Photoluminescence and Electroluminescence in InGaN/GaN Nano-rod Array LEDs Fabricated on a Wafer Scale

2010 ◽  
Author(s):  
P.A. Shields ◽  
C. Chan ◽  
N. Read ◽  
D.W.E. Allsopp ◽  
R.A. Taylor
Keyword(s):  
Wafer Scale ◽  
Rod Array

Wafer scale integration

1988 ◽  
Vol 135 (6) ◽  
pp. 281
Author(s):  
J.B. Butcher ◽  
K.K. Johnstone
Keyword(s):  
Wafer Scale ◽  
Wafer Scale Integration ◽  
Scale Integration

Investigation of Plasma Treatment Conditions for Wafer-Scale Room-Temperature Bonding Using Ultrathin Au Films in Ambient Air

2019 ◽  
Vol 139 (7) ◽  
pp. 217-218
Author(s):  
Michitaka Yamamoto ◽  
Takashi Matsumae ◽  
Yuichi Kurashima ◽  
Hideki Takagi ◽  
Tadatomo Suga ◽  
...  
Keyword(s):  
Plasma Treatment ◽  
Room Temperature ◽  
Ambient Air ◽  
Wafer Scale ◽  
Treatment Conditions

scholarly journals Author Correction: Controllable deposition of organic metal halide perovskite films with wafer-scale uniformity by single source flash evaporation

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Woocheol Lee ◽  
Jonghoon Lee ◽  
Hyeon-Dong Lee ◽  
Junwoo Kim ◽  
Heebeom Ahn ◽  
...  
Keyword(s):  
Metal Halide ◽  
Single Source ◽  
Organic Metal ◽  
Flash Evaporation ◽  
Wafer Scale ◽  
Metal Halide Perovskite ◽  
Halide Perovskite

An amendment to this paper has been published and can be accessed via a link at the top of the paper.

scholarly journals Wafer-Scale Fabrication and Assembly Method of Multichannel Microelectrode Arrays for ECoG Application

Electronics ◽  
2021 ◽  
Vol 10 (3) ◽  
pp. 316
Author(s):  
Cong Wang ◽  
Yu-Chen Wei ◽  
Ho-Kun Sung ◽  
Alok Kumar ◽  
Zhong-Liang Zhou ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Electrochemical Impedance ◽  
Microelectrode Arrays ◽  
Absence Seizure ◽  
Curing Conditions ◽  
Wafer Scale ◽  
In Vivo Test ◽  
Assembly Method ◽  
Signal Recording

High density electrocorticography (ECoG)-based microelectrode arrays (MEAs) are fabricated to timely record the neural activities to provide the fundamental understanding in neuroscience and biomedical engineering. This paper aims to introduce a device-based concept and wafer-scale fabrication process for MEAs. Flexible and biocompatible polyimide is applied on MEAs to bear all possible stress and strain. Detailed fabrication key techniques, including surface treatment, polyimide stability measurement, evaporation process, and curing conditions, have been discussed thoroughly. Moreover, the fabricated polyimide-based MEAs are surface-mounted on well-packaged printed circuit boards (PCBs) via a slot-type connector without any additional wire bonding to make the signal recording process easier. An absence seizure was recorded during the in vivo test, which shows the availability of signal recording based on the presented MEAs. The proposed MEAs could be remained at the skull, while the connector and PCBs can be disassembled apart. Therefore, the testing sample will get less suffering. To verify the robustness of the fabricated MEAs, the impedance properties were characterized using electrochemical impedance spectroscopy. The measured results indicate an average impedance of 12.3 ± 0.675 kΩ at 1 kHz. In total, 10 groups of MEAs were sample tested, and over 90% of the total 60 channels per 1-MEAs operated efficiently.

scholarly journals Wafer-scale low-loss lithium niobate photonic integrated circuits

2020 ◽  
Author(s):  
Kevin Luke ◽  
Prashanta Kharel ◽  
Christian Reimer ◽  
Lingyan He ◽  
Marko Loncar ◽  
...  
Keyword(s):  
Lithium Niobate ◽  
Integrated Circuits ◽  
Photonic Integrated Circuits ◽  
Low Loss ◽  
Wafer Scale
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