Computational stress analysis for ball grid array reliability and passive component reliability in board level assemblies

2005 ◽  
Author(s):  
Chung Yin Lau
Keyword(s):  
Stress Analysis ◽  
Ball Grid Array ◽  
Passive Component ◽  
Component Reliability ◽  
Board Level

Ceramic ball grid array package stress analysis

2017 ◽  
Author(s):  
S. H. B. S. Badri ◽  
M. H. A. Aziz ◽  
N. R. Ong ◽  
Z. Sauli ◽  
J. B. Alcain ◽  
...  
Keyword(s):  
Stress Analysis ◽  
Ball Grid Array ◽  
Ceramic Ball ◽  
Ball Grid Array Package

Reliability of Underfilled Chip Scale Packages Attached With Heat Sink

2005 ◽  
Author(s):  
Saketh Mahalingam ◽  
Ashutosh Joshi ◽  
Joseph Lacey ◽  
Kunal Goray
Keyword(s):  
Solder Joint ◽  
Heat Sink ◽  
Operating Temperature ◽  
Ball Grid Array ◽  
Solder Joint Reliability ◽  
Proper Understanding ◽  
Joint Reliability ◽  
Board Level ◽  
Inelastic Strains ◽  
Underfill Material

Chip Scale Packages (CSP) are ideal intermediates between Direct Chip Attach (DCA) and Ball Grid Array (BGA) technologies in terms of both size and cost. Depending upon the application, chip scale packages are either underfilled for better solder joint reliability or are attached with a heat sink to keep the operating temperature of the chip under control. In many applications, as discussed in this paper, both an underfill and a heat sink are required. Quite expectedly the addition of two more materials, heat sink and adhesive, in the board level assembly results in fresh reliability concerns. In particular, the requirements on the underfill material and the heat sink attach adhesive are more rigorous and needless to say, a proper understanding of process and material issues is needed to make such a choice. The inelastic strains experienced by the solder joint (related to the underfill) and the peeling stresses at the heat sink attach adhesive interfaces (related to the thermal adhesive) are used as metric for comparing the number of material choices that are available. Based on the results, it is shown that it is important to choose materials that are thermo-mechanically matched with the rest of the system.

Degradation Susceptibility Metrics as the Bases for Bayesian Reliability Models of Aging Passive Components and Long-Term Reactor Risk

2011 ◽  
Author(s):  
Stephen D. Unwin ◽  
Peter P. Lowry ◽  
Michael Y. Toyooka ◽  
Benjamin E. Ford
Keyword(s):  
Passive Component ◽  
Degradation Mechanisms ◽  
Component Reliability ◽  
Passive Components ◽  
Reliability Models ◽  
Age Dependent ◽  
Probabilistic Risk Assessments ◽  
Component Failure Rates ◽  
Service Data

Conventional probabilistic risk assessments (PRAs) are not well-suited to addressing long-term reactor operations. Since passive structures, systems and components are among those for which refurbishment or replacement can be least practical, they might be expected to contribute increasingly to risk in an aging plant. Yet, passives receive limited treatment in PRAs. Furthermore, PRAs produce only snapshots of risk based on the assumption of time-independent component failure rates. This assumption is unlikely to be valid in aging systems. The treatment of aging passive components in PRA does present challenges. First, service data required to quantify component reliability models are sparse, and this problem is exacerbated by the greater data demands of age-dependent reliability models. A compounding factor is that there can be numerous potential degradation mechanisms associated with the materials, design, and operating environment of a given component. This deepens the data problem since the risk-informed management of materials degradation and component aging will demand an understanding of the long-term risk significance of individual degradation mechanisms. In this paper we describe a Bayesian methodology that integrates the metrics of materials degradation susceptibility being developed under the Nuclear Regulatory Commission’s Proactive Materials Degradation Assessment Program with available plant service data to estimate age-dependent passive component reliabilities. Integration of these models into conventional PRA will provide a basis for materials degradation management informed by the predicted long-term operational risk.

Stress Analysis of Printed Circuit Boards With Highly Populated Solder Joints and Components: A Micromechanics Approach

1996 ◽  
Vol 118 (2) ◽  
pp. 87-93
Author(s):  
K. X. Hu ◽  
Y. Huang ◽  
C. P. Yeh ◽  
K. W. Wyatt
Keyword(s):  
Stress Analysis ◽  
Printed Circuit Boards ◽  
Solder Joints ◽  
Effective Properties ◽  
Mechanical Analysis ◽  
Computational Effort ◽  
Circuit Boards ◽  
Element Analysis ◽  
Printed Circuit ◽  
Board Level

The single most difficult aspect for thermo-mechanical analysis at the board level lies in to an accurate accounting for interactions among boards and small features such as solder joints and secondary components. It is the large number of small features populated in a close neighborhood that proliferates the computational intensity. This paper presents an approach to stress analysis for boards with highly populated small features (solder joints, for example). To this end, a generalized self-consistent method, utilizing an energy balance framework and a three-phase composite model, is developed to obtain the effective properties at board level. The stress distribution inside joints and components are obtained through a back substitution. The solutions presented are mostly in the closed-form and require a minimum computational effort. The results obtained by present approach are compared with those by finite element analysis. The numerical calculations show that the proposed micromechanics approach can provide reasonably accurate solutions for highly populated printed circuit boards.

Transforming Electronic Interconnect

2017 ◽  
Vol 2017 (S1) ◽  
pp. 000080-000108 ◽  
Author(s):  
Tim Olson
Keyword(s):  
Central Nervous System ◽  
Supply Chain ◽  
Manufacturing Systems ◽  
Ball Grid Array ◽  
Industry Growth ◽  
Electronic Products ◽  
Electronic Manufacturing ◽  
Large Panels ◽  
The Central Nervous System ◽  
Board Level

From nanometers at the transistor level to 100's of microns at the ball grid array (BGA) connections, electronic interconnect of semiconductors spans orders of magnitude as it forms the central nervous system of today's advanced electronic products. Tectonic shifts are currently underway within the industries providing electronic interconnect. Traditional supply chain boundaries produce back end of line (BEOL) structures within wafer foundries ranging from 10's of nanometers to 10's of microns. First-level interconnect, or packaging, the classical purvey of semiconductor assembly and test services (SATS) providers operates in 10's to 100's of microns. Second-level interconnect, or board level assembly, historically rests with electronic manufacturing systems (EMS) providers measuring their work in 100's of microns and above. The transformation underway in electronic interconnect will redefine historical supply chain boundaries as it blurs the lines between foundries, SATS and EMS providers. At the heart of the transformation is ‘fan-out’ technology moving from initial capacities in wafer form to an emerging format of large panels. Breaking through capital cost, reliability and yield concerns with novel solutions will open the door for widespread industry growth of fan-out.

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