scholarly journals Towards a Description Synthesis of the Entanglement of the Substrate with the Interconnection Network, for Fast Modeling of 3D RF circuits

2021 ◽  
Vol 9 (3) ◽  
pp. 36-54
Author(s):  
A. Nabil ◽  
J. Bernardo ◽  
A. Rangel ◽  
M. Shaker ◽  
M. Abouelatta ◽  
...  
Keyword(s):  
Background Noise ◽  
Interconnection Network ◽  
Signal Transmission ◽  
Rf Circuits ◽  
Actual Problem ◽  
Impedance Extraction ◽  
Silicon Vias ◽  
Thermal Phenomena ◽  
3D Chip Stacking ◽  
General Tool

3D chip stacking is considered known to overcome conventional 2D-IC issues, using Trough Silicon Via (TSVs) to ensure vertical signal transmission between data.  If the electrical behaviour of 3D interconnections (redistribution metal lines and through silicon vias) used in 3D IC stack technologies are to be explored in this paper, the substrate itself is of interest, via Green Kernels by solving Poisson's equation analytically. Using this technique, the substrate coupling and loss in IC's can be analysed. We implement our algorithms in MATLAB. This method has been already used; but, it permits to extract impedances for a stacked uniform layers substrate. We have extended for any numbers of embedded contacts, of any shape. On a second hand, we grasp the background noise   between any two points, in the bulk, or at the surface, from a transfer impedance extraction technique.  With an analog algorithm, a strength of this work, we calculate unsteady solutions of the heat equation, using a spreading resistance concept. This method has been adapted to stacked layers. With this general tool of impedance field, we investigate on the problems encountered by interconnects, especially the vias, the substrate, and their entanglement. A calculation of thermal mechanical stresses and their effects on substrate crack (max and min stresses), devices (i.e: transistors) and hotspots, are made to track the performance. But, to well understand the interconnection incidence on 3D system performances, it is important to consider the whole electrical context; it seems relevant to consider the possible couplings between vias, not only by the electromagnetic field, but also by any possible energy transfer between interconnects; more generally, one of actual problem is to determine  where the energy is  really confined in such 3D circuits, before find solutions to limit  pollutions  coming from  electro-magneto -thermal   phenomena or  background noises.

3D Electromagnetic Modeling of Through Silicon Vias and Interposers in Electronic Packaging

2012 ◽  
Vol 2012 (1) ◽  
pp. 001057-001067
Author(s):  
Darryl Kostka ◽  
Antonio Ciccomancini Scogna
Keyword(s):  
High Speed ◽  
Signal Transmission ◽  
Form Factors ◽  
Point Of View ◽  
Electromagnetic Modeling ◽  
Electromagnetic Simulations ◽  
Full Wave ◽  
3D Ics ◽  
Silicon Vias ◽  
Delivery Networks

3D ICs promise “more than Moore” integration by packing a lot of functionality into small form factors. Interposers along with TSVs play an important role in 3D integration from an electrical, thermal and mechanical point of view. The goal of this paper is to electrically model TSVs and 3D interposers by means of three 3D full wave electromagnetic simulations. A comparative analysis of various configurations of signal delivery networks in 3D interposers for high speed signal transmission is presented.

scholarly journals A study on new right/left inverses of nonsquare polynomial matrices

2011 ◽  
Vol 21 (2) ◽  
pp. 331-348 ◽  
Author(s):  
Wojciech Hunek ◽  
Krzysztof Latawiec
Keyword(s):  
Polynomial Matrix ◽  
Signal Transmission ◽  
Minimum Variance ◽  
Inverse Model ◽  
New Right ◽  
Mimo Channels ◽  
Polynomial Matrices ◽  
Model Control ◽  
Normal Rank ◽  
General Tool

A study on new right/left inverses of nonsquare polynomial matricesThis paper presents several new results on the inversion of full normal rank nonsquare polynomial matrices. New analytical right/left inverses of polynomial matrices are introduced, including the so-called τ-inverses, σ-inverses and, in particular,S-inverses, the latter providing the most general tool for the design of various polynomial matrix inverses. The applicationoriented problem of selecting stable inverses is also solved. Applications in inverse-model control, in particular robust minimum variance control, are exploited, and possible applications in signal transmission/recovery in various types of MIMO channels are indicated.

RF characterization and modelling of high density Through Silicon Vias for 3D chip stacking

2010 ◽  
Vol 87 (3) ◽  
pp. 491-495 ◽  
Author(s):  
L. Cadix ◽  
C. Bermond ◽  
C. Fuchs ◽  
A. Farcy ◽  
P. Leduc ◽  
...  
Keyword(s):  
High Density ◽  
Through Silicon Vias ◽  
Silicon Vias ◽  
3D Chip Stacking

High Speed Signal Transmission using Through-Si Vias and Coplanar Waveguides in a 3D IC Test Structure

2013 ◽  
Vol 2013 (1) ◽  
pp. 000228-000232
Author(s):  
Min Xu ◽  
Robert Geer ◽  
Pavel Kabos ◽  
Thomas Wallis
Keyword(s):  
Integrated Circuits ◽  
High Frequency ◽  
High Speed ◽  
Signal Transmission ◽  
Coplanar Waveguides ◽  
Scattering Parameter ◽  
High Frequency Signal ◽  
3D Integrated Circuits ◽  
High Bandwidth ◽  
Silicon Vias

