scholarly journals THERMO-VISCOELASTIC CHARACTERIZATION OF POLYMER LAMINATE FILMS

2016 ◽  
Vol 3 ◽  
pp. 82-85
Author(s):  
Eliza Truszkiewicz ◽  
Daniel Tscharnuter ◽  
Gerald Pilz
Keyword(s):  
Digital Image Correlation ◽  
Digital Image ◽  
Viscoelastic Behavior ◽  
Image Correlation ◽  
Material Modeling ◽  
Electronic Components ◽  
Printed Circuits ◽  
Mechanical Measurements ◽  
Laminate Film

The investigated material - laminate is intended as a substrate for small electronic components, electrodes and printed circuits, which are processed onto the laminate prior to thermoforming. The placement of the electronic components and the connecting circuits must be carefully designed to prevent damage during the thermoforming. The thermo-viscoelastic behavior of a polymer laminate film was characterized by mechanical measurements to obtain data for material modeling. The strain was measured using digital image correlation. The film is anisotropic and is able to deform to strains up to 60%.

Thermoforming of Polymer Laminate Films: Thermo-Viscoelastic Characterization

2015 ◽  
Author(s):  
E. Truszkiewicz ◽  
D. Tscharnuter ◽  
G. Pilz ◽  
G. Pinter
Keyword(s):  
Thermal Expansion ◽  
Digital Image Correlation ◽  
Digital Image ◽  
Viscoelastic Behavior ◽  
Image Correlation ◽  
Material Modeling ◽  
Mechanical Measurements ◽  
Laminate Film

The thermo-viscoelastic behavior of a polymer laminate film was characterized by mechanical measurements to obtain data for material modeling. The strain was measured using digital image correlation. The film is anisotropic and sustains uniaxial strains up to 60%. Additionally, the thermal expansion was measured for both materials that form the laminate.

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