Measurement of Crack-Tip Stress Distributions by X-Ray Diffraction

2009 ◽  
pp. 550-550-13 ◽  
Author(s):  
JE Allison
2019 ◽  
Vol 127 ◽  
pp. 500-508 ◽  
Author(s):  
P. Lopez-Crespo ◽  
J.V. Peralta ◽  
J.F. Kelleher ◽  
P.J. Withers

1987 ◽  
Vol 31 ◽  
pp. 223-230
Author(s):  
L. T. Nguyen ◽  
I. C. Noyan

The results of an experimental study on residual stresses within the encapsulation layers of electronic components are described. For this study, silicon wafers were coated with a flexibilized cycloaliphatic formulation filled with 30 and 40 (vol.) % of Cu particles. The residual stresses were determined by measuring the radii of curvature of the encapsulated wafers. The stress in the Cu particles at the surface was also measured by X-Ray diffraction. It was seen that the stresses within the structure are primarily macro-stresses, with little stress present within the Cu particles. Comparison of the experimental values to those calculated from linear elasticity theory also indicate relaxation within the composite during curing.


2009 ◽  
Vol 1156 ◽  
Author(s):  
Conal E. Murray ◽  
Paul R. Besser ◽  
Christian Witt ◽  
Jean L. Jordan-Sweet

AbstractGlancing-incidence X-ray diffraction (GIXRD) has been applied to the investigation of depth-dependent stress distributions within electroplated Cu films due to overlying capping layers. 0.65 μm thick Cu films plated on conventional barrier and seed layers received a CVD SiCxNyHz cap, an electrolessly-deposited CoWP layer, or a CoWP layer followed by a SiCxNyHz cap. GIXRD and conventional X-ray diffraction measurements revealed that strain gradients were created in Cu films possessing a SiCxNyHz cap, where a greater in-plane tensile stress was generated near the film / cap interface. The constraint imposed by the SiCxNyHz layer during cooling from the cap deposition temperature led to an increase in the in-plane stress of approximately 180 MPa from the value measured in the bulk Cu. However, Cu films possessing a CoWP cap without a SiCxNyHz layer did not exhibit depth-dependent stress distributions. Because the CoWP capping deposition temperature was much lower than that employed in SiCxNyHz deposition, the Cu experienced elastic deformation during the capping process. Cross-sectional transmission electron microscopy indicated that the top surface of the Cu films exhibited extrusions near grain boundaries for the samples undergoing the thermal excursion during SiCxNyHz deposition. The conformal nature of these caps confirmed that the morphological changes of the Cu film surface occurred prior to capping and are a consequence of the thermal excursions associated with cap deposition.


2008 ◽  
Vol 571-572 ◽  
pp. 119-124 ◽  
Author(s):  
M. Rahman ◽  
Michael E. Fitzpatrick ◽  
Lyndon Edwards ◽  
S. Pratihar ◽  
Matthew J. Peel ◽  
...  

There have been many theoretical studies to predict the stress fields around the tip of a growing fatigue crack. However, until recently the highly-localized, small scale nature of the stresses has meant that direct measurement has not been possible. With the current generation of synchrotron X-ray sources, sub-millimetre sampling dimensions are now possible, and it has become possible to evaluate directly the stresses at the tip of a fatigue crack and to see how the stresses evolve as the result of an overload, for example. In this paper we present results of synchrotron X-ray diffraction analysis of the stress fields around a fatigue crack in aluminium alloy 5091 (Al-Mg-Li-C-O); this is a dispersion-strengthened alloy with a fine grain size, which makes it ideal for such experiments. Compact tension (CT) specimens were prepared with constant amplitude fatigue loading. The energy dispersive X-ray diffraction (EDXRD) technique was used for measuring strains around the crack tip along the mid thickness of the specimen under in-situ loading. The measurement was carried out at the ESRF (European Synchrotron Radiation Facility), Grenoble, France on the ID15A beam line. The experimental crack tip stresses have been compared with the analytical fracture mechanics solution.


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