Design of a non-Hermitian on-chip mode converter using phase change materials

2020 ◽  
Vol 45 (16) ◽  
pp. 4630
Author(s):  
Song-Rui Yang ◽  
Xu-Lin Zhang ◽  
Hong-Bo Sun
2019 ◽  
Vol 383 (25) ◽  
pp. 3196-3199 ◽  
Author(s):  
Mandeep Singh ◽  
Sanjeev Kumar Raghuwanshi ◽  
T. Srinivas

2013 ◽  
Vol 26 (9) ◽  
pp. 1372-1377 ◽  
Author(s):  
Carlos Rios ◽  
Peiman Hosseini ◽  
C. David Wright ◽  
Harish Bhaskaran ◽  
Wolfram H. P. Pernice

Photonics ◽  
2021 ◽  
Vol 8 (6) ◽  
pp. 205
Author(s):  
Muhammad Shemyal Nisar ◽  
Xing Yang ◽  
Liangjun Lu ◽  
Jianping Chen ◽  
Linjie Zhou

Phase change materials present a unique type of materials that drastically change their electrical and optical properties on the introduction of an external electrical or optical stimulus. Although these materials have been around for some decades, they have only recently been implemented for on-chip photonic applications. Since their reinvigoration a few years ago, on-chip devices based on phase change materials have been making a lot of progress, impacting many diverse applications at a very fast pace. At present, they are found in many interesting applications including switches and modulation; however, phase change materials are deemed most essential for next-generation low-power memory devices and neuromorphic computational platforms. This review seeks to highlight the progress thus far made in on-chip devices derived from phase change materials including memory devices, neuromorphic computing, switches, and modulators.


Author(s):  
Carlos Rios ◽  
Qingyang Du ◽  
Yifei Zhang ◽  
Mikhail Shalaginov ◽  
Paul Miller ◽  
...  

Author(s):  
Charlie De Vivero ◽  
Fulya Kaplan ◽  
Ayse K. Coskun

Continued CMOS scaling accompanied with a stall in the voltage scaling has led to high on-chip power densities. High on-chip power densities elevate the temperatures, substantially limiting the performance and reliability of computing systems. The use of Phase Change Materials (PCMs)1 has been explored as a passive cooling method to manage excessive chip temperatures. The thermal properties of PCMs allow a large amount of heat to be stored at near-constant temperature during the phase transition. This heat storage capability of PCM can be leveraged during periods of intense computation. For systems with PCM, development of new management strategies is essential to maximize the benefits of PCM. In order to design and evaluate these management strategies, it is necessary to have an accurate PCM thermal model. In our recent work, we proposed a detailed phase change thermal model, which we integrated into a compact thermal simulation tool, HotSpot. In this paper, we build a hardware testbed incorporating a PCM unit on top of the chip package. We then validate the accuracy of our previously proposed thermal model by comparing the HotSpot simulation results against the measurements on the testbed. We observe that the error between the measured and simulated temperatures is less than 4°C with 0.65 probability. Finally, we implement a soft PCM capacity sensor that monitors the remaining PCM latent heat capacity to be used for development of thermal management policies. We evaluate a set of thermal management policies on the testbed. We compare policies that adjust the sprinting frequency based on current temperature against the policies that take action based on the remaining PCM capacity.


2020 ◽  
Vol 28 (11) ◽  
pp. 16394 ◽  
Author(s):  
Joaquin Faneca ◽  
Liam Trimby ◽  
Ioannis Zeimpekis ◽  
Matthew Delaney ◽  
Daniel W. Hewak ◽  
...  

Author(s):  
S.S. Kruglov (Jr.) ◽  
◽  
G.L. Patashnikov ◽  
S.S. Kruglov (Sr.) ◽  
◽  
...  

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