Ultrasonic Monitoring of a Low-Temperature Diffusion Bonding Process

2000 ◽  
Vol 28 (2) ◽  
pp. 88 ◽  
Author(s):  
DR Petersen ◽  
RE Link ◽  
Y Greenberg ◽  
D Itzhak ◽  
G Kohn
Keyword(s):  
Low Temperature ◽  
Diffusion Bonding ◽  
Bonding Process ◽  
Ultrasonic Monitoring ◽  
Temperature Diffusion

scholarly journals A Low-Temperature Alumina/Copper Diffusion Bonding Process using La-Doped Titanium Interlayers

Coatings ◽  
2018 ◽  
Vol 8 (11) ◽  
pp. 401 ◽  
Author(s):  
Cherng-Yuh Su ◽  
Jia-Liang Huang ◽  
Po-Chun Chen ◽  
Hsin-Jung Yu ◽  
Dai-Liang Ma ◽  
...  
Keyword(s):  
Low Temperature ◽  
Diffusion Bonding ◽  
Bonding Temperature ◽  
Oxygen Affinity ◽  
Temperature Stability ◽  
High Strength ◽  
High Temperature Stability ◽  
Transmission Electron ◽  
Temperature Diffusion ◽  
La Doped

Ceramic-to-metal heterojunctions have been established to improve high-temperature stability for applications in aerospace and harsh environments. In this work, we employed low-temperature diffusion bonding to realize an alumina/Cu heterogeneous joint. Using a thin layer of lanthanum-doped titanium (La-doped Ti) to metallize the alumina surface, we achieved the bonding at a temperature range of 250–350 °C. We produced a uniform, thermally stable, and high-strength alumina/Cu joint after a hot-press process in vacuum. Signals from X-ray diffraction (XRD) suggested the successful diffusion of Ti and La into the alumina substrate, as Ti can easily substitute Al in alumina, and La has a better oxygen affinity than that of Al. The transmission electron microscopy and XRD results also showed the existence of CuxTiyO phases without CuxTiy or LaOx. In addition, the bonding strength of alumina/copper hot-pressed at 250, 300, and 350 °C were 7.5, 9.8 and 15.0 MPa, respectively. The process developed in this study successfully lowered the bonding temperature for the alumina/copper joint.

Low temperature diffusion bonding of stainless steel

2010 ◽  
Vol 63 (6) ◽  
pp. 853-857 ◽  
Author(s):  
P. S. Gawde ◽  
R. Kishore ◽  
A. L. Pappachan ◽  
G. B. Kale ◽  
G. K. Dey
Keyword(s):  
Stainless Steel ◽  
Low Temperature ◽  
Diffusion Bonding ◽  
Temperature Diffusion

Ultrasonic On-Line Monitoring and Mapping of Low-Temperature Diffusion Bonding of 6061-T6 Aluminum

1998 ◽  
pp. 245-250 ◽  
Author(s):  
G. Kohn ◽  
Y. Greenberg ◽  
O. Tevet ◽  
O. Yeheskel ◽  
Y. Feuerlicht ◽  
...  
Keyword(s):  
Low Temperature ◽  
Diffusion Bonding ◽  
Temperature Diffusion ◽  
On Line
Sign in / Sign up

Export Citation Format

Share Document