Maintenance Scheduling Based on Accumulated Crack Growth

2009 ◽  
pp. 172-172-16
Author(s):  
AP Berens ◽  
JP Gallagher
Keyword(s):  
Crack Growth ◽  
Maintenance Scheduling

Examination of Fracture Interfaces in Silicon Nitride

1975 ◽  
Vol 33 ◽  
pp. 60-61
Author(s):  
Nancy J. Tighe
Keyword(s):  
Silicon Nitride ◽  
Grain Boundary ◽  
Crack Growth ◽  
Subcritical Crack Growth ◽  
Slow Crack Growth ◽  
Ceramic Materials ◽  
Grain Boundary Sliding ◽  
Boundary Phase ◽  
Turbine Engines ◽  
Boundary Sliding

Silicon nitride is one of the ceramic materials being considered for the components in gas turbine engines which will be exposed to temperatures of 1000 to 1400°C. Test specimens from hot-pressed billets exhibit flexural strengths of approximately 50 MN/m2 at 1000°C. However, the strength degrades rapidly to less than 20 MN/m2 at 1400°C. The strength degradition is attributed to subcritical crack growth phenomena evidenced by a stress rate dependence of the flexural strength and the stress intensity factor. This phenomena is termed slow crack growth and is associated with the onset of plastic deformation at the crack tip. Lange attributed the subcritical crack growth tb a glassy silicate grain boundary phase which decreased in viscosity with increased temperature and permitted a form of grain boundary sliding to occur.

A discrete dislocation analysis of fatigue crack growth

2001 ◽  
Vol 11 (PR5) ◽  
pp. Pr5-69-Pr5-75
Author(s):  
V. S. Deshpande ◽  
H. H.M. Cleveringa ◽  
E. Van der Giessen ◽  
A. Needleman
Keyword(s):  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Discrete Dislocation

Progressive Debonding of Multilayer Interconnect Structures

1997 ◽  
Vol 473 ◽  
Author(s):  
Michael Lane ◽  
Robert Ware ◽  
Steven Voss ◽  
Qing Ma ◽  
Harry Fujimoto ◽  
...  
Keyword(s):  
Thin Films ◽  
Crack Growth ◽  
Driving Force ◽  
Adhesion Energy ◽  
Time Dependent ◽  
Multilayer Thin Films ◽  
Processing Conditions ◽  
Interface Morphology ◽  
Entire Sample ◽  
Crack Growth Velocity

ABSTRACTProgressive (or time dependent) debonding of interfaces poses serious problems in interconnect structures involving multilayer thin films stacks. The existence of such subcriticai debonding associated with environmentally assisted crack-growth processes is examined for a TiN/SiO2 interface commonly encountered in interconnect structures. The rate of debond extension is found to be sensitive to the mechanical driving force as well as the interface morphology, chemistry, and yielding of adjacent ductile layers. In order to investigate the effect of interconnect structure, particularly the effect of an adjacent ductile Al-Cu layer, on subcriticai debonding along the TiN/SiO2 interface, a set of samples was prepared with Al-Cu layer thicknesses varying from 0.2–4.0 μm. All other processing conditions remained the same over the entire sample run. Results showed that for a given crack growth velocity, the debond driving force scaled with Al-Cu layer thickness. Normalizing the data by the critical adhesion energy allowed a universal subcriticai debond rate curve to be derived.

Fatigue Investigation of Elastomeric Structures

2010 ◽  
Vol 38 (3) ◽  
pp. 194-212 ◽  
Author(s):  
Bastian Näser ◽  
Michael Kaliske ◽  
Will V. Mars
Keyword(s):  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Material Behavior ◽  
Period Effect ◽  
Numerical Representation ◽  
Material Force ◽  
Strain Behavior ◽  
Dissipative Effects ◽  
Elastomeric Materials

Abstract Fatigue crack growth can occur in elastomeric structures whenever cyclic loading is applied. In order to design robust products, sensitivity to fatigue crack growth must be investigated and minimized. The task has two basic components: (1) to define the material behavior through measurements showing how the crack growth rate depends on conditions that drive the crack, and (2) to compute the conditions experienced by the crack. Important features relevant to the analysis of structures include time-dependent aspects of rubber’s stress-strain behavior (as recently demonstrated via the dwell period effect observed by Harbour et al.), and strain induced crystallization. For the numerical representation, classical fracture mechanical concepts are reviewed and the novel material force approach is introduced. With the material force approach at hand, even dissipative effects of elastomeric materials can be investigated. These complex properties of fatigue crack behavior are illustrated in the context of tire durability simulations as an important field of application.

Subcritical Crack Growth and Long-Term Strength in Rock and High-Strength and Ultra Low-Permeability Concrete

2009 ◽  
Vol 58 (6) ◽  
pp. 525-532 ◽  
Author(s):  
Yoshitaka NARA ◽  
Masafumi TAKADA ◽  
Daisuke MORI ◽  
Hitoshi OWADA ◽  
Tetsuro YONEDA ◽  
...  
Keyword(s):  
Crack Growth ◽  
Subcritical Crack Growth ◽  
High Strength ◽  
Low Permeability ◽  
Term Strength

Application of the Strip Yield Model to Crack Growth Predictions for Structural Steel

2010 ◽  
Vol 57 (1) ◽  
pp. 1-20
Author(s):  
Małgorzata Skorupa ◽  
Tomasz Machniewicz
Keyword(s):  
Structural Steel ◽  
Crack Growth ◽  
Model Calibration ◽  
Load History ◽  
Yield Model ◽  
Variable Amplitude Loading ◽  
Variable Amplitude ◽  
Constraint Factors ◽  
Strip Yield Model ◽  
Closure Mechanism

Application of the Strip Yield Model to Crack Growth Predictions for Structural SteelA strip yield model implementation by the present authors is applied to predict fatigue crack growth observed in structural steel specimens under various constant and variable amplitude loading conditions. Attention is paid to the model calibration using the constraint factors in view of the dependence of both the crack closure mechanism and the material stress-strain response on the load history. Prediction capabilities of the model are considered in the context of the incompatibility between the crack growth resistance for constant and variable amplitude loading.

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