Integration of phosphor printing and encapsulant dispensing processes for LED array wafer level packaging

2011 ◽  
Author(s):  
Kewei Chen
Keyword(s):  
Wafer Level ◽  
Wafer Level Packaging ◽  
Led Array

Packaging HB LEDs with Integrated Beamshaping

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001493-001514
Author(s):  
Thomas Hoeftmann
Keyword(s):  
Beam Shaping ◽  
Wafer Level ◽  
Consumer Market ◽  
High Brightness ◽  
Automotive Market ◽  
Wafer Level Packaging ◽  
Led Array ◽  
New Ideas ◽  
Application Fields ◽  
Glass Lenses

LED light will dominate in future a lot of application fields in everyday life and it already started not only in consumer market. Therefore more and more applications require new ideas and approaches for packaging to fulfill upgraded requirements for protection, reliability, beam shaping and cost reduction, especially for High Brightness (HB) LEDs in e.g. automotive and other markets. This presentation will give an overview about the developed monolithic window with integrated anti-glare shield for HB LED packaging used in the automotive market for low and high beam headlights and other special lighting functions of modern cars. Apart from the component protection, the monolithic window ensures that there is sufficient contrast and thus glare protection in the irradiation area of the LED array. In addition future packaging technologies will be introduced to provide 3D interconnection and beam shaping by glass lenses. All discussed packaging ideas will meet the requirement of vacuum tight wafer level packaging by building monolithic packaging boards or capping wafers made of micro processed silicon and glass material.

MEMS Wafer-level Packaging Technology Using LTCC Wafer

2012 ◽  
Vol 132 (8) ◽  
pp. 246-253 ◽  
Author(s):  
Mamoru Mohri ◽  
Masayoshi Esashi ◽  
Shuji Tanaka
Keyword(s):  
Wafer Level ◽  
Packaging Technology ◽  
Wafer Level Packaging

3D IC/Stacked Device Fault Isolation Using 3D Magnetic Field Imaging

2014 ◽  
Author(s):  
A. Orozco ◽  
N.E. Gagliolo ◽  
C. Rowlett ◽  
E. Wong ◽  
A. Moghe ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Fault Isolation ◽  
Wafer Level ◽  
Wafer Level Packaging ◽  
Current Location ◽  
Geometrical Information ◽  
Magnetic Field Imaging ◽  
Silicon Vias ◽  
Non Destructive ◽  
Field Imaging

Abstract The need to increase transistor packing density beyond Moore's Law and the need for expanding functionality, realestate management and faster connections has pushed the industry to develop complex 3D package technology which includes System-in-Package (SiP), wafer-level packaging, through-silicon-vias (TSV), stacked-die and flex packages. These stacks of microchips, metal layers and transistors have caused major challenges for existing Fault Isolation (FI) techniques and require novel non-destructive, true 3D Failure Localization techniques. We describe in this paper innovations in Magnetic Field Imaging for FI that allow current 3D mapping and extraction of geometrical information about current location for non-destructive fault isolation at every chip level in a 3D stack.

scholarly journals Utilizing an Adaptive Grey Model for Short-Term Time Series Forecasting: A Case Study of Wafer-Level Packaging

2013 ◽  
Vol 2013 ◽  
pp. 1-6 ◽  
Author(s):  
Che-Jung Chang ◽  
Der-Chiang Li ◽  
Wen-Li Dai ◽  
Chien-Chih Chen
Keyword(s):  
Semiconductor Manufacturing ◽  
Manufacturing System ◽  
Grey System Theory ◽  
Grey Model ◽  
Grey System ◽  
Wafer Level ◽  
Short Term ◽  
Packaging Process ◽  
Wafer Level Packaging

The wafer-level packaging process is an important technology used in semiconductor manufacturing, and how to effectively control this manufacturing system is thus an important issue for packaging firms. One way to aid in this process is to use a forecasting tool. However, the number of observations collected in the early stages of this process is usually too few to use with traditional forecasting techniques, and thus inaccurate results are obtained. One potential solution to this problem is the use of grey system theory, with its feature of small dataset modeling. This study thus uses the AGM(1,1) grey model to solve the problem of forecasting in the pilot run stage of the packaging process. The experimental results show that the grey approach is an appropriate and effective forecasting tool for use with small datasets and that it can be applied to improve the wafer-level packaging process.

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