Excellent performance of a cryogenic Nd:YAlO3 laser with low wavefront distortion based on zero thermal expansion

2021 ◽  
Author(s):  
Yan Song ◽  
yuanzhai xu ◽  
shuai meng ◽  
Xingxing Jiang ◽  
Chongfeng Shao ◽  
...  
2011 ◽  
Vol 284-286 ◽  
pp. 620-623
Author(s):  
Ming Hu ◽  
Jing Gao ◽  
Yun Long Zhang

The SiC/Cu electronic packaging composites with excellent performance were successfully prepared by the chemical plating copper on the surface of SiC powders and high-speed flame spraying technology. The results showed that the homogeneous dense coated layers can be obtained on the surface of SiC powder by optimizing process parameters. The volume fraction of SiC powders in the composites could significantly increase and figure was beyond 55vol% after spraying Copper. The SiC and Cu were the main phases in the spraying SiC/Cu electronic packaging composite, at the same time Cu2O can be tested as the trace phase. The interface combination properties of SiC/Cu in the hot-pressed samples can obviously improve. The thermal expansion coefficient and thermal conductivity of SiC/Cu electronic packaging composite basic can satisfy the requirements for electronic packaging materials.


2012 ◽  
Vol 476-478 ◽  
pp. 705-709 ◽  
Author(s):  
Lan Zhu Zhang ◽  
Min Li

Because of the excellent performance of Polyetheretherketone (PEEK), it is widely used in aerospace, mechanic, electronic and auto industry. Here the properties of injected molded PEEK composites reinforced by short carbon fiber (SCF), and the influence of SCF on the mechanical performance and thermal expansion performance were studied. It was indicated how the mechanical and thermal performance were changed with SCF content. Also the microstructure of PEEK composites was studied by taking SEM photographs. The results showed, in the here studied range of SCF content, the mechanical performance of PEEK composites rapidly increased with the increasing of SCF content. While the weight percent of short fibers was more than 10%, this increasing tendency became slow. SEM photographs showed, the interaction between base material PEEK and SCF was good, that because SCF could be good connected with PEEK base material, and the filling with SCF could also decrease the thermal expansion coefficient of PEEK composites.


2022 ◽  
Vol 12 (2) ◽  
pp. 577
Author(s):  
Wenqing Wei ◽  
Yongfeng Zhang ◽  
Zongzheng Du ◽  
Minwei Song ◽  
Yuanyuan Zhang ◽  
...  

The coefficient of thermal expansion (CTE) is an important property of ultra-low expansion (ULE) glass, and the ultrasonic velocity method has shown excellent performance for the nondestructive measurement of CTE in large ULE glass. In this method, the accurate acquisition of the ultrasonic velocity in ULE glass is necessary. Herein, we present a correlation method to determine the ultrasonic TOF in ULE glass and to further obtain the ultrasonic longitudinal wave velocity (cL) indirectly. The performance of this method was verified by simulations. Considering the dependence of cL on temperature (T), we carried out the derivation of the analytical model between cL and T. Based on reasonable constant assumptions in the physical sense, a cL–T exponential model was produced, and some experimental results support this model. Additional experiments were carried out to validate the accuracy of the cL–T exponential model. The studies we conducted indicate that the cL–T exponential model can reliably predict the ultrasonic velocity in ULE glass at different temperatures, providing a means for the nondestructive CTE measurement of large ULE glass at a specified temperature.


Author(s):  
J. Cooper ◽  
O. Popoola ◽  
W. M. Kriven

Nickel sulfide inclusions have been implicated in the spontaneous fracture of large windows of tempered plate glass. Two alternative explanations for the fracture-initiating behaviour of these inclusions have been proposed: (1) the volume increase which accompanies the α to β phase transformation in stoichiometric NiS, and (2) the thermal expansion mismatch between the nickel sulfide phases and the glass matrix. The microstructure and microchemistry of the small inclusions (80 to 250 μm spheres), needed to determine the cause of fracture, have not been well characterized hitherto. The aim of this communication is to report a detailed TEM and EDS study of the inclusions.


Author(s):  
G.F. Bastin ◽  
H.J.M. Heijligers ◽  
J.M. Dijkstra

For the calculation of X-ray intensities emitted by elements present in multi-layer systems it is vital to have an accurate knowledge of the x-ray ionization vs. mass-depth (ϕ(ρz)) curves as a function of accelerating voltage and atomic number of films and substrate. Once this knowledge is available the way is open to the analysis of thin films in which both the thicknesses as well as the compositions can usually be determined simultaneously.Our bulk matrix correction “PROZA” with its proven excellent performance for a wide variety of applications (e.g., ultra-light element analysis, extremes in accelerating voltage) has been used as the basis for the development of the software package discussed here. The PROZA program is based on our own modifications of the surface-centred Gaussian ϕ(ρz) model, originally introduced by Packwood and Brown. For its extension towards thin film applications it is required to know how the 4 Gaussian parameters α, β, γ and ϕ(o) for each element in each of the films are affected by the film thickness and the presence of other layers and the substrate.


1995 ◽  
Vol 05 (C8) ◽  
pp. C8-1109-C8-1113
Author(s):  
T.R. Finlayson, ◽  
M. Liu ◽  
T.F. Smith
Keyword(s):  

1978 ◽  
Vol 39 (C6) ◽  
pp. C6-406-C6-407 ◽  
Author(s):  
T. Fukase ◽  
T. Kobayashi ◽  
M. Isino ◽  
N. Toyota ◽  
Y. Muto

1980 ◽  
Vol 41 (C8) ◽  
pp. C8-875-C8-877
Author(s):  
E. Girt ◽  
P. Tomić ◽  
A. Kuršumović ◽  
T. Mihać-Kosanović

1988 ◽  
Vol 49 (C8) ◽  
pp. C8-1903-C8-1904
Author(s):  
S. U. Jen ◽  
Y. D. Yao ◽  
H. Y. Pai

1988 ◽  
Vol 49 (C8) ◽  
pp. C8-159-C8-160
Author(s):  
T. Suzuki ◽  
T. Kanomata ◽  
T. Kaneko

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