Final Code of Practice – test method for thermal cycling oxidation testing

2007 ◽  
pp. 212-252
Keyword(s):  
Thermal Cycling ◽  
Test Method ◽  
Practice Test ◽  
Code Of Practice ◽  
Final Code ◽  
Oxidation Testing

Evaluation of the Resistance of Individual Si Die to Cracking

1998 ◽  
Author(s):  
R. Berriche ◽  
R.K. Lowry ◽  
M.I. Rosenfield
Keyword(s):  
Thermal Cycling ◽  
Hardness Test ◽  
Mechanical Stresses ◽  
Test Method ◽  
Processing Conditions ◽  
Micro Hardness ◽  
Test Methodology ◽  
Vickers Micro Hardness

Abstract The present work investigated the use of the Vickers micro-hardness test method to determine the resistance of individual die to cracking. The results are used as an indicator of resistance to failure under the thermal and mechanical stresses of packaging and subsequent thermal cycling. Indentation measurements on die back surfaces are used to determine how changes in wafer backside processing conditions affect cracks that form around impressions produced at different loads. Test methodology and results obtained at different processing conditions are discussed.

Delamination toughness of electron beam physical vapor deposition (EB-PVD) Y2O3–ZrO2 thermal barrier coatings by the pushout method: Effect of thermal cycling temperature

2008 ◽  
Vol 23 (9) ◽  
pp. 2382-2392 ◽  
Author(s):  
M. Tanaka ◽  
Y.F. Liu ◽  
S.S. Kim ◽  
Y. Kagawa
Keyword(s):  
Electron Beam ◽  
Thermal Cycling ◽  
Bond Coat ◽  
Physical Vapor Deposition ◽  
Thermally Grown Oxide ◽  
Test Method ◽  
Thermal Barrier ◽  
Barrier Coating ◽  
Delamination Toughness ◽  
Cycling Temperature

A pushout test method was used to quantify effect of thermal cycling temperatures on the delamination toughness of an electron beam physical vapor deposited thermal barrier coating (EB-PVD TBC). The delamination toughness, Γi, was related to the maximum thermal cycling temperature, Th, equal to 1000, 1025, 1050, and 1100 °C. The measured delamination toughness varied from 9 to 95 J/m2. At Th = 1000 °C, Γi attained a maximum value, larger than that of the as-deposited sample and decreasing with increased Th. During the thermal cycling tests, the thermally grown oxide (TGO) was formed between the TBC and the bond coat deposited onto the superalloy substrate. Inside the TGO layer, mixture of Al2O3 and ZrO2 oxides was observed close to the TBC side with nearly pure Al2O3 phases close to the bond-coat side. During the pushout test, delamination occurred at the interface of the mixture and pure Al2O3 layer with an exception for Th = 1100 °C specimens where delamination also occurred at the interface between the TGO and bond-coat layers. The effect of thermal cycling temperatures on the delamination toughness is discussed in terms of the microstructural change and delamination behavior.

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