Deformation Analysis of Boron/Aluminum Specimens by Moire Interferometry

2008 ◽  
pp. 161-161-10 ◽  
Author(s):  
D Post ◽  
Y Guo ◽  
R Czarnek
Keyword(s):  
Moiré Interferometry ◽  
Deformation Analysis ◽  
Moire Interferometry

scholarly journals Thermal Deformation Analysis of Flip-Chip Devices by Moire Interferometry.

2002 ◽  
Vol 5 (7) ◽  
pp. 654-659
Author(s):  
Yasuyuki MORITA ◽  
Kazuo ARAKAWA ◽  
Mitsugu TODO ◽  
Masayuki KANETO
Keyword(s):  
Thermal Deformation ◽  
Flip Chip ◽  
Moiré Interferometry ◽  
Deformation Analysis ◽  
Moire Interferometry

scholarly journals DEFORMATION ANALYSIS OF LASER PROCESSED GRAIN ORIENTED SILICON STEEL SHEET USING MOIRE INTERFEROMETRY

1999 ◽  
Vol 48 (12Appendix) ◽  
pp. 291-295
Author(s):  
Huimin XIE ◽  
Satoshi KISHIMOTO ◽  
Jindong LI ◽  
Daqing ZOU ◽  
Fulong DAI ◽  
...  
Keyword(s):  
Steel Sheet ◽  
Silicon Steel ◽  
Moiré Interferometry ◽  
Deformation Analysis ◽  
Moire Interferometry

Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry

1995 ◽  
Vol 117 (3) ◽  
pp. 185-191 ◽  
Author(s):  
B. Han ◽  
Y. Guo
Keyword(s):  
Mechanical Behavior ◽  
Electronic Packaging ◽  
Early Stage ◽  
High Sensitivity ◽  
Moiré Interferometry ◽  
Deformation Analysis ◽  
Moire Interferometry ◽  
Plated Through Hole ◽  
Chip Carrier

Thermo-mechanical behavior of various levels of electronic packaging products is studied by moire´ and microscopic moire´ interferometry. The global deformations of packages with complex geometries and the local deformations of solder interconnections are determined by displacement measurements of high sensitivity and high spatial resolution. Several packaging studies are reviewed. They include analyses of thin small outline package, leadless chip carrier package, surface mount array package, chip/organic carrier package, deformation near a plated through hole, and determination of an effective CTE. In-situ and quantitative nature of the methods leads to more accurate and realistic understanding of the macro and micro mechanical behavior of packaging assemblies and interconnections, which in turn, facilitates design evaluation and optimization at an early stage of product development.

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