Wear Reductions and Contact Interface Observations for Carbon Samples Sliding Against Wavy and Smooth Copper Surfaces

2009 ◽  
pp. 32-32-14 ◽  
Author(s):  
MD Bryant ◽  
J-W Lin
Keyword(s):  
Contact Interface ◽  
Copper Surfaces

THE ADSORPTION SITE OF FORMATE (HCOO) ON COPPER SURFACES

1986 ◽  
Vol 47 (C8) ◽  
pp. C8-487-C8-490
Author(s):  
M. D. CRAPPER ◽  
C. E. RILEY ◽  
D. P. WOODRUFF
Keyword(s):  
Adsorption Site ◽  
Copper Surfaces

BRUSHFORM 65

Alloy Digest ◽  
2013 ◽  
Vol 62 (6) ◽  
Keyword(s):  
Physical Properties ◽  
Tensile Properties ◽  
Contact Force ◽  
Temperature Rise ◽  
Power Loss ◽  
High Reliability ◽  
Superior Performance ◽  
Contact Interface ◽  
Resistive Heating ◽  
Computer Power

Abstract BrushForm 65 is designed for both superior performance and high reliability in appliance, automotive, and computer power applications. Alloy BF-65’s combination of properties limits power loss at the contact interface, controls temperature rise from resistive heating, and provides stable contact force at temperatures to 200 C (390 F). This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties as well as fatigue. It also includes information on forming. Filing Code: Cu-821. Producer or source: Materion Brush Performance Alloys.

Improving the Organic Semiconductor- Metal Contact Interface in Printed High Performance Organic TFTs

2012 ◽  
Vol 1402 ◽  
Author(s):  
Kanan Puntambekar ◽  
Lisa Stecker ◽  
Kurt Ulmer ◽  
Themistokles Afentakis ◽  
Steven Droes
Keyword(s):  
Organic Semiconductor ◽  
High Performance ◽  
Thin Film Transistor ◽  
Device Performance ◽  
Organic Thin Film ◽  
Contact Interface ◽  
Organic Thin Film Transistor ◽  
Metal Electrodes ◽  
Free Surfaces ◽  
Gas Plasma

ABSTRACTOptimization of the interface between the organic semiconductor (OSC) & the source-drain (S/D) electrode is critical in order to improve organic thin film transistor (OTFT) device performance. This process typically involves coating the metal S/D electrodes with an optimal self-assembled thiol layer; a process that requires pristine metal surfaces for successful treatment. Obtaining contamination free surfaces can be challenging in the case of printed metal electrodes. Here we demonstrate an effective strategy to address this issue by introducing a brief low power forming gas plasma treatment prior to the surface coating step. We show a two orders of magnitude decrease in the contact resistance as a result of this treatment.

Friction Force and Stresses Analysis for Contact of Assembled Details

2006 ◽  
Vol 113 ◽  
pp. 334-338
Author(s):  
Z. Dreija ◽  
O. Liniņš ◽  
Fr. Sudnieks ◽  
N. Mozga
Keyword(s):  
Mechanical Properties ◽  
Surface Roughness ◽  
Plastic Deformation ◽  
Friction Force ◽  
Sliding Friction ◽  
Friction Model ◽  
Contact Interface ◽  
Finite Element Program ◽  
Elastic Plastic ◽  
Element Program

The present work deals with the computation of surface stresses and deformation in the presence of friction. The evaluation of the elastic-plastic contact is analyzed revealing three distinct stages that range from fully elastic through elastic-plastic to fully plastic contact interface. Several factors of sliding friction model are discussed: surface roughness, mechanical properties and contact load and areas that have strong effect on the friction force. The critical interference that marks the transition from elastic to elastic- plastic and plastic deformation is found out and its connection with plasticity index. A finite element program for determination contact analysis of the assembled details and due to details of deformation that arose a normal and tangencial stress is used.

The Use of Ratio-Recording Interferometry for the Measurement of Infrared Emission Spectra: Applications to Oxide Films on Copper Surfaces

1975 ◽  
Vol 29 (6) ◽  
pp. 496-500 ◽  
Author(s):  
D. Kember ◽  
N. Sheppard
Keyword(s):  
Emission Spectra ◽  
Black Body ◽  
Infrared Emission ◽  
Thin Layers ◽  
Oxide Surface ◽  
Surface Layers ◽  
Selective Reflection ◽  
Copper Surfaces ◽  
Emission And Absorption Spectra ◽  
Direct Correspondence

Infrared emission spectra from metal samples with oxide surface layers are shown to be very advantageously studied using the spectrum-ratioing facility of a recording infrared interferometer. The emission from a given sample is ratioed against that from a black-body emitter at the same temperature so as to give emittance as a function of wavenumber directly. This method has very useful application to irregularly shaped metal emitters. In the absence of selective reflection there is a direct correspondence between emission and absorption spectra for thin layers of an emitting substance. However, the presence of selective reflection leads to reduced emission and to considerable differences in the appearance of “absorption” and emission spectra in regions of strong absorption. Emission spectra obtained from copper plates heated, above 150°C, for different periods in air are shown clearly to indicate the presence of cuprous, Cu(I), and cupric, Cu(II), oxides in the surface layer.

Engineering the Band Offsets at the Back Contact Interface for Efficient Kesterite CZTSSe Solar Cells

2020 ◽  
Vol 3 (11) ◽  
pp. 10976-10982
Author(s):  
Afei Zhang ◽  
Zhaoyang Song ◽  
Zhengji Zhou ◽  
Yueqing Deng ◽  
Wenhui Zhou ◽  
...  
Keyword(s):  
Solar Cells ◽  
Back Contact ◽  
Contact Interface ◽  
Band Offsets

scholarly journals Anti-Galling Cold, Dry Forging of Pure Titanium by Plasma-Carburized AISI420J2 Dies

2021 ◽  
Vol 11 (2) ◽  
pp. 595
Author(s):  
Tatsuhiko Aizawa ◽  
Tomoaki Yoshino ◽  
Yohei Suzuki ◽  
Tomomi Shiratori
Keyword(s):  
Pure Titanium ◽  
Solid Lubrication ◽  
Cold Forging ◽  
Contact Interface ◽  
Metallic Titanium ◽  
Low Friction ◽  
Debris Particles ◽  
Titanium Wire ◽  
Oxide Debris

A bare AISI420J2 punch often suffers from severe adhesion of metallic titanium as well as titanium oxide debris particles in dry, cold forging of biomedical titanium alloys. This punch was plasma-carburized at 673 K for 14.4 ks to harden it up to 1200 HV on average and to achieve carbon supersaturation in the carburized layer. This plasma-carburized punch was employed in the cold, dry forging of a pure titanium wire into a flat plate while reducing the thickness by 70%. The contact interface width approached the forged workpiece width with increasing the reduction ratio. This smaller bulging deformation reveals that the workpiece is upset by homogeneous plastic flow with a lower friction coefficient. This low-friction and anti-galling forging process was sustained by an in situ solid lubrication mechanism. Unbound free carbon was isolated from the carbon-supersaturated AISI420J2 matrix and deposited as a thin tribofilm to protect the contact interface from mass transfer of metallic titanium.

Sign in / Sign up

Export Citation Format

Share Document