Measurement of Apparent Thermal Conductivity by the Thermal Probe Method

2000 ◽  
Vol 28 (5) ◽  
pp. 345 ◽  
Author(s):  
DR Petersen ◽  
RE Link ◽  
K Manohar ◽  
DW Yarbrough ◽  
JR Booth
1999 ◽  
Vol 45 (150) ◽  
pp. 346-351 ◽  
Author(s):  
A. K. Singh

AbstractThermal conductivity of snow has been investigated experimentally using the thermal-probe method, which is a transient method of measurement. The measurements have been made over a wide range of snow density (for fresh and dense snow), for varying temperatures and for different conditions of water content, snow-grain type, etc., both in the field and in the laboratory. The results are presented along with detailed sample descriptions. Thermal conductivity of snow increases with density and water content. It also increases with temperature, and the effect is more pronounced for temperatures between –15° and 0°C.


1999 ◽  
Vol 45 (150) ◽  
pp. 346-351 ◽  
Author(s):  
A. K. Singh

AbstractThermal conductivity of snow has been investigated experimentally using the thermal-probe method, which is a transient method of measurement. The measurements have been made over a wide range of snow density (for fresh and dense snow), for varying temperatures and for different conditions of water content, snow-grain type, etc., both in the field and in the laboratory. The results are presented along with detailed sample descriptions. Thermal conductivity of snow increases with density and water content. It also increases with temperature, and the effect is more pronounced for temperatures between –15° and 0°C.


Cryogenics ◽  
2021 ◽  
pp. 103300
Author(s):  
Yang Biao ◽  
Xi Xiaotong ◽  
Liu Xuming ◽  
Xu Xiafan ◽  
Chen Liubiao ◽  
...  

Holzforschung ◽  
2008 ◽  
Vol 62 (1) ◽  
pp. 91-98 ◽  
Author(s):  
Johannes Konnerth ◽  
David Harper ◽  
Seung-Hwan Lee ◽  
Timothy G. Rials ◽  
Wolfgang Gindl

Abstract Cross sections of wood adhesive bonds were studied by scanning thermal microscopy (SThM) with the aim of scrutinizing the distribution of adhesive in the bond line region. The distribution of thermal conductivity, as well as temperature in the bond line area, was measured on the surface by means of a nanofabricated thermal probe offering high spatial and thermal resolution. Both the thermal conductivity and the surface temperature measurements were found suitable to differentiate between materials in the bond region, i.e., adhesive, cell walls and embedding epoxy. Of the two SThM modes available, the surface temperature mode provided images with superior optical contrast. The results clearly demonstrate that the polyurethane adhesive did not cause changes of thermal properties in wood cell walls with adhesive contact. By contrast, cell walls adjacent to a phenol-resorcinol-formaldehyde adhesive showed distinctly changed thermal properties, which is attributed to the presence of adhesive in the wood cell wall.


2018 ◽  
Vol 63 (11) ◽  
pp. 4277-4279 ◽  
Author(s):  
Georgia J. Tertsinidou ◽  
Chrysi M. Tsolakidou ◽  
Maria Pantzali ◽  
Marc J. Assael ◽  
Laura Colla ◽  
...  

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