Characterization of Localized Failure Modes in Honeycomb Sandwich Panels Using Indentation

2009 ◽  
pp. 139-139-27 ◽  
Author(s):  
TK Tsotsis ◽  
SM Lee
Keyword(s):  
Failure Modes ◽  
Sandwich Panels ◽  
Honeycomb Sandwich ◽  
Localized Failure

scholarly journals The Bending Responses of Sandwich Panels with Aluminium Honeycomb Core and CFRP Skins Used in Electric Vehicle Body

2018 ◽  
Vol 2018 ◽  
pp. 1-11 ◽  
Author(s):  
Yong Xiao ◽  
Yefa Hu ◽  
Jinguang Zhang ◽  
Chunsheng Song ◽  
Xiangyang Huang ◽  
...  
Keyword(s):  
Electric Vehicle ◽  
Failure Modes ◽  
Sandwich Panels ◽  
Vehicle Body ◽  
Stacking Sequence ◽  
Honeycomb Core ◽  
Fibre Direction ◽  
Element Analysis ◽  
Honeycomb Sandwich ◽  
Carbon Fibre Reinforced Plastic

The aim of this paper was to investigate bending responses of sandwich panels with aluminium honeycomb core and carbon fibre-reinforced plastic (CFRP) skins used in electric vehicle body subjected to quasistatic bending. The typical load-displacement curves, failure modes, and energy absorption are studied. The effects of fibre direction, stacking sequence, layer thickness, and loading velocity on the crashworthiness characteristics are discussed. The finite element analysis (FEA) results are compared with experimental measurements. It is observed that there are good agreements between the FEA and experimental results. Numerical simulations and experiment predict that the honeycomb sandwich panels with ±30° and ±45° fibre direction, asymmetrical stacking sequence (45°/−45°/45°/−45°), thicker panels (0.2 mm∼0.4 mm), and smaller loading velocity (5 mm/min∼30 mm/min) have better crashworthiness performance. The FEA prediction is also helpful in understanding the initiation and propagation of cracks within the honeycomb sandwich panels.

Modeling and characterization of fiber-reinforced plastic honeycomb sandwich panels for highway bridge applications

2001 ◽  
Vol 52 (3-4) ◽  
pp. 441-452 ◽  
Author(s):  
Julio F Davalos ◽  
Pizhong Qiao ◽  
X Frank Xu ◽  
Justin Robinson ◽  
Karl E Barth
Keyword(s):  
Sandwich Panels ◽  
Highway Bridge ◽  
Fiber Reinforced ◽  
Fiber Reinforced Plastic ◽  
Reinforced Plastic ◽  
Honeycomb Sandwich

scholarly journals Design, Manufacturing, and Characterization of Hybrid Carbon/Hemp Sandwich Panels

2021 ◽  
Author(s):  
Luca Boccarusso ◽  
Fulvio Pinto ◽  
Stefano Cuomo ◽  
Dario De Fazio ◽  
Kostas Myronidis ◽  
...  
Keyword(s):  
Composite Structures ◽  
Failure Modes ◽  
Sandwich Panels ◽  
Industrial Applications ◽  
Low Velocity Impact ◽  
Sandwich Composite ◽  
Continuous Manufacturing ◽  
Low Velocity ◽  
Impact Compression

AbstractAdvanced sandwich composite structures that incorporate foams or honeycombs as core materials, have been extensively investigated and used in various applications. One of the major limitations of the conventional materials used is their weak impact resistance and their end-of-life recyclability and overall sustainability. This paper is focused on the study of the production and mechanical characterization of hybrid sandwich panels using hemp bi-grid cores that were manufactured with an ad hoc continuous manufacturing process. Bi-grid structures were stratified in multiple layers, resulting in cores with different thicknesses and planar density. Sandwich panels made with carbon fibers skins were then subjected to Low Velocity Impact, compression and indentation and the damaged panels were investigated via CT-Scan. Results show that the high tailorability of the failure modes and the very good energy absorption properties of the hybrid material open new exciting perspectives for the development of new sandwich structures that can extend the use of natural fibers into several industrial applications.

