scholarly journals Improved technique for the characterization of micro-ring resonator using low coherence measurement

2015 ◽  
Vol 40 (12) ◽  
pp. 2909 ◽  
Author(s):  
Wei Kang Liu ◽  
Chun Yen Chen ◽  
Chia-Chien Wei ◽  
Yung Jui Chen
Sensors ◽  
2021 ◽  
Vol 21 (10) ◽  
pp. 3385
Author(s):  
Jialu Ma ◽  
Jingchao Tang ◽  
Kaicheng Wang ◽  
Lianghao Guo ◽  
Yubin Gong ◽  
...  

A complex permittivity characterization method for liquid samples has been proposed. The measurement is carried out based on a self-designed microwave sensor with a split ring resonator (SRR), the unload resonant frequency of which is 5.05 GHz. The liquid samples in capillary are placed in the resonant zone of the fabricated senor for high sensitivity measurement. The frequency shift of 58.7 MHz is achieved when the capillary is filled with ethanol, corresponding a sensitivity of 97.46 MHz/μL. The complex permittivity of methanol, ethanol, isopropanol (IPA) and deionized water at the resonant frequency are measured and calibrated by the first order Debye model. Then, the complex permittivity of different concentrations of aqueous solutions of these materials are measured by using the calibrated sensor system. The results show that the proposed sensor has high sensitivity and accuracy in measuring the complex permittivity of liquid samples with volumes as small as 0.13 μL. It provides a useful reference for the complex permittivity characterization of small amount of liquid chemical samples. In addition, the characterization of an important biological sample (inositol) is carried out by using the proposed sensor.


2013 ◽  
Vol 2013 (1) ◽  
pp. 000861-000865 ◽  
Author(s):  
Blake Dronen ◽  
Aric Shorey ◽  
B.K. Wang ◽  
Leon Tsai

Wafer thinning represents a critical step in 2.5D and 3D-IC integration. Achieving low total thickness variation (TTV) of a bonded stack is essential since it directly impacts the TTV of the thinned device wafer. It is essential to understand and utilize appropriate processes and materials that provide precision bonded stacks prior to thinning operations in order to achieve high process yields. The 3M™ Wafer Support System and Corning's precision glass carrier wafers were used to produce bonded stacks. Leveraging metrology tools like the Flatmaster MSP-300 and low coherence interferometric probes allow for characterization of the TTV of each layer of a bonded stack and better understanding of the stack-up as well as how to minimize stack TTV. The ability to deliver stack TTV of < 2 um in a repeatable manner has been demonstrated.


Optik ◽  
2020 ◽  
Vol 221 ◽  
pp. 164426
Author(s):  
Fayza K. A ◽  
Sooraj Ravindran ◽  
Kwangwook Park ◽  
Kamal Alameh ◽  
Aylin Bengi ◽  
...  

1993 ◽  
Author(s):  
Joseph M. Schmitt ◽  
Alexander R. Knuettel ◽  
Amir H. Gandjbakhche ◽  
Robert F. Bonner

Author(s):  
Zhiwen Sun ◽  
Ziqi Jiang ◽  
Xinmeng Zhang ◽  
Junda Chen ◽  
Peng Lin ◽  
...  

1999 ◽  
Author(s):  
Zhaoyang Hu ◽  
Xinyu Ma ◽  
Fuying Li ◽  
Quan'an Tang ◽  
Shiqin Zhou ◽  
...  

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