Application of Focused Ion Beam Technique to Thin-Film Sample Preparation for Auger Electron Spectroscopy-Sputter Depth Profiling of Deep Interfaces

2008 ◽  
Vol 15 (1) ◽  
pp. 40-49
Author(s):  
Michiko Satoh ◽  
Yoshihiko Seyama ◽  
Toru Itakura
Author(s):  
Carolyn F. H. Gondran ◽  
Emily Morales

Abstract It is shown that a focused ion beam (FIB) grounding technique can be used to alleviate charge buildup on samples that would otherwise charge in the electron beam to the point where analysis by Auger electron spectroscopy (AES) was limited or impossible. FIB grounding alleviates the sample charging and permits AES analysis. The grounding technique is quick, easy and well understood as it has been used extensively for voltage-contrast analysis. The technique is shown to be useful for enabling analysis on electrically isolated conductive features as well as insulating samples.


1983 ◽  
Vol 25 ◽  
Author(s):  
C G Tuppen ◽  
G J Davies ◽  
M R Taylor ◽  
R Heckingbottom

ABSTRACTBuried oxide layers, formed by high dose ion implantation, have been examined using Auger depth profiling. The phase distribution of oxygen in the wings of the implant profile and effects of high temperature annealing, have been investigated. Ion beam induced cascade mixing, which occurs during sputter etching, limits the minimum detectable size of SiO2 precipitates. However, it is possible to minimise this effect by reducing the ion beam energy. At very small precipitate sizes (<100Å) silicon atoms at the edge of the precipitate particles will make a major contribution to the Si KLL Auger spectrum. A previously reported theoretical model has been expanded to take account of this phenomenon.


2001 ◽  
Vol 695 ◽  
Author(s):  
Robert Esser ◽  
Aris Christou

ABSTRACTA refractory metallization of Au/Nb is proposed for use in first level metallization of GaAs devices. The diffusion and reaction kinetics are explored using sheet resistance measurements, along with X-ray diffraction and Auger electron spectroscopy depth profiling. The interdiffusion coefficients are reported. Diodes are fabricated using Nb/Au metallization and characterized


2002 ◽  
Vol 733 ◽  
Author(s):  
Brock McCabe ◽  
Steven Nutt ◽  
Brent Viers ◽  
Tim Haddad

AbstractPolyhedral Oligomeric Silsequioxane molecules have been incorporated into a commercial polyurethane formulation to produce nanocomposite polyurethane foam. This tiny POSS silica molecule has been used successfully to enhance the performance of polymer systems using co-polymerization and blend strategies. In our investigation, we chose a high-temperature MDI Polyurethane resin foam currently used in military development projects. For the nanofiller, or “blend”, Cp7T7(OH)3 POSS was chosen. Structural characterization was accomplished by TEM and SEM to determine POSS dispersion and cell morphology, respectively. Thermal behavior was investigated by TGA. Two methods of TEM sample preparation were employed, Focused Ion Beam and Ultramicrotomy (room temperature).


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