Real and Effective Heat Transfer Coefficients (HTCs) Used for Computer Simulation of Transient Nucleate Boiling Processes during Quenching

2012 ◽  
Vol 1 (1) ◽  
pp. 104656 ◽  
Author(s):  
Nikolai I. Kobasko
1962 ◽  
Vol 84 (4) ◽  
pp. 365-371 ◽  
Author(s):  
H. S. Swenson ◽  
J. R. Carver ◽  
G. Szoeke

In large, subcritical pressure, once-through power boilers heat is transferred to steam and water mixtures ranging in steam quality from zero per cent at the bottom of the furnace to 100 per cent at the top. In order to provide design information for this type of boiler, heat-transfer coefficients for forced convection film boiling were determined for water at 3000 psia flowing upward in a vertical stainless-steel tube, AISI Type 304, having an inside diameter of 0.408 inches and a heated length of 6 feet. Heat fluxes ranged between 90,000 and 180,000 Btu/hr-sq ft and were obtained by electrical resistance heating of the tube. The operation of the experimental equipment was controlled so that nucleate boiling, transition boiling, and stable film boiling occurred simultaneously in different zones of the tube. The film boiling data were correlated with a modified form of the equation Nu = a a(Re)m(Pr)n using steam properties evaluated at inside surface temperature. Results of a second series of heat-transfer tests with tubes having a helical rib on the inside surface showed that nucleate boiling could be maintained to much higher steam qualities with that type of tube than with a smooth-bore tube.


2000 ◽  
Author(s):  
Edward V. McAssey ◽  
Jinfeng Wu ◽  
Thomas Dougherty ◽  
Bao Wen Yang

Abstract Data are presented for sub-cooled boiling of water in the range of two to four atmospheres. The results show that the sharp increase in heat transfer coefficient associated with nucleate boiling occurs at wall superheats of 20 °C to 30 °C. Comparisons between experimental and predicted heat transfer coefficients are also presented. The two prediction methods examined are the Chen correlation and the Kandlikar correlation.


2004 ◽  
Vol 120 ◽  
pp. 269-276
Author(s):  
M. Maniruzzaman ◽  
R. D. Sisson

Quenching heat treatment in a liquid medium is a very complex heat transfer process. Heat extraction from the part surface occurs through several different heat transfer mechanisms in distinct temperature ranges, namely, film boiling, partial film boiling (i.e. transition), nucleate boiling and convection. The maximum heat transfer occurs during the nucleate boiling stage. Experimental study shows that, the effective surface heat transfer coefficient varies more than two orders of magnitude with the temperature during the quenching. For quenching process simulation, accurate prediction of the time-temperature history and microstructure evolution within the part largely depends on the accuracy of the boundary condition supplied. The heat transfer coefficient is the most important boundary condition for process simulation. This study focuses on creating a database of heat transfer coefficients for various liquid quenchant-metallic alloy combinations through experimentation using three different quench probes. This database is a web-based tool for use in quench process simulation. It provides at-a-glance information for quick and easy analysis and sets the stage for a Decision Support System (DSS) and Data Mining for heat-treating process.


1990 ◽  
Vol 112 (3) ◽  
pp. 538-546 ◽  
Author(s):  
S. G. Bankoff

This review covers the dynamics and tendency toward rupture of thin evaporating liquid films on a heated surface. Very large heat transfer coefficients can be obtained. The applications include various boiling heat transfer and film cooling devices. A relatively new area for study is heat transfer through ultrathin films, which are less than 100 nm in thickness, and hence subject to van der Waals and other long-range molecular forces. Some recent work employing lubrication theory to obtain an evolution equation for the growth of a surface wave is described. Earlier phenomenological work is briefly discussed, as well as the connection between forced-convection subcooled nucleate boiling and thin-film heat transfer.


Micromachines ◽  
2021 ◽  
Vol 12 (8) ◽  
pp. 980
Author(s):  
Kairui Tang ◽  
Jingjing Bai ◽  
Siyu Chen ◽  
Shiwei Zhang ◽  
Jie Li ◽  
...  

With the rapid development of electronics, thermal management has become one of the most crucial issues. Intense research has focused on surface modifications used to enhance heat transfer. In this study, multilayer copper micromeshes (MCMs) are developed for commercial compact electronic cooling. Boiling heat transfer performance, including critical heat flux (CHF), heat transfer coefficients (HTCs), and the onset of nucleate boiling (ONB), are investigated. The effect of micromesh layers on the boiling performance is studied, and the bubbling characteristics are analyzed. In the study, MCM-5 shows the highest critical heat flux (CHF) of 207.5 W/cm2 and an HTC of 16.5 W(cm2·K) because of its abundant micropores serving as nucleate sites, and outstanding capillary wicking capability. In addition, MCMs are compared with other surface structures in the literature and perform with high competitiveness and potential in commercial applications for high-power cooling.


1993 ◽  
Vol 115 (1) ◽  
pp. 78-88 ◽  
Author(s):  
C. O. Gersey ◽  
I. Mudawar

The effects of chip protrusion on the forced-convection boiling and critical heat flux (CHF) of a dielectric coolant (FC-72) were investigated. The multi-chip module used in the present study featured a linear array of nine, 10 mm x 10 mm, simulated microelectronic chips which protruded 1 mm into a 20-mm wide side of a rectangular flow channel. Experiments were performed in vertical up flow with 5-mm and 2-mm channel gap thicknesses. For each configuration, the velocity and subcooling of the liquid were varied from 13 to 400 cm/s and 3 to 36° C, respectively. The nucleate boiling regime was not affected by changes in velocity and subcooling, and critical heat flux generally increased with increases in either velocity or subcooling. Higher single-phase heat transfer coefficients and higher CHF values were measured for the protruded chips compared to similar flush-mounted chips. However, adjusting the data for the increased surface area and the increased liquid velocity above the chip caused by the protruding chips yielded a closer agreement between the protruded and flush-mounted results. Even with the velocity and area adjustments, the most upstream protruded chip had higher single-phase heat transfer coefficients and CHF values for high velocity and/or highly-subcooled flow as compared the downstream protruded chips. The results show that, except for the most upstream chip, the performances of protruded chips are very similar to those of flush-mounted chips.


1999 ◽  
Vol 122 (4) ◽  
pp. 678-690 ◽  
Author(s):  
L. D. Clark ◽  
K. Davey ◽  
I. Rosindale ◽  
S. Hinduja

A mesh partitioning strategy is presented which facilitates the application of boundary conditions to irregular shaped cooling channels in the pressure diecasting process. The strategy is used to partition a boundary element mesh, but can also be applied to the surface of a cooling channel bounded by a finite element mesh. The partitioning of the mesh into a series of element packs enables a one-dimensional flow model to be applied to the coolant. The flow model is used in conjunction with a steady-state thermal model which initially assumes that no boiling is taking place on the die/coolant interface. Values of bulk temperature, pressure, and velocity in the coolant are thus ascertained. This information, together with die temperatures, is then used in empirical relationships which model the various heat transfer mechanisms, including nucleate and transitional film boiling, between die and coolant. Effective heat transfer coefficients are calculated and applied at the die/coolant interface. The steady-state thermal code and the empirical boiling model are then used iteratively until stable values for the effective heat transfer coefficients are obtained. The models are tested by casting a small thin component using a die with conventional cooling channels and also using a novel die with irregular shaped cooling channels running on a hot chamber proprietary die casting machine. Simulation results are shown and experimental results using the hot chamber pressure die casting machine are reported. [S1087-1357(00)02302-9]


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