Advanced Methods of Coating Adhesion Testing

Author(s):  
NV Gitis ◽  
J Xiao ◽  
M Vinogradov
2005 ◽  
Vol 2 (9) ◽  
pp. 12958
Author(s):  
NV Gitis ◽  
J Xiao ◽  
M Vinogradov

1997 ◽  
Vol 473 ◽  
Author(s):  
H. S. Yang ◽  
F. R. Brotzen ◽  
D. L. Callahan ◽  
C. F. Dunn

ABSTRACTQuantitative measurement of the adhesion strength of thin film metallizations has been achieved by a novel technique employing electrostatic forces to generate delaminating stresses. This technique has been used in testing the adhesion of Al-Cu, Cu, and Al multilayer films deposited on Si. Micro-blister-type failure is revealed by scanning electron microscopy. The delamination process and the geometry of the blister are discussed. The measured adhesion data fit a Weibull distribution function.


2021 ◽  
Vol 158 ◽  
pp. 106335
Author(s):  
ChuanXing Wang ◽  
YuYing Han ◽  
Wenxue Wang ◽  
Juan Liu ◽  
Ning Wang ◽  
...  

2016 ◽  
Author(s):  
Vladimir A. Slabodchikov ◽  
Dmitry P. Borisov ◽  
Vladimir M. Kuznetsov

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