High frequency signal transmission through silicon substrates is critical for 3D heterogeneous integration. This paper presented fabrication, testing, and simulation of high-frequency interconnects based on through-silicon vias (TSVs) and coplanar waveguides (CPWs) for stacked 3D integrated circuits (3D ICs). Our simulation results showed that adding ground TSVs can improve signal transmission by 6× at 50GHz. We further investigated signal/ground TSV (1SXG) configurations for high-bandwidth signal transmission links. Scattering parameter measurements of fabricated 1SXG TSV structures for frequencies from 100MHz to 50GHz show low insertion loss (S21 less than −1dB up to 50GHz) and return loss (S11 lower than −15dB). These results indicate that these vertical interconnects exhibit good performance for high speed signal transmission. To understand the RF signal transmission in 3D interconnects, we used full wave electromagnetic simulation to investigate the electromagnetic field distribution associated with the ground TSV placement. We observed that the ground TSVs induced substantial overall field confinement, consistent with the experimental observation of improved signal transmission. Simulations also provided design guidance with respect to the substrate conductivity's impact on EM confinement and signal transmission.

3D chip-stacking technology with through-silicon vias and low-volume lead-free interconnections

2008 ◽  
Vol 52 (6) ◽  
pp. 611-622 ◽  
Author(s):  
K. Sakuma ◽  
P. S. Andry ◽  
C. K. Tsang ◽  
S. L. Wright ◽  
B. Dang ◽  
...  
Keyword(s):  
Lead Free ◽  
Through Silicon Vias ◽  
Low Volume ◽  
Silicon Vias ◽  
3D Chip Stacking

Analog Codes for Gross Error Correction in Signal Transmission

2011 ◽  
Vol 341-342 ◽  
pp. 514-518 ◽  
Author(s):  
Fang Ning Hu ◽  
Werner Henkel ◽  
Ming Jie Zhao
Keyword(s):  
Error Correction ◽  
Background Noise ◽  
Signal Transmission ◽  
Complex Numbers ◽  
Original Signal ◽  
Decoding Algorithm ◽  
Reed Solomon Codes ◽  
Gross Error ◽  
As If

We proposed a novel decoding algorithm for Analog Codes (Reed-Solomon Codes over complex numbers), thesyndrome repairing(SR) algorithm, for gross error correction in signal transmission. Simulations show that, if the number of gross errors is not too large and the amplitude of background noise is small enough (compared to the amplitude of gross errors), the SR algorithm recovers the original signal with nearly the same accuracy as if no gross errors occur upon transmission. In particular, if the transmission is background-noise-free, then the recovery is exact.

Solder Based Self-Assembled Structures for 3D Integration

2014 ◽  
Vol 875-877 ◽  
pp. 1604-1609
Author(s):  
Madhav Rao
Keyword(s):  
Integrated Circuit ◽  
Heat Dissipation ◽  
Three Dimensional ◽  
3D Structures ◽  
Solder Bumps ◽  
Additional Processing ◽  
Measured Resistance ◽  
Self Assembled ◽  
Silicon Vias ◽  
3D Chip Stacking

A novel way of three dimensional (3D) chip stacking has been designed in a view to improve heat dissipation across the layers. Chip stacking using vertical interconnections forms microscale channels for coolant to circulate through the gaps. Solder-based self-assembled (SBSA) 3D structures have been designed as posts on simulated through silicon vias (TSVs) to prove the processing concept. The processing of SBSA structures using a low temperature solder alloy and dip soldering method is described. Additional processing steps to fabricate interconnected 3D structures were demonstrated. Mechanical grinding of the 3D structures shows that soldered SBSA structures were void free and robust enough to be used as a connection post for chip stacking. SBSA structures provide a solder bump that serves as a connection path in the integration of dissimilar electronic technologies. Conventional copper posts, developed in a previous project, can be an effective approach to integrated circuit (IC) stacking. However, the SBSA post provides more variety in size and shape with a potential to serve as a reservoir for solder to aid in chip bonding. The solder bumps are heat resistant and uniform thicknesses were obtained across a large array of SBSA structures. The electrical durability of SBSA posts were determined by completing I-V measurements after thermal treatments. Fabricated SBSA posts were subjected to thermal cycling with temperatures ranging from room temperature to 300 °C. The interconnected SBSA posts are shown to be stable until 165 °C with little variation in measured resistance.

scholarly journals On the evolution of noise-dependent vocal plasticity in birds

2012 ◽  
Vol 8 (6) ◽  
pp. 913-916 ◽  
Author(s):  
Sophie Schuster ◽  
Sue Anne Zollinger ◽  
John A. Lesku ◽  
Henrik Brumm
Keyword(s):  
Background Noise ◽  
Animal Communication ◽  
Signal Transmission ◽  
Bird Species ◽  
Vocal Plasticity ◽  
Lombard Effect ◽  
Signal Plasticity ◽  
Communication Signal ◽  
History Of ◽  
Bird Group

Signal plasticity is considered an important step in the evolution of animal communication. In acoustic communication, signal transmission is often constrained by background noise. One adaptation to evade acoustic signal masking is the Lombard effect, in which an animal increases its vocal amplitude in response to an increase in background noise. This form of signal plasticity has been found in mammals, including humans, and some birds, but not frogs. However, the evolution of the Lombard effect is still unclear. Here we demonstrate for the first time the Lombard effect in a phylogentically basal bird species, the tinamou Eudromia elegans . By doing so, we take a step towards reconstructing the evolutionary history of noise-dependent vocal plasticity in birds. Similar to humans, the tinamous also raised their vocal pitch in noise, irrespective of any release from signal masking. The occurrence of the Lombard effect in a basal bird group suggests that this form of vocal plasticity was present in the common ancestor of all living birds and thus evolved at least as early as 119 Ma.

Sign in / Sign up

Export Citation Format

Share Document