scholarly journals RELIABILITY ANALYSIS OF LOW-SILVER BGA SOLDER JOINTS USING FOUR FAILURE CRITERIA

2012 ◽  
Author(s):  
Erin A. Kimura
Keyword(s):  
Reliability Analysis ◽  
Solder Joints ◽  
Failure Criteria

Power Stack Die Package Design, Simulation and Reliability Analysis

2010 ◽  
Author(s):  
Yong Liu ◽  
Howard Allen ◽  
Stephen Martin
Keyword(s):  
Thermal Cycling ◽  
Reliability Analysis ◽  
Failure Mechanism ◽  
Solder Joints ◽  
Buck Converter ◽  
Lower Side ◽  
Package Design ◽  
High Side ◽  
Solder Balls

This paper presents a power stack die package design for a point of load buck converter. The buck converter system in package (SiP) consists of a lower side Mosfet and a high side Mosfet together with an IC controller. Its structure includes a premolded leadframe with an IC controller. The two Mosfets (both low side and higher side) are stacked on the premolded leadfrrame (LF) and IC controller. Solder balls are placed on the leadframe’s exposed lands, and together with the two drains of Mosfets, to form the stacked die power package. The thermal cycling simulations for the solder balls to connect the PCB and solder joints of the two Mosfet die to the leadframe pads are studied. The failure mechanism and reliability analysis of the power package in TMCL test are discussed.

Fatigue Properties of Microelectronics Solder Joints

1991 ◽  
Vol 113 (2) ◽  
pp. 92-101 ◽  
Author(s):  
N. Nir ◽  
T. D. Dudderar ◽  
C. C. Wong ◽  
A. R. Storm
Keyword(s):  
Solder Joints ◽  
Low Cycle Fatigue ◽  
Failure Criteria ◽  
Mode Analysis ◽  
Fatigue Properties ◽  
Strength Failure ◽  
Loading System ◽  
Failure Mode Analysis ◽  
Post Test ◽  
Reversed Shear

Low cycle fatigue studies of solder joints designed and fabricated to represent generic interconnection structures typical of what might be used in packaging microelectronics have been carried out to assist in the development of a better understanding of the fundamental mechanical properties that determine the reliability of such structures. These studies involve micro scale joints (micro-joints) of both eutectic and 95/5 Pb/Sn solders fabricated by several different processes. In addition to a discussion of the results of recent tests reflecting specified loss-of-strength failure criteria and extensive post-test failure mode analysis of, primarily, 95/5 Pb/Sn micro-joints, descriptions of (1) the design and fabrication of the custom shear test vehicles and (2) the high-resolution electro-mechanical loading system used to apply cyclic loadings under isothermal conditions will be presented. This computer controlled system provides for the application of fully or partially reversed shear strains (with or without dwells) to either prototypes or custom test vehicles, and can be operated to maintain either total or plastic strain control during cycling.

Impact of Low Temperatures on Solder Joint Failures

2002 ◽  
Vol 124 (2) ◽  
pp. 135-137 ◽  
Author(s):  
Boris Mirman
Keyword(s):  
Solder Joint ◽  
Shear Strain ◽  
Low Temperatures ◽  
Solder Joints ◽  
Failure Criteria ◽  
Plastic Shear ◽  
Plastic Packages ◽  
Plastic Shear Strain ◽  
Thin Plastic ◽  
The Impact

An experiment with solder joints of thin plastic packages, cycled between −10° and 110°C, has demonstrated that the majority of solder joint failures occurred at the low temperatures. In this experiment, the low temperatures caused high peeling stresses in the heel area of solder joints and, as usual, relatively low plastic shear strain (as compared with these strains at high temperatures). This fact suggests that the impact of solder peeling stresses on the solder failure is noticeably higher than is anticipated by applying the commonly used failure criteria.

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