New Method of Monitoring Tunnel Feet-Lock Pipe (TFP) Mechanics Using Fiber Bragg Grating (FBG)

2018 ◽  
Vol 48 (4) ◽  
pp. 20170364 ◽  
Author(s):  
Yanbin Luo ◽  
Pengsheng Diao ◽  
Jianxun Chen ◽  
Dong Li ◽  
Yalong Guo ◽  
...  
2006 ◽  
Author(s):  
Jian-wei Fu ◽  
Li-zhi Xiao ◽  
Yuan-zhong Zhang ◽  
Xiao-liang Zhao ◽  
Hai-feng Chen

2021 ◽  
Vol 2101 (1) ◽  
pp. 012023
Author(s):  
Xiao Huang ◽  
Zhenkun Jin ◽  
Qing Shen

Abstract Fiber Bragg Grating (FBG) has been widely used in temperature and strain measurement. Its center wavelength drift is affected by both temperature and strain. The influence of temperature and strain on center wavelength should be decoupled when measuring. In this paper, the sensing characteristics of FBG which pasted at different angles were simulated and analyzed, and it was found that FBG sensing for strain has strong directivity. A dual FBG composite construction based on the directivity of FBG sensing was proposed. Two FBGs were at an Angle of 62°. One FBG was sensitive to both temperature and strain, and the other was only sensitive to temperature. The structure can realize the decoupling of temperature and strain, and it doesn’t depend on feature of cantilever beam. It was verified by experimental analysis that the decoupling result was good by utilizing the combined FBG structure, and decoupling was realized easily.


2009 ◽  
Author(s):  
Bing Zhao ◽  
Zhi-Li Zhang ◽  
Qi-Yuan Zhong ◽  
Hongliang Tu ◽  
Lilong Tan

Mechatronics ◽  
2015 ◽  
Vol 31 ◽  
pp. 22-29 ◽  
Author(s):  
Mingyao Liu ◽  
Zhijian Zhang ◽  
Zude Zhou ◽  
Shuang Peng ◽  
Yuegang Tan

2021 ◽  
Author(s):  
Rasha Hussain

Maintaining structural integrity is an important issue for advanced flip chip ball grid array (FC-BFA) packages especially due to the use of Pb-free solder replacing the Pb-contained solders and the large package size induced mechanical vulnerability. For such packages, the mechanical bending causes fracture in the interconnecting plastic PWB. To determine the critical load becomes a challenge to assembly manufacturers since the conventional testing methods based on monitoring electric continuity of the daisy chained solder joints fail to detect the PWB de-bonding near the interconnect. This thesis researches a new method that uses the Fiber Bragg Grating sensor to detect the interconnect fracture failure of 55 mm lead-free FC-BGA under four-point bend test. Experimental setups and procedures are studied, a proper test configuration is determined and a series of testing performed. The validity of the new method in monitoring the solder joint de-bonding is proved through analyzing the test results, which shows that the FBG sensors are sensitive to capture the onset of the fracture in different cases.


2021 ◽  
Author(s):  
Rasha Hussain

Maintaining structural integrity is an important issue for advanced flip chip ball grid array (FC-BFA) packages especially due to the use of Pb-free solder replacing the Pb-contained solders and the large package size induced mechanical vulnerability. For such packages, the mechanical bending causes fracture in the interconnecting plastic PWB. To determine the critical load becomes a challenge to assembly manufacturers since the conventional testing methods based on monitoring electric continuity of the daisy chained solder joints fail to detect the PWB de-bonding near the interconnect. This thesis researches a new method that uses the Fiber Bragg Grating sensor to detect the interconnect fracture failure of 55 mm lead-free FC-BGA under four-point bend test. Experimental setups and procedures are studied, a proper test configuration is determined and a series of testing performed. The validity of the new method in monitoring the solder joint de-bonding is proved through analyzing the test results, which shows that the FBG sensors are sensitive to capture the onset of the fracture in different cases.


Measurement ◽  
2018 ◽  
Vol 127 ◽  
pp. 431-435 ◽  
Author(s):  
Yong Ding ◽  
Qingxiong Yao ◽  
Zhendong Zhang ◽  
Xin Wang ◽  
Tengteng Yan ◽  
...  

2010 ◽  
Vol 18 (3) ◽  
pp. 2646 ◽  
Author(s):  
Xia Fang ◽  
X. Y. He ◽  
C. R. Liao ◽  
Minwei Yang ◽  
D. N. Wang ◽  
...  

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