Experimental Characterization of Synchronization in Networks of Non Linear Oscillators with Dynamic Links

2014 ◽  
Vol 1 ◽  
pp. 53-56
Author(s):  
Massimiliano de Magistris ◽  
Mario di Bernardo ◽  
Carlo Petrarca
Keyword(s):  
Experimental Characterization ◽  
Non Linear ◽  
Dynamic Links

Experimental characterization of the instability of the vortex rings. Part II: Non-linear phase

2006 ◽  
Vol 41 (3) ◽  
pp. 401-413 ◽  
Author(s):  
Antoine Dazin ◽  
Patrick Dupont ◽  
Michel Stanislas
Keyword(s):  
Vortex Rings ◽  
Linear Phase ◽  
Experimental Characterization ◽  
Non Linear

scholarly journals Micromechanical modeling and experimental characterization of the non linear behavior of platelet-reinforced nanocomposites

2009 ◽  
Vol 10 (3-4) ◽  
pp. 291-297
Author(s):  
Ludovic Cauvin ◽  
Djimedo Kondo ◽  
Mathias Brieu ◽  
Naresh Bhatnagar
Keyword(s):  
Micromechanical Modeling ◽  
Experimental Characterization ◽  
Linear Behavior ◽  
Non Linear

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

Sign in / Sign up

Export Citation Format

Share Document