxy. Several techniques show that a dislocation density of only 2–3×107/cm2 was achieved by combining these two approaches. We also suggest other developments of cantilever epitaxy for reducing dislocations in heteroepitaxial systems.

The Reduction of The Defect Density in CdTe Buffer Layers for The Growth of HgCdTe Infrared Photodiodes on Si (211) Substrates

1997 ◽  
Vol 484 ◽  
Author(s):  
H.-Y. Wei ◽  
L. Salamanca-Riba ◽  
N. K. Dhar
Keyword(s):  
Dislocation Density ◽  
Defect Density ◽  
Three Dimensional ◽  
Buffer Layers ◽  
Threading Dislocation ◽  
Si Substrates ◽  
Migration Enhanced Epitaxy ◽  
Threading Dislocation Density ◽  
Order Of Magnitude ◽  
Cdte Buffer

CdTe epilayers were grown by molecular beam epitaxy on As-passivated nominal (211) Si substrates using thin interfacial ZnTe layers. By using thin recrystallized (initially amorphous) ZnTe buffei layers, we utilized migration enhanced epitaxy (MEE) in the ZnTe layer and overcome the tendency toward three dimensional nucleation. The threading dislocation densities in 8–9 tm thick CdTe films deposited on the recrystallized amorphous ZnTe films were in the range of 2 to 5 × 105 cm−2. In addition to the reduction of threading dislocation density, the interface between the ZnTe layers and the Si substrate is much smoother and the microtwin density is an order of magnitude lower than in regular MEE growth. In order to understand the initial nucleation mechanism of the ZnTe on the As precursor Si surface, we also grew ZnTe epilayers on Te precursor treated Si substrates. The growth mode, microtwin density, and threading dislocation density are compared for films grown on Si substrates with different surface precursors and grown by different growth methods.

Dependence of Threading Dislocation Density on Substrate Misorientation in In0.15Ga0.85As Grown on GaAs(100)

1989 ◽  
Vol 145 ◽  
Author(s):  
P.N. Uppal ◽  
J.S. Ahearn ◽  
R. Herring
Keyword(s):  
Dislocation Density ◽  
Strain Relaxation ◽  
Dislocation Network ◽  
Uniform Density ◽  
Threading Dislocation ◽  
Dislocation Mobility ◽  
Transmission Electron ◽  
Dislocation Arrays ◽  
Threading Dislocation Density ◽  
Strained Layer Superlattices

AbstractThe density and arrangement of dislocations in In0.15Ga0.85As grown on GaAs(100)) were determined by transmission electron microscopy as a function of misorientation toward (111)A, (111)B, and (110). Strained layer superlattices were used in all cases to reduce dislocation density. Layers grown on exact GaAs(100) exhibited a non-uniform threading dislocation dis- tribution whereby some areas had a high density (∼ 109cm-2or higher) of dislocation tangles and other areas that we in between had a more uniform density (∼ 2 x 107cm-2). The misorientated layers exhibited a uniform threading dislocation distribution with densities of ∼ 5 x 106 cm-2 for (100) misoriented towards (111)A, ∼ 1 x 107cm-2towards (111)B, and ∼ 3 x 107cm-2 towards (110). The misfit dislocation network (dislocations located at the GaAs-InO0.15Ga0.85 As interface) formed orthogonal dislocation arrays in the case of exact (100) substrates and slightly non-ortho- gonal arrays in the case of misoriented substrates. These results are explained with the help of a general glide model of strain relaxation in which the exact (100) orientation has eight equally stressed glide systems which presumably activate during strain relaxation. With misoriented substrates the stress symmetry is broken and fewer glide systems experience the maximum stress, thus reducing the number of active dislocation systems. A small asymmetry in interfacial dis- location density was observed in all the cases where the linear dislocation density along the two (011) and (011) orthogonal directions differed by about 20%. This is explained by the preferred activation of (x-dislocations (high dislocation mobility) over 13-dislocations (low dislocation mobility).

Sign in / Sign up

Export Citation Format

Share Document