The Effect of Multi-Walled Carbon Nanotubes Reinforcement and Multiple Reflow Cycles on Shear Strength of SAC305 Lead-Free Solder Alloy

2019 ◽  
Vol 8 (3) ◽  
pp. 20180044
Author(s):  
Sanjay Tikale ◽  
K. Narayan Prabhu
Keyword(s):  
Carbon Nanotubes ◽  
Shear Strength ◽  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Multi Walled Carbon Nanotubes ◽  
Lead Free Solder Alloy ◽  
Free Solder ◽  
Multiple Reflow Cycles ◽  
Walled Carbon Nanotubes

Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate

2015 ◽  
Vol 830-831 ◽  
pp. 215-218 ◽  
Author(s):  
Sanjay Tikale ◽  
Mrunali Sona ◽  
K.N. Prabhu
Keyword(s):  
Shear Strength ◽  
Solder Alloy ◽  
Copper Substrate ◽  
Bulk Solder ◽  
Lead Free ◽  
Lead Free Solder ◽  
Reflow Time ◽  
Bond Shear Strength ◽  
Lead Free Solder Alloy ◽  
Free Solder

Lead-free solders are environment friendly and are in great demand for microelectronic applications. In the present study, Sn-9Zn lead free solder alloy was solidified on Cu substrate for different reflow times from 10 to 1000s. The influence of reflow time on wetting, formation of intermetallic compounds (IMCs) and bond shear strength was studied using dynamic contact angle analyzer, bond tester and scanning electron microscopy. The results indicate that, the wettability of the solder alloy increased with increase in reflow time. Microstructure study revealed the presence of Cu5Zn8 and CuZn5 IMCs at the interface. The thickness of an IMC increased with increase in the reflow time. The mean thickness of about 11μm for Cu5Zn8 IMC layer was observed for the reflow time of 1000s. The thickness of CuZn5 layer increased up to a reflow time of 100s and decreases thereafter. The bond shear strength increased up to 100s and decreased with increase in reflow time. The decrement in shear strength at higher reflow time is mainly due to excessive thickness of Cu5Zn8 IMC layer and diffusion of Sn from bulk solder towards the substrate. The excessive thick IMC layer exhibited pre micro-cracks led to the brittle failure of bond under the influence of shear stress.

A review: Effect of nanoparticles addition on the properties of Sn-Ag-Cu lead free solder alloy

2021 ◽  
Author(s):  
M. N. Ervina Efzan ◽  
M. M. Nur Haslinda ◽  
M. M. Al Bakri Abdullah
Keyword(s):  
Solder Alloy ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder
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