Finite element analysis on stress/strain in CBGA solder joint with different substrates under thermal cycle
2009 ◽
Vol 18
(3)
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pp. 333
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1990 ◽
Vol 27
(1)
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pp. 5-6
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2018 ◽
Vol 28
(6)
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pp. 1200-1215
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2012 ◽
Vol 227
(6)
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pp. 1177-1186
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2016 ◽
Vol 685
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pp. 186-190
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2016 ◽
Vol 08
(06)
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pp. 1650082
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