Spectrum Fatigue Testing and Small-Crack Life Prediction Analysis on a Coupon Similar to a Critical Design Detail of a CF188 Hornet Component

2004 ◽  
Vol 1 (9) ◽  
pp. 19032
Author(s):  
M Yanishevsky ◽  
RA Everett
Keyword(s):  
Life Prediction ◽  
Fatigue Testing ◽  
Small Crack ◽  
Prediction Analysis ◽  
Critical Design ◽  
Design Detail

scholarly journals Experimental Design and Validation of an Accelerated Random Vibration Fatigue Testing Methodology

2015 ◽  
Vol 2015 ◽  
pp. 1-13 ◽  
Author(s):  
Yu Jiang ◽  
Gun Jin Yun ◽  
Li Zhao ◽  
Junyong Tao
Keyword(s):  
Fatigue Life ◽  
Stress Responses ◽  
Life Prediction ◽  
Random Vibration ◽  
Fatigue Testing ◽  
Fatigue Tests ◽  
Fatigue Life Prediction ◽  
Power Spectral ◽  
Vibration Fatigue ◽  
Non Gaussian

Novel accelerated random vibration fatigue test methodology and strategy are proposed, which can generate a design of the experimental test plan significantly reducing the test time and the sample size. Based on theoretical analysis and fatigue damage model, several groups of random vibration fatigue tests were designed and conducted with the aim of investigating effects of both Gaussian and non-Gaussian random excitation on the vibration fatigue. First, stress responses at a weak point of a notched specimen structure were measured under different base random excitations. According to the measured stress responses, the structural fatigue lives corresponding to the different vibrational excitations were predicted by using the WAFO simulation technique. Second, a couple of destructive vibration fatigue tests were carried out to validate the accuracy of the WAFO fatigue life prediction method. After applying the proposed experimental and numerical simulation methods, various factors that affect the vibration fatigue life of structures were systematically studied, including root mean squares of acceleration, power spectral density, power spectral bandwidth, and kurtosis. The feasibility of WAFO for non-Gaussian vibration fatigue life prediction and the use of non-Gaussian vibration excitation for accelerated fatigue testing were experimentally verified.

Development of a High Cycle Fatigue Life Prediction Model for Thin Film Silicon Structures

2018 ◽  
Vol 140 (3) ◽  
Author(s):  
Chia-Cheng Chang ◽  
Sheng-Da Lin ◽  
Kuo-Ning Chiang
Keyword(s):  
Thin Film ◽  
Fatigue Life ◽  
Life Prediction ◽  
Microelectromechanical Systems ◽  
Fatigue Testing ◽  
Mesh Size ◽  
Prediction Equation ◽  
Frequency Effect ◽  
Element Analysis ◽  
Solution Type

The fatigue characteristics of microelectromechanical systems (MEMS) material, such as silicon or polysilicon, have become very important. Many studies have focused on this topic, but none have defined a good methodology for extracting the applied stress and predicting fatigue life accurately. In this study, a methodology was developed for the life prediction of a polysilicon microstructure under bending tests. Based on the fatigue experiments conducted by Hocheng et al. (2008, “Various Fatigue Testing of Polycrystalline Silicon Microcantilever Beam in Bending,” Jpn. J. Appl. Phys., 47, pp. 5256–5261) and (Hung and Hocheng, 2012, “Frequency Effects and Life Prediction of Polysilicon Microcantilever Beams in Bending Fatigue,” J. Micro/Nanolithogr., MEMS MOEMS, 11, p. 021206), cantilever beams with different dimensions were remodeled with mesh control technology using finite element analysis (FEA) software to extract the stress magnitude. The mesh size, anchor boundary, loading boundary, critical stress definition, and solution type were well modified to obtain more correct stress values. Based on the new stress data extracted from the modified models, the optimized stress-number of life curve (S–N curve) was obtained, and the new life-prediction equation was found to be referable for polysilicon thin film life prediction under bending loads. After comparing the literature and confirming the new models, the frequency effect was observed only for the force control type and not for the displacement control type.

Low-cycle fatigue testing and thermal fatigue life prediction of electroplated copper thin film for through hole via

2018 ◽  
Vol 82 ◽  
pp. 20-27 ◽  
Author(s):  
Kazuki Watanabe ◽  
Yoshiharu Kariya ◽  
Naoyuki Yajima ◽  
Kizuku Obinata ◽  
Yoshiyuki Hiroshima ◽  
...  
Keyword(s):  
Thin Film ◽  
Life Prediction ◽  
Fatigue Testing ◽  
Low Cycle Fatigue ◽  
Fatigue Life Prediction ◽  
Cycle Fatigue ◽  
Copper Thin Film ◽  
Thermal Fatigue Life ◽  
Electroplated Copper ◽  
Through Hole
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