Effect of Low Temperature on Tensile Strength and Mode I Fracture Energy of a Room Temperature Vulcanizing Silicone Adhesive

2015 ◽  
Vol 44 (3) ◽  
pp. 20140208 ◽  
Author(s):  
E. A. S. Marques ◽  
M. D. Banea ◽  
Lucas F. M. da Silva ◽  
R. J. C. Carbas ◽  
C. Sato
Keyword(s):  
Tensile Strength ◽  
Low Temperature ◽  
Fracture Energy ◽  
Room Temperature ◽  
Mode I ◽  
Mode I Fracture ◽  
Silicone Adhesive

scholarly journals Comparative study of elastic properties and mode I fracture energy of carbon nanotube/epoxy and carbon fibre/epoxy laminated composites

2020 ◽  
Vol 8 (1) ◽  
Author(s):  
Jyotikalpa Bora ◽  
Sushen Kirtania
Keyword(s):  
Carbon Nanotube ◽  
Carbon Fibre ◽  
Fracture Energy ◽  
Elastic Properties ◽  
Volume Fraction ◽  
Laminated Composites ◽  
Laminated Composite ◽  
Fe Analysis ◽  
Mode I ◽  
Mode I Fracture

Abstract A comparative study of elastic properties and mode I fracture energy has been presented between conventional carbon fibre (CF)/epoxy and advanced carbon nanotube (CNT)/epoxy laminated composite materials. The volume fraction of CNT fibres has been considered as 15%, 30%, and 60% whereas; the volume fraction of CF has been kept constant at 60%. Three stacking sequences of the laminates viz.[0/0/0/0], [0/90/0/90] and [0/30/–30/90] have been considered in the present analysis. Periodic microstructure model has been used to calculate the elastic properties of the laminated composites. It has been observed analytically that the addition of only 15% CNT in epoxy will give almost the same value of longitudinal Young’s modulus as compared to the addition of 60% CF in epoxy. Finite element (FE) analysis of double cantilever beam specimens made from laminated composite has also been performed. It has been observed from FE analysis that the addition of 15% CNT in epoxy will also give almost the same value of mode I fracture energy as compared to the addition of 60% CF in epoxy. The value of mode I fracture energy for [0/0/0/0] laminated composite is two times higher than the other two types of laminated composites.

scholarly journals Low temperature mixed-mode debond fracture and fatigue characterisation of foam core sandwich

2018 ◽  
Vol 22 (4) ◽  
pp. 1039-1054 ◽  
Author(s):  
Arash Farshidi ◽  
Christian Berggreen ◽  
Leif A Carlsson
Keyword(s):  
Fracture Toughness ◽  
Growth Rate ◽  
Low Temperature ◽  
Mixed Mode ◽  
Room Temperature ◽  
Sliding Mode ◽  
Fatigue Tests ◽  
Mode I ◽  
Foam Core ◽  
Climatic Chamber

This paper experimentally investigates the effects of low temperature on fracture toughness and fatigue debond growth rate in foam core sandwich composites. Mixed-mode bending specimens were statically and cyclically tested inside a climatic chamber at a low temperature (−20°C) and at room temperature (23°C) as a reference. Testing was conducted in mode I (opening) and mixed-mode I/II (opening-sliding) mode mixities. The fatigue tests results are presented according to the modified Paris–Erdogan relation. Results showed substantial fracture toughness reduction due to low temperature. Low temperature furthermore elevated the cyclic crack growth rate.

Organic Solvent Fumigation Bonding for Multi-Layer Poly(methyl Methacrylate) Microfluidic Device

2014 ◽  
Vol 609-610 ◽  
pp. 654-659 ◽  
Author(s):  
He Zhang ◽  
Xiao Wei Liu ◽  
Li Tian ◽  
Xiao Wei Han ◽  
Yao Liu
Keyword(s):  
Low Temperature ◽  
Organic Solvent ◽  
Methyl Methacrylate ◽  
Room Temperature ◽  
Microfluidic Devices ◽  
Saturated Steam ◽  
Silicone Adhesive ◽  
Cover Sheet ◽  
Temperature And Pressure ◽  
Bonding Method

In this paper, a novel bonding method for microfluidic devices was presented. The organic solvent fumigation bonding method can be used to produce multi-layer PMMA microfluidic devices under the condition of room temperature and low pressure. During the bonding, we choose chloroform as bonding solvents, the polyimide tape was used to protect no-need-bonding side of the cover sheet and the sealant silicone adhesive was used to protect the microstructure in the bonding side. The substrate was fumigated for 5minutes in the saturated steam conditions, then remove the polyimide tape as well as the sealant silicone adhesive. Assemble the fumigation cover sheet to the substrate with microchannel by using fixtures, soon after put the fixture and the substrates into the oven, dried at 50 °C for 10 minutes. Finally, remove the fixture, the bonding complete. Because of the bonding was accomplished under conditions of low temperature and pressure, the deformation of microchannel is very small. When the method was used for multilayer chip bonding, it also achieved good results.

scholarly journals Effects of Temperature on the Relationship between Mode-I Fracture Toughness and Tensile Strength of Rock

2019 ◽  
Vol 9 (7) ◽  
pp. 1326 ◽  
Author(s):  
Gan Feng ◽  
Xiao-chuan Wang ◽  
Yong Kang ◽  
Shi-gang Luo ◽  
Yao-qing Hu
Keyword(s):  
Fracture Toughness ◽  
Tensile Strength ◽  
Theoretical Research ◽  
Mode I ◽  
Mode I Fracture ◽  
Positive Correlation ◽  
Mode I Fracture Toughness ◽  
Heat Treated ◽  
Different Temperatures ◽  
The Relationship

Fracture toughness is used to characterize rock resistance to fracturing and it is important in theoretical research and engineering applications. Mode-I fracture toughness can be predicted on the basis of an empirical relationship between fracture toughness (KIC) and tensile strength (σt). In underground engineering, rocks are often subjected to different temperatures. Therefore, this paper explores the effect of temperature on the relationship between mode-I fracture toughness and tensile strength. The results show that the change trends in the KIC and σt values of rocks at temperatures from 20 °C to 600 °C are broadly consistent with each other. For rocks heat-treated to the same temperature, the KIC of the rock increases with an increase in σt. This positive correlation between KIC and σt is different in rocks heat-treated to different temperatures. Critical crack propagation radius (rIC) is an important factor in the relationship between KIC and σt and is related to the type of rock and the conditions under which it is tested. For the same rock, rIC is quite different after it has been exposed to different temperatures. The positive correlation between KIC and σt results from a similarity in the fracture morphology and properties of failure when rock is destroyed in fracture and tensile tests.

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