Compression after impact behavior of titanium honeycomb sandwich structures

2017 ◽  
Vol 20 (5) ◽  
pp. 639-657 ◽  
Author(s):  
Wei Zhao ◽  
Zonghong Xie ◽  
Xiang Li ◽  
Xishan Yue ◽  
Junfeng Sun
Keyword(s):  
Failure Modes ◽  
Sandwich Structures ◽  
Impact Damage ◽  
Sandwich Panels ◽  
Low Velocity Impact ◽  
Impact Behavior ◽  
Failure Strength ◽  
Compressive Failure ◽  
Low Velocity ◽  
Honeycomb Sandwich

Titanium honeycomb sandwich structures are gradually used in several newly developed aircrafts in China. During the manufacturing process and aircraft service life, low-velocity impacts from foreign objects (typically stones, tools and hails, etc.), would quite likely happen and could not be completely avoided. In order to evaluate the influence of low-velocity impact damage on titanium honeycomb sandwich structures, unidirectional in-plane compression tests on both intact and impact damaged sandwich panels were conducted to obtain their failure modes and compressive failure strength. Test results showed that the low-velocity impact damage could cause the change in failure modes and a 9% to 15% decrease in the compressive failure strength. Different impact energy levels showed a limited influence on the compressive failure strength. Numerical analysis was conducted to study the compression after impact behavior of titanium sandwich panels. Parametric finite element models that contained all the geometric and the structural details of honeycomb core cells, as well as the indentation and the crushed core region, were developed in the analysis. The numerical results successfully exhibited the failure process of the intact and impact damaged titanium sandwich panels subjected to unidirectional in-plane compression, similar to what observed in the tests. The predicted compressive failure strength also agreed very well with the test data.

Structural Dynamic Characterization of Metallic Honeycomb Sandwich Panels for Aerospace Applications

2017 ◽  
Author(s):  
Adriano Todorovic Fabro ◽  
Kleverson Sousa ◽  
Marcus Vinicius Girão de Morais ◽  
Sergio Carneiro ◽  
Allan Domingues
Keyword(s):  
Sandwich Panels ◽  
Dynamic Characterization ◽  
Structural Dynamic ◽  
Aerospace Applications ◽  
Honeycomb Sandwich

scholarly journals Static and Fatigue Characterization of Nomex Honeycomb Sandwich Panels

2015 ◽  
Vol 6 (4) ◽  
pp. 81
Author(s):  
B. Keskes ◽  
A. Abbadi ◽  
Z. Azari ◽  
N. Bouaouadja
Keyword(s):  
Sandwich Panels ◽  
Honeycomb Sandwich ◽  
Nomex Honeycomb

Electrical Characterization of Different Failure Modes in Sub-100 nm Devices Using Nanoprobing Technique

2009 ◽  
Author(s):  
E. Hendarto ◽  
S.L. Toh ◽  
J. Sudijono ◽  
P.K. Tan ◽  
H. Tan ◽  
...  
Keyword(s):  
Electron Microscope ◽  
Focused Ion Beam ◽  
Failure Modes ◽  
Ion Beam ◽  
Electrical Characterization ◽  
Nickel Silicide ◽  
Fault Isolation ◽  
Technology Nodes ◽  
Scanning Electron

Abstract The scanning electron microscope (SEM) based nanoprobing technique has established itself as an indispensable failure analysis (FA) technique as technology nodes continue to shrink according to Moore's Law. Although it has its share of disadvantages, SEM-based nanoprobing is often preferred because of its advantages over other FA techniques such as focused ion beam in fault isolation. This paper presents the effectiveness of the nanoprobing technique in isolating nanoscale defects in three different cases in sub-100 nm devices: soft-fail defect caused by asymmetrical nickel silicide (NiSi) formation, hard-fail defect caused by abnormal NiSi formation leading to contact-poly short, and isolation of resistive contact in a large electrical test structure. Results suggest that the SEM based nanoprobing technique is particularly useful in identifying causes of soft-fails and plays a very important role in investigating the cause of hard-fails and improving device yield.

Case Study and Fault Modeling for Wrong Redundancy Evaluation on DRAM Devices

2007 ◽  
Author(s):  
Martin Versen ◽  
Dorina Diaconescu ◽  
Jerome Touzel
Keyword(s):  
Failure Mode ◽  
Failure Modes ◽  
Fault Modeling ◽  
Mode Analysis ◽  
Root Cause ◽  
Failure Mode Analysis

Abstract The characterization of failure modes of DRAM is often straight forward if array related hard failures with specific addresses for localization are concerned. The paper presents a case study of a bitline oriented failure mode connected to a redundancy evaluation in the DRAM periphery. The failure mode analysis and fault modeling focus both on the root-cause and on the test aspects of the problem.

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